CN101848623B - 散热装置 - Google Patents
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Abstract
一种散热装置,用于对装设于电路板上的电子元件进行散热,包括一贴设于电子元件上的散热器及若干将该散热器固定于电路板上的扣合装置,所述散热器包括一基座,所述扣合装置包括一头部、由该头部底部向下延伸而出并穿过所述基座的一杆体、套设于该杆体外周并夹置于所述头部与基座之间的一弹性元件及与所述杆体相卡扣配合的一固定座,所述固定座固定于电路板上,所述杆体的底部分开形成二相对设置的锁合臂,该二锁合臂卡扣于所述固定座上并夹置该固定座。与现有技术相比,本发明的散热装置通过所述扣合装置的二锁合臂与固定座相配合卡扣从而将所述散热器与电子元件相固定安装,方便快捷,提升了工作效率。
Description
技术领域
本发明涉及一种散热装置,尤其是指一种用于冷却电子元件的散热装置。
背景技术
随着电子产业的蓬勃迅速发展,大规模集成电路技术不断进步,计算机内部不只是中央处理器,设于主板附加卡上的晶片发热量也在不断增加。大量热量如不能及时散发,将导致电子元件内部温度越来越高,严重影响电子元件运行的稳定性,如今散热问题已成为影响计算机运行性能的一个重要因素,也成为高速处理器实际应用的瓶颈。
业界通常采用一散热器贴置于该电子元件上以对电子元件散热。若干螺钉穿过散热器及电路板上的安装孔,从而将散热器固定于电子元件上。该螺钉包括一头部、自头部中心向下延伸的一螺杆部及位于位于螺杆部末端的一倒勾。该头部的直径较散热器及电路板的安装孔大,且抵顶散热器的上表面。该螺杆部的直径与散热器及电路板的安装孔的直径相当,用于穿设这些安装孔。该倒勾为一弹性件,其伸展后的直径大于散热器及安装孔的直径。安装时,使螺钉的倒勾依次穿过散热器及电路板的安装孔,然后使倒勾的顶部抵顶电路板的下表面,如此完成电路板及散热器的安装。然而,如果要将散热器与电路板拆分,必须使用特定的工具使得螺钉的倒勾变形而从电路板及散热器的安装孔中穿出,拆分困难、浪费工时,而且如此反复多次拆装后,倒勾的形状产生不可恢复的形变,使散热器与电路板的结合不稳定,进而会降低散热器的散热效率。
发明内容
有鉴于此,有必要提供一种拆装方便且配合牢固的散热装置。
一种散热装置,用于对装设于电路板上的电子元件进行散热,包括一贴设于电子元件上的散热器及若干将该散热器固定于电路板上的扣合装置,所述散热器包括一基座,所述扣合装置包括一头部、由该头部底部向下延伸而出并穿过所述基座的一杆体、套设于该杆体外周并夹置于所述头部与基座之间的一弹性元件及与所述杆体相卡扣配合的一固定座,所述固定座固定于电路板上,所述杆体的底部分开形成二相对设置的锁合臂,该二锁合臂卡扣于所述固定座上并夹置该固定座。
与现有技术相比,本发明的散热装置通过所述扣合装置的二锁合臂与固定座相配合卡扣从而将所述散热器与电子元件相固定安装,方便快捷,提升了工作效率。同时,所述二锁合臂与固定座之间配合牢固,可确保散热装置稳定工作。
下面参照附图,结合具体实施例对本发明作进一步的描述。
附图说明
图1是本发明一实施例的散热装置的立体组合图。
图2是图1中散热装置的立体分解图。
图3是图1中散热装置的一扣合装置的立体分解图。
图4是图1中散热装置的扣合装置倒置的立体分解图。
图5是图1中散热装置的扣合装置处于预组装状态的示意图。
图6是图1中散热装置的扣合装置处于未完全扣合状态的示意图。
图7是图1中散热装置的扣合装置处于完全扣合状态的示意图。
具体实施方式
请参阅图1及图2,本发明的散热装置包括一散热器10及四扣合装置20。该四扣合装置20将该散热器10固定于电路板30上以与该电路板30上的发热电子元件40相紧密贴合。
上述散热器10包括一矩形板状基座12、贴设于该基座12顶面的若干散热鳍片14及连接该基座12和所述散热鳍片14的三热管16。所述基座12的四角处分别水平向外延伸出一条形安装臂18。该四安装臂18关于所述基座12对称设置。每一安装臂18靠近末端处均形成一垂直贯通该安装臂18的贯通孔180,用以供所述扣合装置20穿过而将所述散热器10固定安装于电路板30上。所述散热鳍片14相互平行设置,每一散热鳍片14的上下边缘分别垂直延伸一折边(未标示),这些折边分别对应连接相邻的二散热鳍片14。每一热管16大致呈U形,其包括一蒸发段(未标示)、一平行于该蒸发段的冷凝段(未标示)及连接该蒸发段和冷凝段的一连接段(未标示)。所述蒸发段夹置于所述基座12与散热鳍片14之间,所述冷凝段穿设于所述散热鳍片14之中,所述连接段对应位于散热鳍片14的外侧。
请同时参阅图3及图4,所述扣合装置20包括一头部22、由该头部22底部垂直向下延伸而出的一杆体24、套置于该杆体24外周上的一弹簧26及与该杆体24底部相配合卡扣的一固定座28。所述头部22的顶面开设有一供工具作用的十字形卡槽220。所述杆体24整体上呈柱状,其底部分开形成二相正对设置的锁合臂240。每一锁合臂240的底部内侧向下凹陷形成一弧状引导面241。所述二锁合臂240的二引导面241共同围成一整体上呈漏斗状的引导部(未标示),以便于引导所述固定座28卡置于该二锁合臂240之间。所述二锁合臂240于所述引导面241的上方相向分别凸伸出一条形卡制部242。所述卡制部242沿水平设置,其顶面为一水平面,底面为一斜面,从而使得该卡制部242的横截面呈楔形。所述二锁合臂240于所述卡制部242的上方共同围成一容置部243,对应容置所述固定座28的顶部。所述二锁合臂240之间于容置部243的上方形成一间隙244,该间隙244在宽度上小于所述容置部243。所述杆体20的外周于所述间隙244靠近容置部243的位置开设一周向卡槽245,以供一卡环100卡持其上。所述固定座28包括一圆盘形底座280、由该底座280顶面中部一体凸伸而出的一柱状主体部282、一柱状卡持部284及由该主体部282顶面中部垂直凸伸而出并支撑所述卡持部284的一连接部286。所述底座280的外周形成有花齿结构。所述卡持部284的顶部外周缘形成有倒角结构,便于操作。该卡持部284的外径小于所述杆体24的外径。所述连接部286为一扁平板体,对应连接于所述卡持部284底面中央。该连接部286的宽度与所述卡持部284的直径相等,使得其两相对较窄外侧面与该卡持部284的外周缘共面。该连接部286的厚度远小于所述卡持部284的直径,使得所述卡持部284的底部形成有关于该连接部286对称且相隔设置的二台阶部(未标示)。所述固定座28可通过铆接、焊接或直接卡制等方式固定于电路板30上对应的固定孔(图未示)内或固定于该电路板30一侧的背板(未标示)上。在本实施例中,所述固定座28固定于该电路板30一侧的背板上并穿过电路板30的通孔(未标示)以与所述杆体20的二锁合臂240相配合卡扣。所述背板形成有与所述基座12的四安装臂18相对应设置的四支脚(未标示)。每一支脚上形成有一安装孔(未标示),所述固定座28固定卡置于该安装孔内。
请同时参阅图5至图7,所述散热装置在装配时,所述散热器10贴置于所述电子元件40上,所述基座12的安装臂18上的贯通孔180对应电路板30上的通孔。每一所述扣合装置20的杆体24的二锁合臂240穿过所述基座12上对应的贯通孔180。所述弹簧26夹置于所述头部22与安装臂18之间。通常,弹簧26与安装臂18之间会加装一环形垫片200以使弹簧26与安装臂18配合稳固。所述卡环100卡持于所述杆体的卡槽245内。固定于所述背板上的固定座28对应穿过电路板30上的通孔并置于所述杆体24的正下方。按压所述扣合装置20的头部22,使固定座28的卡持部284由杆体24的引导部滑入容置部243,此时该卡持部284的底面位于所述二锁合臂240的二卡制部242上方,旋转所述杆体24使得所述二卡制部242平行于所述固定座28的连接部286,且该二卡制部242的顶面与该卡持部284的底面相贴合(如图7所示),从而完成所述扣合装置20的杆体24与固定座28的扣合过程。可以理解的,所述二卡制部242可抵靠于所述连接部286的两相对较宽侧,亦可有一定间隔。所述弹簧26压缩于所述头部22与安装臂18之间,提供扣合力将所述散热器10紧密固定于所述电路板30的电子元件40上。
拆卸本发明的散热装置时,旋转所述杆体24,使得杆体24的二锁合臂240相对所述固定座28的连接部286转动,当所述锁合臂240的卡制部242与固定座28的连接部286相垂直时,由于该连接部286的两较窄外侧面与所述卡持部284的外周缘共面,使得所述杆体24的卡制部242与固定座28的卡持部284相脱离,在所述弹簧26的作用力下,该杆体24的二锁合臂240向上滑动并最终与固定座28分离,从而完成对散热器10的拆卸。
综上所述,本发明的散热装置通过所述扣合装置20的杆体24与固定座28相配合卡扣从而将所述散热器10与电子元件40相固定安装。与现有技术相比,拆卸及安装该散热器10只需手动操作所述扣合装置20即可,不需使用相关工具,方便安装、拆卸,从而简化了更换流程,提高了工作效率。同时,所述杆体24的二锁合臂240与所述固定座28的卡持部284之间配合牢固,可确保所述散热装置稳定工作。
Claims (13)
1.一种散热装置,用于对装设于电路板上的电子元件进行散热,包括一贴设于电子元件上的散热器及若干将该散热器固定于电路板上的扣合装置,所述散热器包括一基座,其特征在于:所述扣合装置包括一头部、由该头部底部向下延伸而出并穿过所述基座的一杆体、套设于该杆体外周并夹置于所述头部与基座之间的一弹性元件及与所述杆体相卡扣配合的一固定座,所述固定座固定于电路板上,所述杆体的底部分开形成二相对设置的锁合臂,该二锁合臂卡扣于所述固定座上并夹置该固定座,所述固定座包括一位于底部的主体部、与二锁合臂相卡合的一卡持部及由该主体部顶面凸伸而出并支撑所述卡持部的一连接部。
2.如权利要求1所述的散热装置,其特征在于:所述连接部呈扁平状,其两相对较窄的外侧面与所述卡持部的外周面共面。
3.如权利要求1所述的散热装置,其特征在于:所述卡持部呈柱状,所述连接部垂直连接于所述卡持部的底面中部。
4.如权利要求1所述的散热装置,其特征在于:所述二锁合臂分别于内侧相向延伸出一条形卡制部,该二卡制部与所述固定座的卡持部相卡合。
5.如权利要求4所述的散热装置,其特征在于:所述卡制部沿水平设置,其顶面与所述卡持部的底面相贴合。
6.如权利要求4所述的散热装置,其特征在于:所述二卡制部分别抵靠在所述固定座的连接部的相对两侧。
7.如权利要求4所述的散热装置,其特征在于:所述二锁合臂于卡制部上方共同围设出一容置部,对应容置所述固定座的卡持部。
8.如权利要求7所述的散热装置,其特征在于:所述二锁合臂之间于容置部的上方形成一间隙,该间隙在宽度上小于所述容置部,所述杆体对应所述间隙处的外周开设一周向卡槽,以供一卡环卡持其上。
9.如权利要求1所述的散热装置,其特征在于:所述柱体的底部中央凹陷形成一漏斗状引导部,以引导所述固定座卡置于所述二锁合臂之间。
10.如权利要求9所述的散热装置,其特征在于:每一锁合臂的底部内侧向下凹陷形成一弧状引导面,该二引导面共同围成所述引导部。
11.如权利要求1所述的散热装置,其特征在于:还有一背板设置于电路板相对于电子元件的另一侧,所述固定座还包括一结合于该背板上的底座,该固定座穿过电路板上对应其开设的通孔而与所述杆体的锁合臂相卡合。
12.如权利要求1所述的散热装置,其特征在于:所述散热器还包括贴设于所述基座顶面的若干散热鳍片及连接该基座和所述散热鳍片的若干热管。
13.如权利要求1所述的散热装置,其特征在于:所述弹性元件为弹簧。
Priority Applications (2)
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CN200910301136.5A CN101848623B (zh) | 2009-03-25 | 2009-03-25 | 散热装置 |
US12/492,149 US7796390B1 (en) | 2009-03-25 | 2009-06-26 | Fastener and heat sink assembly having the same |
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CN200910301136.5A CN101848623B (zh) | 2009-03-25 | 2009-03-25 | 散热装置 |
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CN101848623A CN101848623A (zh) | 2010-09-29 |
CN101848623B true CN101848623B (zh) | 2013-06-05 |
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CN (1) | CN101848623B (zh) |
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CN101621908A (zh) * | 2008-07-04 | 2010-01-06 | 富准精密工业(深圳)有限公司 | 散热装置及该散热装置的安装方法 |
CN102146944A (zh) * | 2010-02-05 | 2011-08-10 | 鸿富锦精密工业(深圳)有限公司 | 固定装置及使用该固定装置的散热模组 |
DE102010022562A1 (de) * | 2010-06-02 | 2011-12-08 | Vincotech Holdings S.à.r.l. | Elektrisches Leistungsmodul und Verfahren zum Verbinden eines elektrischen Leistungsmoduls mit einer Leiterplatte und einer Wärmesenke |
CN102378529A (zh) * | 2010-08-09 | 2012-03-14 | 鸿富锦精密工业(深圳)有限公司 | 引导装置 |
CN102480889A (zh) * | 2010-11-25 | 2012-05-30 | 鸿富锦精密工业(深圳)有限公司 | 固定装置 |
CN102543914A (zh) * | 2010-12-08 | 2012-07-04 | 鸿富锦精密工业(深圳)有限公司 | 散热器 |
CN102654785A (zh) * | 2011-03-02 | 2012-09-05 | 鸿富锦精密工业(深圳)有限公司 | 存储器固定装置 |
CN102955535A (zh) * | 2011-08-22 | 2013-03-06 | 鸿富锦精密工业(武汉)有限公司 | 支撑装置 |
TW201313110A (zh) * | 2011-09-05 | 2013-03-16 | Foxconn Tech Co Ltd | 散熱裝置 |
CN102983110B (zh) * | 2011-09-07 | 2015-11-18 | 富瑞精密组件(昆山)有限公司 | 散热装置 |
CN103019339A (zh) * | 2011-09-27 | 2013-04-03 | 鸿富锦精密工业(深圳)有限公司 | 散热器固定装置 |
TW201333412A (zh) * | 2012-02-09 | 2013-08-16 | Hon Hai Prec Ind Co Ltd | 散熱器組合 |
TW201334678A (zh) * | 2012-02-15 | 2013-08-16 | Hon Hai Prec Ind Co Ltd | 散熱器組件 |
CN202841813U (zh) * | 2012-09-20 | 2013-03-27 | 中兴通讯股份有限公司 | 散热器固定装置 |
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CN104936415A (zh) * | 2014-03-19 | 2015-09-23 | 奇鋐科技股份有限公司 | 散热器扣具及散热模块装置 |
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CN108710409B (zh) * | 2017-07-05 | 2022-02-11 | 超聚变数字技术有限公司 | 一种处理器固定结构件、组件及计算机设备 |
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US7796390B1 (en) | 2010-09-14 |
CN101848623A (zh) | 2010-09-29 |
US20100246132A1 (en) | 2010-09-30 |
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