FR2937795B1 - Dispositif electronique a matrice de diodes electroluminescentes de forte puissance comprenant des moyens de refroidissement ameliores - Google Patents

Dispositif electronique a matrice de diodes electroluminescentes de forte puissance comprenant des moyens de refroidissement ameliores

Info

Publication number
FR2937795B1
FR2937795B1 FR0857334A FR0857334A FR2937795B1 FR 2937795 B1 FR2937795 B1 FR 2937795B1 FR 0857334 A FR0857334 A FR 0857334A FR 0857334 A FR0857334 A FR 0857334A FR 2937795 B1 FR2937795 B1 FR 2937795B1
Authority
FR
France
Prior art keywords
high power
cooling means
diode array
array device
improved cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0857334A
Other languages
English (en)
Other versions
FR2937795A1 (fr
Inventor
Charles Breda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Biophoton S A
Original Assignee
Biophoton S A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Biophoton S A filed Critical Biophoton S A
Priority to FR0857334A priority Critical patent/FR2937795B1/fr
Publication of FR2937795A1 publication Critical patent/FR2937795A1/fr
Application granted granted Critical
Publication of FR2937795B1 publication Critical patent/FR2937795B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
FR0857334A 2008-10-28 2008-10-28 Dispositif electronique a matrice de diodes electroluminescentes de forte puissance comprenant des moyens de refroidissement ameliores Active FR2937795B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0857334A FR2937795B1 (fr) 2008-10-28 2008-10-28 Dispositif electronique a matrice de diodes electroluminescentes de forte puissance comprenant des moyens de refroidissement ameliores

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0857334A FR2937795B1 (fr) 2008-10-28 2008-10-28 Dispositif electronique a matrice de diodes electroluminescentes de forte puissance comprenant des moyens de refroidissement ameliores

Publications (2)

Publication Number Publication Date
FR2937795A1 FR2937795A1 (fr) 2010-04-30
FR2937795B1 true FR2937795B1 (fr) 2011-04-01

Family

ID=40672169

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0857334A Active FR2937795B1 (fr) 2008-10-28 2008-10-28 Dispositif electronique a matrice de diodes electroluminescentes de forte puissance comprenant des moyens de refroidissement ameliores

Country Status (1)

Country Link
FR (1) FR2937795B1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD735902S1 (en) 2011-06-23 2015-08-04 Cree, Inc. Solid state directional lamp

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102468255B (zh) * 2010-11-15 2016-01-20 神讯电脑(昆山)有限公司 散热装置
US8616724B2 (en) 2011-06-23 2013-12-31 Cree, Inc. Solid state directional lamp including retroreflective, multi-element directional lamp optic
US8757840B2 (en) 2011-06-23 2014-06-24 Cree, Inc. Solid state retroreflective directional lamp
US8777455B2 (en) 2011-06-23 2014-07-15 Cree, Inc. Retroreflective, multi-element design for a solid state directional lamp
US8777463B2 (en) * 2011-06-23 2014-07-15 Cree, Inc. Hybrid solid state emitter printed circuit board for use in a solid state directional lamp
EP3597268B1 (fr) 2018-07-19 2020-10-28 JK-Holding GmbH Dispositif et procédé d'irradiation

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4124638B2 (ja) * 2002-12-16 2008-07-23 順一 島田 Ｌｅｄ照明システム
EP1709692A1 (fr) * 2004-01-29 2006-10-11 Acol Technologies S.A. Diode electroluminescente comportant des moyens integraux de dissipation de chaleur
TWI255377B (en) * 2004-11-05 2006-05-21 Au Optronics Corp Backlight module
WO2006102785A1 (fr) * 2005-03-28 2006-10-05 Neobulb Technologies, Inc. Lampe led de grande puissance et efficace
SG151282A1 (en) * 2005-12-29 2009-04-30 Lam Chiang Lim High power led housing removably fixed to a heat sink
WO2007129231A1 (fr) * 2006-05-08 2007-11-15 Koninklijke Philips Electronics, N.V. Montage thermique en surface de plusieurs diodes électroluminescentes sur un dissipateur thermique
US20080149305A1 (en) * 2006-12-20 2008-06-26 Te-Chung Chen Heat Sink Structure for High Power LED Lamp
US20080180014A1 (en) * 2007-01-29 2008-07-31 Tennrich International Corp. LED heat sink

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD735902S1 (en) 2011-06-23 2015-08-04 Cree, Inc. Solid state directional lamp

Also Published As

Publication number Publication date
FR2937795A1 (fr) 2010-04-30

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