CN1840958A - 系统构装的高功率高效率二极管灯泡 - Google Patents

系统构装的高功率高效率二极管灯泡 Download PDF

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CN1840958A
CN1840958A CNA2005100624504A CN200510062450A CN1840958A CN 1840958 A CN1840958 A CN 1840958A CN A2005100624504 A CNA2005100624504 A CN A2005100624504A CN 200510062450 A CN200510062450 A CN 200510062450A CN 1840958 A CN1840958 A CN 1840958A
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heat
diode
diode bulb
module
radiating fin
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CN1840958B (zh
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陈振贤
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Enraytek Optoelectronics Co Ltd
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NEW LIGHT SOURCE TECHNOLOGY Co Ltd
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Priority to PCT/CN2005/000389 priority patent/WO2006102785A1/zh
Priority to AU2005329901A priority patent/AU2005329901B2/en
Priority to EP05732572A priority patent/EP1873447A4/en
Priority to KR1020077023375A priority patent/KR100999843B1/ko
Priority to US11/887,427 priority patent/US7891837B2/en
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Priority to JP2008503346A priority patent/JP4991696B2/ja
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
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Abstract

本发明涉及一种系统构装的高效率高功率二极管灯泡。该二极管灯泡包含一导热及散热模块、一二极管发光模块、一光学模块以及一控制电路模块。该导热及散热模块包含一导热装置与至少一散热鳍片。该二极管发光模块设置于该导热装置的一平坦部。该光学模块用以将该二极管发光模块所发出的光线聚焦。该控制电路模块用以控制该二极管灯泡。当该二极管灯泡连接至一电源时，该控制电路模块选择性地使该二极管发光模块发光，并且该二极管发光模块在发光时所产生的热由该导热装置自该平坦部导引至该至少一散热鳍片，由该多个散热鳍片散热。

Description

系统构装的高功率高效率二极管灯泡
技术领域
本发明涉及一种高效率高功率的二极管灯泡，并且特别地，本发明的二极管灯泡为一种系统构装(System in package)的照明装置。
背景技术
由于发光二极管(Light emitting diode，LED)具有如省电、耐震、反应快以及适合批量生产等许多优点，因此目前以发光二极管为光源的照明产品日益广泛。然而，现有的高功率发光二极管在持续发亮一段时间后，会有温度过高的问题，使得发光二极管本身的发光效率下降，造成亮度无法提升。因此，各种应用高功率的发光二极管的产品均需要良好的散热机制。
请参阅图1。图1显示了一现有的整合了散热装置的照明器。为了增加单一照明装置所能提供的光线强度，图中的导热板10之上设置有多个发光二极管12。导热板10的周围则设有多个散热鳍片14。由于各个发光二极管12之间的距离太远，该照明装置无法提供如点光源的发光效果。
请参阅图2。图2是显示了台湾第568,358号专利所揭示的照明器。图中的红色发光二极管21、绿色发光二极管22以及蓝色发光二极管23设置于一控制电路24之上。控制电路24用以控制该多个发光二极管，在控制电路24之下的载体25则是用以帮助该多个发光二极管和控制电路24散热。如图2所示的照明器的缺点是控制电路24与发光二极管太过接近。当发光二极管产生热能时，极容易影响甚至破坏控制电路24的运作。
因此，本发明提供了一种高效率高功率的二极管灯泡，并且特别地，本发明的二极管灯泡为一种系统构装的照明装置。
发明内容
本发明的第一主要目的在于提供一种系统构装(System in package)的高效率高功率二极管灯泡。根据本发明的二极管灯泡除了可有效解决先前技术中的散热问题外，还可提供相当于点光源的发光效果。
根据本发明的较佳具体实施例的二极管灯泡包含一导热及散热模块、一二极管发光模块、一光学模块以及一控制电路模块。该导热及散热模块包含一导热装置(Heat-conducting device)与至少一散热鳍片(Heat-dissipating fin)。该二极管发光模块设置于该导热装置的一平坦部上，并与该平坦部平整且紧密地接合。该光学模块用以将该二极管发光模块所发出的光线聚焦。该控制电路模块则用以控制该二极管发光模块。当该二极管灯泡连接至一电源时，该控制电路模块选择性地使该二极管发光模块发光，并且该二极管发光模块于发光时所产生的热由该导热装置自该平坦部导引至该至少一散热鳍片，进而由该至少一散热鳍片散热。
由于本发明所提供的二极管灯泡将导热及散热模块与二极管发光模块整合在一起，该导热及散热模块可由各散热鳍片将该二极管发光模块所产生的热能立即发散至周围的空气中，大幅提升散热效率。因此，相较于先前技术，根据本发明的二极管灯泡更适合应用于需要高效率的发光二极管的照明装置中。
本发明的第二主要目的是提供一种相当于点光源的发光效果的二极管灯泡。由于根据本发明的二极管发光模块是将多颗发光二极管或激光二极管封装在一起，相对于光学模块内的凹面镜的体积相当小，因此可提供相当于点光源的发光效果。
本发明的第三主要目的是提供一种能广泛整合于现有的照明设备中的二极管灯泡。上述较佳具体实施例的二极管灯泡可进一步包含一外壳。该外壳可被设计为与现有的圆柱型电池或方型电池尺寸相搭配。因此，若要将根据本发明的二极管灯泡与现有的电源装置整合在一起相当容易。
关于本发明的优点与精神可以由以下的发明详述及附图得到进一步的了解。
附图说明
图1显示了一现有的整合了散热装置的照明器；
图2显示了台湾第568,358号专利所揭示的照明器；
图3A是根据本发明的一较佳具体实施例的二极管灯泡的侧视图；
图3B是根据本发明的一较佳具体实施例的二极管灯泡的立体图；
图4显示了导热及散热模块中的导热及散热机制；
图5至图6显示了发光二极管芯片32的多种实现方式；
图7至图10显示了散热鳍片312的多种实现方式；
图11显示了本发明中的导热装置与发光二极管芯片的另一实施方式；
图12显示了根据本发明的一包含外壳的二极管灯泡；
图13显示了根据本发明的另一包含外壳的二极管灯泡；
图14显示了根据本发明的另一包含外壳的二极管灯泡。
其中，附图标记说明如下：
10：导热板 12：发光二极管
14：散热鳍片 21：红色发光二极管
22：绿色发光二极管 23：蓝色发光二极管
24：控制电路 25：载体
30：二极管灯泡
31：导热及散热模块 32：二极管发光模块
33：控制电路模块 34：光学模块
311：导热装置 312：散热鳍片
313：孔洞 314：外壳
320：基材 322：电极
324：光源
具体实施方式
本发明的一个主要目的在于提供一种系统构装的高效率高功率二极管灯泡。
请参阅图3A及图3B。图3A及图3B分别为根据本发明的一较佳具体实施例的二极管灯泡的侧视图及立体图。根据本发明的二极管灯泡30包含一导热及散热模块31、一二极管发光模块32、一控制电路模块33以及一光学模块34。导热及散热模块31包含一导热装置311与至少一散热鳍片312。二极管发光模块32设置于导热装置311的一平坦部。光学模块34用以将该二极管发光模块32所发出的光线聚焦。控制电路模块33则是用以控制该二极管发光模块32。当二极管灯泡30连接至一电源时，控制电路模块33选择性地使二极管发光模块32发光，并且二极管发光模块32在发光时所产生的热是由导热装置311自该平坦部导引至散热鳍片312，进而由散热鳍片312散热。
如图3A及图3B所示，由于根据本发明中的的控制电路模块33与二极管发光模块32之间有一段距离，可避免控制电路33直接受到二极管发光模块32所产生的热能影响。
根据本发明，与二极管灯泡30连接的电源可为直流电源，也可为交流电源。当该电源为交流电源时，控制电路模块33还进一步包含一交流至直流(AC-to-DC)转换器，将交流电转换为直流电后供给二极管灯泡30使用。
在实际应用中，导热装置311可能为一以铜制成的热导柱或热导管。请参阅图4。图4显示了导热及散热模块31中的导热及散热机制。导热及散热模块31内部包含毛细组织311A以及工作流体311B。当二极管发光模块32产生热时，会使导热及散热模块31中较靠近二极管发光模块32的工作流体311B由液体蒸发为气体。气化后的工作流体311B可将热传至导热及散热模块31的另一端，经散热鳍片312散热冷却后的工作流体311B会再度凝结为液体。毛细组织311A是用以将再度凝结为液体的工作流体311B传送回导热及散热模块31中较靠近二极管发光模块32的一端。由如图4所示的循环方式，可达到导热及散热效果。
请参阅图5。在实际应用中，发光二极管芯片32可能如图5所示，包含一由硅材料或金属材料所制成的基材(Substrate)320、两电极(Electrode)322以及一发光模块324。发光模块324与电极322分别设置于基材320之上。发光模块324分别通过该两电极322连接至控制电路模块33。请参阅图6。发光二极管芯片32中的发光模块324与两电极322也可能如图6所示，直接被设置于导热装置311的平坦部之上，其中该两电极322与导热装置311之间分别有一绝缘体。
在实际应用中，发光模块324包含至少一发光二极管或激光二极管(Laserdiode)。发光模块324中的发光二极管可能为一白光二极管，或是由一蓝光二极管与荧光粉所组成的白光二极管。发光模块324也可能包含至少一红光二极管、至少一蓝光二极管以及至少一绿光二极管；控制电路模块33可选择性地使该红光二极管、该蓝光二极管以及该绿光二极管发光，使得该多个不同颜色的发光二极管以不同的发光比例组成各种不同颜色的光线。
由于根据本发明的二极管灯泡是将多颗发光二极管封装在一起，发光模块324相对于与发光模块324配合的凹面境或整个二极管灯泡的体积相当小，因此可提供相当于点光源的发光效果。
请参阅图7至图10。本发明中的散热鳍片312可以多种不同的样式实现。一般的散热鳍片312环设于导热装置311的周围。散热鳍片312除了如图7所示的圆盘状之外，也可为如图8所示的不规则状，例如，锯齿状、花瓣状，或是如图9所示具有孔洞。图9中的每一散热鳍片312上均具有至少一孔洞313，该多个孔洞313可供空气流通，帮助加速散热。图10显示了散热鳍片312的另一种实施方式，该多个散热鳍片312与导热装置311的该平坦部垂直，并环绕在导热装置311的周围。
请参阅图11。图11显示了本发明中的导热装置311与发光二极管芯片32的另一实施方式。如图11所示，导热装置311的一端可被设计为扁平状，而发光二极管芯片32设置于该导热装置311的扁平部份之上。
在实际应用中，二极管灯泡30可进一步包含一外壳314。请参阅图12。图12显示了一包含外壳的二极管灯泡30的实施例。外壳314配合能容纳该多个散热鳍片312，不会影响散热鳍片312的散热功能。外壳314可被设计为与现有的圆柱型电池方型电池尺寸相搭配。因此，若要将根据本发明的二极管灯泡与现有的电源装置整合在一起相当容易。
请参阅图13。图13显示了根据本发明的另一较佳具体实施例的二极管灯泡。在本实施例中，导热装置311为一弯曲的导热管，发光二极管芯片32设置于导热装置311的一端的平坦部。散热鳍片312设置于导热装置311的侧壁的周围。发光二极管芯片32所产生的热能透过导热装置311传递至散热鳍片312，再发散至周围的空气中，由此达成散热的效果。非封闭式的外壳314配合能容纳该至少一散热鳍片，并不会影响散热鳍片312的散热。
请参阅图14。图14显示了根据本发明的另一较佳具体实施例的二极管灯泡。在本实施例中，导热装置311为一弯曲的导热管，而发光二极管芯片32设置于导热装置311侧壁上的一平坦部上。散热鳍片312设置于导热装置311的两端的周围。发光二极管芯片32所产生的热能透过导热装置311传递至散热鳍片312，再发散至周围的空气中，由此达成散热的效果。
由于本发明所提供的二极管灯泡是将导热及散热模块与发光二极管芯片整合在一起，该导热及散热模块可由散热鳍片将该发光二极管芯片所产生的热能立即发散至周围的空气中，大幅提升散热效率。通过改善二极管灯泡的散热效率，解决了因过热造成发光二极管效率下降的问题，根据本发明的二极管灯泡的发光效率也可以提升。因此，相较于先前技术，根据本发明的整合散热模块的二极管灯泡更适合应用于需要高功率高效率的二极管灯泡的照明装置中。

Claims (20)

1.一种系统构装的高效率高功率二极管灯泡，其特征在于，包含：
一导热及散热模块，包含一导热装置和至少一散热鳍片，该导热装置具有一平坦部；该至少一散热鳍片设置于该导热装置的周围；
一二极管发光模块，该二极管发光模块设置于该导热装置的该平坦部；
一光学模块，该光学模块用以将该二极管发光模块所发出的光线聚焦；以及
一控制电路模块，该控制电路模块用以控制该二极管发光模块；
其中当该二极管灯泡连接至一电源时，该控制电路模块选择性地使该二极管发光模块发光，并且该二极管发光模块在发光时所产生的热由该导热装置自该平坦部导引至该至少一散热鳍片，进而由该至少一散热鳍片散热。
2.如权利要求1所述的二极管灯泡，其特征在于，该电源为交流电源，并且该控制电路模块进一步包含一交流至直流转换器。
3.如权利要求1所述的二极管灯泡，其特征在于，该发光二极管芯片装置包含一基材、一发光模块以及两电极，该发光模块以及该两电极分别设置于该基材上。
4.如权利要求1所述的二极管灯泡，其特征在于，该二极管发光模块包含至少一发光二极管或激光二极管。
5.如权利要求1所述的二极管灯泡，其特征在于，该发光模块包含一白光二极管。
6.如权利要求5所述的二极管灯泡，其特征在于，该白光二极管包含蓝光二极管与荧光粉。
7.如权利要求1所述的二极管灯泡，其特征在于，该发光模块包含至少一红光二极管、至少一蓝光二极管以及至少一绿光二极管。
8.如权利要求7所述的二极管灯泡，其特征在于，该控制电路模块选择性地使该红光二极管、该蓝光二极管以及该绿光二极管发光。
9.如权利要求1所述的二极管灯泡，其特征在于，该基材是由一硅材料或一金属材料所制成。
10.如权利要求1所述的二极管灯泡，其特征在于，该发光装置包含一发光模块以及两电极，该发光模块以及该两电极分别安置于该导热装置的该平坦部上。
11、如权利要求10所述的二极管灯泡，其特征在于，该两电极与该导热装置之间分别有一绝缘体。
12、如权利要求1所述的二极管灯泡，其特征在于，该导热装置为一热导柱或热导管。
13、如权利要求1所述的二极管灯泡，其特征在于，该导热装置以铜材料制成。
14、如权利要求1项所述的二极管灯泡，其特征在于，该至少一散热鳍片中的每一散热鳍片环设于该导热装置的周围。
15、如权利要求1所述的二极管灯泡，其特征在于，该至少一散热鳍片中的每一散热鳍片为圆盘状。
16、如权利要求1所述的二极管灯泡，其特征在于，该至少一散热鳍片中的每一散热鳍片为不规则状。
17、如权利要求1所述的二极管灯泡，其特征在于，该至少一散热鳍片中的每一散热鳍片均具有至少一孔洞。
18、如权利要求1所述的二极管灯泡，其特征在于，该平坦部位于该导热装置的一端。
19、如权利要求1所述的二极管灯泡，其特征在于，该平坦部位于该导热装置的侧壁。
20、如权利要求1所述的二极管灯泡，其特征在于，该二极管灯泡进一步包含一外壳，该外壳配合并能容纳该至少一散热鳍片。
CN2005100624504A 2005-03-28 2005-03-28 系统构装的高功率高效率二极管灯泡 Expired - Fee Related CN1840958B (zh)

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KR1020077023375A KR100999843B1 (ko) 2005-03-28 2005-03-28 효율적인 고출력 ｌｅｄ 램프
US11/887,427 US7891837B2 (en) 2005-03-28 2005-03-28 System in package high power highly efficient diode lamp
CN2005100624504A CN1840958B (zh) 2005-03-28 2005-03-28 系统构装的高功率高效率二极管灯泡
JP2008503346A JP4991696B2 (ja) 2005-03-28 2005-03-28 高出力高効率パッケージ組込み型ダイオードランプ
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US13/006,015 US8029158B2 (en) 2005-03-28 2011-01-13 System in package high power highly efficient diode lamp
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008131584A1 (fr) * 2007-04-27 2008-11-06 Jenshyan Chen Dispositif d'éclairage à diode électro-luminescente
CN102927481A (zh) * 2011-11-25 2013-02-13 俞国宏 一种大功率led灯具
CN101749656B (zh) * 2008-12-19 2013-07-10 中山伟强科技有限公司 一种发光二极管灯具
CN103594606A (zh) * 2013-11-12 2014-02-19 广东工业大学 一种发光二极管飞盘状支架

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE485479T1 (de) * 2005-03-31 2010-11-15 Neobulb Technologies Inc Hochleistungs-led-beleuchtungseinrichtung mit hohem thermischen diffusionsvermögen
CA2614803C (en) * 2005-04-05 2015-08-25 Tir Technology Lp Electronic device package with an integrated evaporator
EA015530B1 (ru) * 2006-11-30 2011-08-30 Необульб Текнолоджиз, Инк. Наружное высокомощное светодиодное осветительное оборудование
BRPI0622246A2 (pt) * 2006-12-30 2011-12-27 Jen-Shyan Chen equipamento de iluminaÇço de diodo emissor de luz
US10655837B1 (en) 2007-11-13 2020-05-19 Silescent Lighting Corporation Light fixture assembly having a heat conductive cover with sufficiently large surface area for improved heat dissipation
JP4945433B2 (ja) * 2007-12-28 2012-06-06 シャープ株式会社 照明装置
EP2251595A2 (en) * 2008-03-06 2010-11-17 Fawoo Technology Co., Ltd Fan-less heat ventilation for led lighting apparatus
CN101608785B (zh) * 2008-06-19 2013-07-17 松下电器产业株式会社 具有组合散热结构的led灯
FR2937795B1 (fr) * 2008-10-28 2011-04-01 Biophoton S A Dispositif electronique a matrice de diodes electroluminescentes de forte puissance comprenant des moyens de refroidissement ameliores
CA2672629A1 (en) * 2009-01-06 2010-07-06 Jen-Shyan Chen Energy transducing apparatus and energy transducing equipment
CA2749739A1 (en) 2009-01-28 2010-08-05 Relume Technologies, Inc. Led light engine with finned modules for heat transfer
JP5171856B2 (ja) * 2009-06-11 2013-03-27 チョンシャン ウェイチャン テクノロジー カンパニー リミテッド Ｌｅｄランプ
TW201043841A (en) 2009-06-12 2010-12-16 Yeh Chiang Technology Corp LED light bulb
KR20120080022A (ko) * 2011-01-06 2012-07-16 삼성엘이디 주식회사 조명 장치
KR101272346B1 (ko) * 2011-01-25 2013-06-07 정춘식 히트파이프가 장착된 냉각장치
WO2013090536A1 (en) 2011-12-13 2013-06-20 Ephesus Technologies, Llc High intensity light-emitting diode luminaire assembly
US9313849B2 (en) 2013-01-23 2016-04-12 Silescent Lighting Corporation Dimming control system for solid state illumination source
US9192001B2 (en) 2013-03-15 2015-11-17 Ambionce Systems Llc. Reactive power balancing current limited power supply for driving floating DC loads
US9255676B2 (en) 2013-09-29 2016-02-09 Energy Savings Technology, Llc Tubular luminaire
TWI607175B (zh) * 2013-11-21 2017-12-01 綠點高新科技股份有限公司 Lighting device and radiator manufacturing method for lighting device
GB2524093B (en) 2014-03-14 2016-11-16 Dyson Technology Ltd Light fixture
US9410688B1 (en) * 2014-05-09 2016-08-09 Mark Sutherland Heat dissipating assembly
EP3172488B1 (en) 2014-07-22 2019-05-22 Signify Holding B.V. Light source cooling body, light source assembly, a luminaire and method to manufacture a light source cooling body or a light source assembly
US9380653B1 (en) 2014-10-31 2016-06-28 Dale Stepps Driver assembly for solid state lighting
US9970649B2 (en) 2015-07-24 2018-05-15 Fluence Bioengineering Systems and methods for a heat sink
CN110159979A (zh) * 2019-06-21 2019-08-23 叶利苗 一种压差式绕组扩展散热的led路灯模组
EP4176199B1 (en) * 2020-08-11 2024-01-31 Signify Holding B.V. System comprising luminescent material and two-phase cooling device
EP4237744A4 (en) * 2020-10-30 2024-04-03 Flex N Gate Advanced Product Dev Llc HEAT DISSIPATION SYSTEM FOR VEHICLE LAMP
CN117588694A (zh) * 2023-12-29 2024-02-23 惠州市拉图影视器材有限公司 一种模块化射灯及其装配方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2204589A1 (de) * 1972-02-01 1973-08-16 Siemens Ag Kuehlanordnung fuer flache halbleiterbauelemente
GB1365448A (en) * 1972-05-17 1974-09-04 Trw Inc Fluid heat transfer apparatus for semi conducting devices
US5857767A (en) * 1996-09-23 1999-01-12 Relume Corporation Thermal management system for L.E.D. arrays
KR100702273B1 (ko) * 1998-09-28 2007-03-30 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 조명 시스템
US20050279949A1 (en) * 1999-05-17 2005-12-22 Applera Corporation Temperature control for light-emitting diode stabilization
EP1393374B1 (en) * 2001-05-26 2016-08-24 GE Lighting Solutions, LLC High power led lamp for spot illumination
US6465961B1 (en) * 2001-08-24 2002-10-15 Cao Group, Inc. Semiconductor light source using a heat sink with a plurality of panels
US20040256630A1 (en) * 2001-08-24 2004-12-23 Densen Cao Illuminating light
US7083305B2 (en) * 2001-12-10 2006-08-01 Galli Robert D LED lighting assembly with improved heat management
JP2003178602A (ja) * 2001-12-10 2003-06-27 Koito Mfg Co Ltd 照明装置
US6966677B2 (en) * 2001-12-10 2005-11-22 Galli Robert D LED lighting assembly with improved heat management
KR100991829B1 (ko) * 2001-12-29 2010-11-04 항조우 후양 신잉 띠앤즈 리미티드 Ｌｅｄ 및 ｌｅｄ램프
CN100468609C (zh) * 2001-12-29 2009-03-11 杭州富阳新颖电子有限公司 超导热管灯
US7011431B2 (en) * 2002-04-23 2006-03-14 Nichia Corporation Lighting apparatus
JP2005534201A (ja) * 2002-07-25 2005-11-10 ジョナサン エス． ダーム、 発光ダイオードを硬化用に使用するための方法および装置
CN2564849Y (zh) 2002-08-21 2003-08-06 财团法人工业技术研究院 光电照明模块
WO2004038759A2 (en) * 2002-08-23 2004-05-06 Dahm Jonathan S Method and apparatus for using light emitting diodes
US6787999B2 (en) * 2002-10-03 2004-09-07 Gelcore, Llc LED-based modular lamp
US6897486B2 (en) * 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
JP2004296245A (ja) * 2003-03-26 2004-10-21 Matsushita Electric Works Ltd Ｌｅｄランプ
US6910794B2 (en) * 2003-04-25 2005-06-28 Guide Corporation Automotive lighting assembly cooling system
US6938680B2 (en) * 2003-07-14 2005-09-06 Thermal Corp. Tower heat sink with sintered grooved wick
CN2644878Y (zh) 2003-08-14 2004-09-29 葛世潮 发光二极管灯
CN2677742Y (zh) * 2004-01-13 2005-02-09 葛世潮 大功率发光二极管灯
TWI257465B (en) * 2004-10-11 2006-07-01 Neobulb Technologies Inc Lighting device with high heat dissipation efficiency
US20060100496A1 (en) * 2004-10-28 2006-05-11 Jerome Avron Device and method for in vivo illumination
US7331691B2 (en) * 2004-10-29 2008-02-19 Goldeneye, Inc. Light emitting diode light source with heat transfer means
US20070273290A1 (en) * 2004-11-29 2007-11-29 Ian Ashdown Integrated Modular Light Unit
ATE485479T1 (de) * 2005-03-31 2010-11-15 Neobulb Technologies Inc Hochleistungs-led-beleuchtungseinrichtung mit hohem thermischen diffusionsvermögen

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008131584A1 (fr) * 2007-04-27 2008-11-06 Jenshyan Chen Dispositif d'éclairage à diode électro-luminescente
CN101749656B (zh) * 2008-12-19 2013-07-10 中山伟强科技有限公司 一种发光二极管灯具
CN102927481A (zh) * 2011-11-25 2013-02-13 俞国宏 一种大功率led灯具
CN102927481B (zh) * 2011-11-25 2013-11-20 俞国宏 一种大功率led灯具
CN103594606A (zh) * 2013-11-12 2014-02-19 广东工业大学 一种发光二极管飞盘状支架

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