CN1848035A - 锁固组件 - Google Patents

锁固组件 Download PDF

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CN1848035A
CN1848035A CNA2005100342404A CN200510034240A CN1848035A CN 1848035 A CN1848035 A CN 1848035A CN A2005100342404 A CNA2005100342404 A CN A2005100342404A CN 200510034240 A CN200510034240 A CN 200510034240A CN 1848035 A CN1848035 A CN 1848035A
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locked assembly
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张�杰
黄清白
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to US11/162,611 priority patent/US7333340B2/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种锁固组件,用于将散热模组固定至电路板上,包括设有卡槽的杆状体、可卡设于卡槽内的卡环、提供弹性力的弹性体及与杆状体相结合的固定元件,该弹性体在杆状体穿过设于散热模组的通孔并与卡环相卡扣时,迫使该散热模组与卡环紧密接触、在杆状体穿过电路板并与固定元件相配合时,迫使该散热模组与该电路板紧密接触,该杆状体靠近卡槽设有一导引面,卡环沿该导引面滑入该卡槽内,与杆状体相卡扣。

Description

锁固组件
【技术领域】
本发明关于一种锁固组件,特别是关于一种可迅速将散热模组固定至电路板上且具有防呆装置的锁固组件。
【背景技术】
随着信息技术的飞速发展,计算机中央处理器的运算速度越来越快,其产生的热量也越来越多,过多的热量若无法及时排出,将使处理器自身的温度升高,对系统安全及性能造成不良影响,目前散热问题已经成为新一代高速处理器推出时必需解决的问题。业界通常于中央处理器等芯片上安装散热器来散热,并利用风扇来增加散热能力。
为确保散热器具良好的散热效果,业界通常利用扣合装置将散热器固定至电子元件上,使散热器与电子元件间具良好接触,以增强传热效果。如图1所示的散热装置,包括一电路板2,一散热模组3及用于将该散热模组3固定至电路板2上的若干扣具4。该扣具4包括一底部设有螺纹的螺柱4a、套设于螺柱4a上部的螺旋弹簧4b及卡设于螺柱4a上的扣环4c,该螺柱4a设有用于收容该扣环4c的环槽4d。该散热模组3对应该等扣具4设有通孔3a,该电路板2设有可与螺柱4a的螺纹相配合以固定扣具4的螺纹孔2a。
组装时,将扣具4穿设于散热模组3的通孔3a内,按压扣具4,使弹簧4b受压变形,从而使环槽4d凸伸出散热模组3表面,然后将扣环4c沿径向卡设于该环槽4d内,使该扣具4预组装至散热模组3上(如图2所示)。接下来,将散热模组3及扣具4置于电路板2上,令螺柱4a对准电路板2的螺纹孔2a,对扣具4施加作用力,使扣具4沿螺纹孔2a旋转向下运动,直到扣环4c与电路板2上表面相抵靠,螺柱4a的螺纹完全旋入电路板2的螺纹孔2a内,将散热模组3固定至电路板2上。扣具4的运动过程中,弹簧4b继续受压变形,挤压散热模组3与电路板2紧密接触。
该扣具4可使散热模组3与电路板2紧密接触,从而使散热模组3具良好之散热效果。但是,由于该散热装置没有防呆设计,使扣环4c沿环槽4d径向安装至螺柱4a上时,容易误卡在螺牙上,该扣环4c与螺牙间的结合不牢固,可能会使扣环4c在运输和组装时脱落,从而导致该散热装置无法组装。另,该扣环4c误卡在螺牙上,也可能使扣具4向下运动的位移较小,从而使弹簧4b的变形量较小,降低组装后的散热模组3与电路板2间的压紧力,使散热模组3和电路板2不能充分接触,而导致发热电子元件因过热而烧毁,造成不利影响。故,该散热装置的扣具仍需改进。
【发明内容】
为解决上述扣合装置没有防呆设计、容易误卡的问题,下面以实施例说明一种具防呆设计、安装准确的锁固组件。
该锁固组件,用于将第一元件固定至第二元件上,包括设有卡槽的杆状体、可卡设于卡槽内的卡环、提供弹性力的弹性体及与杆状体相结合的固定元件,该弹性体在杆状体穿过设于第一元件的通孔并与卡环相卡扣时,迫使该第一元件与卡环紧密接触、在杆状体穿过第二元件并与固定元件相配合时,迫使该第一元件与该第二元件紧密接触,该杆状体靠近卡槽设有一导引面,卡环沿该导引面滑入该卡槽内,与杆状体相卡扣。
其中,该第一元件为一散热模组,第二元件为一设有发热电子元件的电路板。
本实施例设置的导引面具有防呆效果,使锁固组件的卡环在导引面的作用下沿杆状体轴向滑入卡槽内,防止因误操作而将卡环卡设在螺牙上,令卡环快速、准确地安装至卡槽内,从而利用该锁固组件将散热模组牢固地安装至电路板上,使散热模组与电路板紧密接触,并使预组装至散热模组上的卡环在运输过程中不易脱落。
【附图说明】
下面参照附图结合实施例作进一步描述:
图1为一传统扣具与相关组件的示意图;
图2为图1的部分剖示图;
图3为一使用该锁固组件的散热装置的立体图;
图4至图6为该散热装置的组装过程示意图;
图7为该锁固组件另一实施例与相关组件的组合示意图。
【具体实施方式】
图3所示为一使用该锁固组件的散热装置的立体图,该散热装置10包括一第一元件(散热模组20)、一装设该第一元件的第二元件(电路板30)及用于将该第一元件装设于第二元件上的若干锁固组件40。其中,该电路板30上设有发热电子元件31(如图5所示)。该散热模组20更包含一散热器21、一将热量由发热电子元件31传导至散热器21的热管22(如图5所示)及一将散热器21处热量带走以实现对电子元件31散热的散热风扇23。该散热模组20设有对应该锁固组件40的通孔24。
该锁固组件40更包括一杆状体41、一套设于杆状体41外围的弹性体42、卡设于该杆状体41中部的卡环43及与该杆状体41相配合的固定元件44。
请一并参阅图4,该杆状体41更包括一身部411、设于身部411一端的头部412及由身部411另一端延伸出的固定部413。该身部411上设置一环状凸缘411a,该凸缘411a与部分弹性体42相卡止,从而将弹性体42固定至杆状体41上,使该弹性体42不易从该杆状体41上脱落。该固定部413设有外螺纹,固定部413的直径小于身部411的直径,使身部411的一部分沿径向凸伸出固定部413。该身部411靠近固定部413的一端设有一环形卡槽411b,该身部411位于卡槽411b与固定部413间的部分呈锥状设计,从而在身部411与固定部413间形成一连接该两部分的导引面414,使该导引面414的径向宽度由远离卡槽411b的固定部413向卡槽411b逐渐增加。
弹性体42恢复形变时可提供向上及向下的弹性力,使该锁固组件40与散热模组20及电路板30紧密结合。本实施例的弹性体42为螺旋弹簧。
卡环43由塑料等弹性较好的材料制成,使该卡环43在一较小外力下即可发生弹性变形向外扩张。该卡环43可沿径向开设一缺口,以减小使卡环43弹性变形的作用力。
固定元件44设于电路板30上,该固定元件44对应锁固组件40的固定部413设有通孔,本实施例的通孔为螺纹孔441。锁固组件40的固定部413可装设于该螺纹孔441内,将散热模组20与锁固组件40固定至电路板30上。
组装时,先将该锁固组件40的杆状体41穿设于散热模组20的通孔24内,按压该锁固组件40的头部412,使其向散热模组20运动,同时使弹性体42因挤压而向内弹性变形,从而使卡槽411b凸伸出散热模组20表面,然后将卡环43套设在固定部413上,按压卡环43,由于卡环43由弹性材料制成,且导引面414的径向宽度由固定部413向卡槽411b逐渐增大,故,使卡环43在导引面414的作用下向外扩张,发生弹性变形,并沿导引面414滑入卡槽411b中,然后恢复形变,将卡环43卡设于卡槽411b中,从而使卡环43与散热模组20相抵靠,将锁固组件40预组装至散热模组20上。
接下来,如图5及图6所示,将组装后的散热模组20与锁固组件40翻转180°后置于电路板30上,令锁固组件40的固定部413与螺纹孔441相对应,对锁固组件40的头部412施加作用力,使锁固组件40的固定部413向下以旋转方式进入螺纹孔441内,同时使弹性体42继续变形(如图5所示),直至卡环43与电路板30上表面相接触,锁固组件40被安装至电路板30上,此时,弹性体42挤压散热模组20与发热电子元件31紧密接触,如图6所示。
本实施例设置的导引面414具有防呆效果,使锁固组件40的卡环43沿杆状体41轴向滑入卡槽411b内,可防止因误操作而将卡环43卡设在螺牙上,令卡环43快速、准确地安装至卡槽411b内,从而利用该锁固组件40将散热模组20牢固地安装至电路板30上,使散热模组20与电路板30紧密接触,并使安装至散热模组20上的卡环43不易在运输过程中脱落。
因卡环43由具有较大弹性的塑料材料制成,故,利用一较小的外力即可将卡环43压入卡槽411b内,从而将锁固组件40预组装至散热模组20上。该装置组装时所需的外力较小。
如图7所示为该锁固组件另一实施例的示意图,上述实施例中,锁固组件40采用螺接的方式实现杆状体41与固定元件44的配合,本实施例的锁固组件40′的固定部413′上未设置螺纹,利用铆接的方式实现固定元件44′与杆状体41′的配合,使散热模组20与发热电子元件31具良好热接触。另,本实施例的弹性体42′为弹片。

Claims (10)

1.一种锁固组件,用于将第一元件固定至第二元件上,包括设有卡槽的杆状体、可卡设于卡槽内的卡环、提供弹性力的弹性体及与杆状体相结合的固定元件,该弹性体在杆状体穿过设于第一元件的通孔并与卡环相卡扣时,迫使该第一元件与卡环紧密接触、在杆状体穿过第二元件并与固定元件相配合时,迫使该第一元件与该第二元件紧密接触,其特征在于:该杆状体靠近卡槽设有一导引面,卡环沿该导引面滑入该卡槽内,与杆状体相卡扣。
2.如权利要求1所述的锁固组件,其特征在于:该第一元件为一散热模组,第二元件为设有发热电子元件的电路板。
3.如权利要求1所述的锁固组件,其特征在于:该导引面的径向宽度由远离卡槽的一端向卡槽逐渐增加。
4.如权利要求1所述的锁固组件,其特征在于:该弹性体为弹簧或弹片。
5.如权利要求1所述的锁固组件,其特征在于:该卡环由弹性材料制成。
6.如权利要求5所述的锁固组件,其特征在于:该卡环由塑胶材料制成。
7.如权利要求1所述的锁固组件,其特征在于:该卡环设置一用于减小使卡环弹性变形作用力的缺口。
8.如权利要求1所述的锁固组件,其特征在于:该固定元件与杆状体间采用螺接或铆接结合。
9.如权利要求1所述的锁固组件,其特征在于:该杆状体下部设有螺纹,该固定元件设有对应该螺纹的螺纹孔。
10.如权利要求1所述的锁固组件,其特征在于:该杆状体上设有一固定弹性体的凸缘。
CNA2005100342404A 2005-04-14 2005-04-14 锁固组件 Pending CN1848035A (zh)

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CNA2005100342404A CN1848035A (zh) 2005-04-14 2005-04-14 锁固组件
US11/162,611 US7333340B2 (en) 2005-04-14 2005-09-16 Mounting device for heat dissipating apparatus

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CN102238844A (zh) * 2010-04-26 2011-11-09 富准精密工业(深圳)有限公司 散热装置
CN102548348A (zh) * 2010-12-28 2012-07-04 鸿富锦精密工业(深圳)有限公司 散热装置
CN101848623B (zh) * 2009-03-25 2013-06-05 富准精密工业(深圳)有限公司 散热装置
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