EP1709692A1 - Diode electroluminescente comportant des moyens integraux de dissipation de chaleur - Google Patents

Diode electroluminescente comportant des moyens integraux de dissipation de chaleur

Info

Publication number
EP1709692A1
EP1709692A1 EP04706235A EP04706235A EP1709692A1 EP 1709692 A1 EP1709692 A1 EP 1709692A1 EP 04706235 A EP04706235 A EP 04706235A EP 04706235 A EP04706235 A EP 04706235A EP 1709692 A1 EP1709692 A1 EP 1709692A1
Authority
EP
European Patent Office
Prior art keywords
base
cover
thermal conductor
light sources
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04706235A
Other languages
German (de)
English (en)
Inventor
Vladimir Abramov
Dmitry Agafonov
Nikolai Scherbakov
Alexander Shishov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Acol Technologies SA
Original Assignee
Acol Technologies SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acol Technologies SA filed Critical Acol Technologies SA
Publication of EP1709692A1 publication Critical patent/EP1709692A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Definitions

  • the following invention disclosure is generally concerned with the art of semiconductor electronics packaging and in particular with forming a thermal conductive path integrally with device packaging.
  • Light emitting diodes are presently made in huge quantities. Generally speaking, they are very standard in their construct and form. As such, optical engineers enjoy buying them in bulk and configuring devices and systems from these standardized packages.
  • limitations associated with standard designs prevent use of LEDs in some high performance arrangements. For example, in high brightness applications, several LEDs may be ganged together to produce a bright light. This is an inferior solution and one not useful in certain systems.
  • a preferred solution may be to drive the LED at a high current to produce more light. However, this is not possible because standard LED packages trap heat and self destruct when too much current is applied.
  • An LED package generally is comprised of a hard polycarbonate material which completely surrounds the semiconductor. When excess heat is trapped, the polycarbonate expands and tends to break. Further, the heat tends to cause junction breakdown in the semiconductor as well. Heat is a light emitting diode's worst enemy. Thus, skilled practitioners of the art have tried to couple heat away from
  • LEDs to improve their performance.
  • heat sink arrangements have been introduced to carry heat away from the diodes. These heat sinks are sometimes provided with heat coupling suitable for standard LED packages.
  • the polycarbonate material may be in intimate contact with a heat sink. While these arrangements serve their purpose to some extent, they are limited because common LED packages are not arranged to cooperate with heat removal mechanisms. While considerable efforts in the material sciences are made to improve the efficiency of semiconductor diode junctions used in LEDs, these improvements come slowly and with fractional gains at large expense. The chemistry and physics of diode junctions changes slowly in time. Most notably in recent developments, high brightness blue colored chips are becoming more readily available.
  • Diodes which emit blue colored light are difficult to produce because blue light is comprised of higher energy photons which are not easily produced in normal band gap junctions.
  • the 'gap' between bands of allowed energies must be quite large to form a high energy blue photon.
  • specialized materials and dopants are used in the semiconductor growth and doping. Although these materials will produce blue photons, they do so with less efficiency than materials used to produce other colors. More of the input electrical energy is converted to heat than to blue light. This is problematic as the heat is lost as waste. It is desirable that one should have the highest possible quantum efficiency to reduce this loss. Improving the quantum efficiency of the junction is not the only way to realize high output from a diode.
  • the diode will self destruct and cease to function as the heat damages the physical structure of the semiconductor. Accordingly, common diodes are rated to operate normally at about 20 milliamps. They will continue to produce greater light outputs beyond 20 milliamps with a lifetime penalty. After a significant current is applied beyond twenty milliamps, the device will break and become forever damaged. A primary reason the device breaks is due to heat in the junction. If heat can be drawn away from the junction at a rate faster than it is produced there, then damage to the junction will not occur. Thus, one can increase the current without limit so long as the corresponding heat produced as a result can be drawn from the junction at a rate greater than which it is produced.
  • a common LED is made with metallic leads fashioned as two electrical conductors, i.e.
  • an anode and a cathode lead to provide an electrical contact with the semiconductor materials.
  • An assembly is arranged and a polycarbonate bonding material is applied to seal elements together whereby the polycarbonate totally encases the diode, the electrodes among other elements.
  • the metallic leads also provide mechanical and optical services in the overall structure as well.
  • LEDs are generally mounted, for example into a circuit board, via their electrical leads which protrude from the bottom of the polycarbonate cover which typically includes a lens in its top surface.
  • the two electrodes provide an electrical path to the semiconductor device which is best set into a mirror or reflective conic section element.
  • the reflector is generally formed into the metallic lead.
  • a thin wire may be connected from a first electrode to a top surface of the diode.
  • This assembly and arrangement is placed into a mold of polycarbonate material in a liquid state before being polymerized or subject to other curing.
  • the cover may be formed as a very hard plastic having a lens thereon its top surface.
  • current is forced through the electrodes, light is produced in the junction and reflects from the conic reflector and passes to the lens in the plastic cover.
  • Some of the heat generated at the diode passes down the electrical lead as it is metal and an excellent thermal conductor. Although some heat passes to the opposing lead via the thin wire, this thermal path is limited because the gauge of the wire is generally quite small. Some heat also passes via the polycarbonate cover to the surrounding atmosphere.
  • thermo conductor is integrated as part of an LED package design.
  • the thermal conductor is arranged to provide excellent heat coupling directly with the semiconductor chip; in some cases providing both electrical and thermal contact.
  • the thermal conductor is also fashioned whereby heat drawn from the semiconductor is further passed into a heat sink system.
  • Thermal conductors are arranged to cooperate with the entire LED package and components thereof.
  • a thermal conductor may serve as an electrical conductor as well.
  • a thermal conductor may also be arranged as an optical reflective element. It is a primary object of these inventions to provide light emitting diodes with improved packaging. It is an object of these inventions to provide light emitting diodes with improved packaging for high current high brightness operation. It is a further object to provide a thermal conductive path leading away from a semiconductor diode junction.
  • Figure 1 is a cross sectional drawing of a first version
  • Figure 2 is an expanded view of Figure 1 with added detail
  • Figure 3 is a similar cross sectional drawing of another version
  • Figure 4 illustrates in cross section an LED package arranged with a special thermal conductor
  • Figure 5 shows a version of a thermal conductor with an optical element formed therein
  • Figure 6 shows a thermal conductor having a special termination end.
  • an LED sometimes includes a light emitting semiconductor diode and the package into which it is arranged.
  • a 'support package' may include electrical elements, optical elements, and thermal elements among others.
  • the packaging of a semiconductor chip to produce a light source is considered part of the entire device sometimes referred to as an 'LED'. Accordingly, an LED is more precisely a device comprised of two major systems. LEDs are made of a semiconductor diode element in cooperation with a package system.
  • the 'diode' is a special semiconductor device of two material types arranged to form a special junction region having light emitting properties.
  • the 'package' contains electrical leads, mounting support, optical lensing, and thermal conductors. Altho ugh, the LED acronym only suggests the 'diode', it is affirmed here that 'LED' also is intended to include the packaging for purposes of this disclosure.
  • mechanisms are provided to draw he at away from the diode junction at an exceptional rate. Although such means can be provided in a great plurality of ways, one will appreciate certain features unique to the arrangements first taught here.
  • Preferred versions of these inventions have a thermal conductor element included integrally with the device package.
  • an element having rotational symmetry or axial symmetry forms a platform onto which a semiconductor or semiconductors may be placed into intimate thermal contact.
  • the thermal conductor is integrated with a base element which supports other system components including a cover and electrical leads for example.
  • Figure 1 illustrates some major components of an LED of these inventions including a thermal conductor.
  • a hard plastic cover element 1 may be molded into a special shape including a lens at its upper surface.
  • a base member 2 forms support upon which the cover and other elements are coupled.
  • the cover may be pushed tightly onto the base to form an enclosed cavity between the base and an interior surface of the cover as it is placed onto the base member.
  • the base may further support passage of electrical conductor or 'lead' 3 by way of holes bored there through.
  • a special insulator material lines the hole in the base.
  • This insulator 4 may be formed of a glass, ceramic or rubber material for example.
  • An important element of the package includes a thermal conductor 5. This thermal conductor is intimately and thermally connected directly to the semiconductor chip 6 whereby heat is encouraged to easily passes away from the diode junction into the thermal conductor. Heat may be drawn toward the opposite end of the thermal conductor where it may leave. As shown in the diagram, the semiconductor may sit symmetrically within a recess formed in the base in the shape of a conic section 7.
  • the cover element includes a skirt portion 9 which is configured to engage the base with precision.
  • the cover skirt may provide alignment function as well as mechanical holding means.
  • a soft and flexible gel material fills the cavity between the cover and the base.
  • FIG. 1 is an expanded view of Figure 1 to illustrate further detail with regard to gel element which is part of the package.
  • the top and sides of the semiconductor are thermally coupled to the thermal conductor because the gel is also a material having appreciably high thermal conductivity; far higher than air and polycarbonate materials used in other LED packages. This arrangement provides maximum coupling between the semiconductor 25 and the thermal conductor 24.
  • the plastic cover 23 is illustrated with only its bottom surface showing as forming a cavity between the cover and the base.
  • the gel 26 is inserted or applied.
  • the gel may be applied before setting the cover to the base and that action can be helpful in assuring the gel forms good and solid contact between the gel and other components.
  • the cover tends to push the flexible gel into tiny cracks and spaces 27, in particular between the semiconductor sides and the conic section reflector, and pressure is applied when the cover is joined with the base.
  • the semiconductor is perfectly surrounded by material having high thermal conductivity, and a clear thermal path, i.e.
  • LEDs typically have a reflecting element to turn light emitted substantially in a horizontal plane, towards the top of the device.
  • that reflector is formed as a conic section into either of the electrical connectors. It is not necessary nor desirable to form a conic section reflector into electrical conductor leads in these inventions. Rather, a reflector may be formed into the base member as in the previous example, alternatively into the thermal conductor, or into the cover element.
  • Figure 3 is a cross section diagram of another preferred version of these inventions having a thermal conductor element formed as an integral part of the device package.
  • this version stands in contrast to the previous in several ways.
  • this device employs a plurality of semiconductor elements. As such these devices consume a greater footprint at the semiconductor - thermal conductor junction. The space required to accommodate the plurality of chips is large in comparison to the single chip case. As such, coupling between the reflector is necessarily different. The reflector is improved if it is larger and placed farther away from the chip/s. Accordingly, the second difference in this version is a reflector built into the cover element at its under surface. To accommodate independent drive of each of the chips, a corresponding plurality of electrical leads is led through the base element. With reference to the drawing figure, optically transparent cover 31 includes reflector surface 32.
  • the thermal conductor 33 supports a platform onto which the entire plurality of chips might be soldered. In the present case three chips are shown, however, it is fully anticipated that any number of chips might be placed there without loss of generality. Careful note should be made with regard to the relationship between the height of the thermal conductor and the position of the undersurface of the cover which includes the reflector. The chips must be properly located with respect to the features of the undersurface of the cover in order for it to operate properly to efficiently couple light into a controlled output beam.
  • the base 34 may be formed in a similar manner as the previous example and it easily supports a plurality of via holes, one each for each electrical conductor.
  • each semiconductor might be arranged to be in electrical communication with either electrical lead.
  • semiconductor 36 appears without a connection, the cross section drawing does not support objects which extend from the page, thus one will appreciate its existence without it being shown explicitly.
  • the base provides a common electrical connection, via the metallic thermal conductor, then each electrical lead 37 is isolated from the base via insulators 37.
  • the top surface 39 of the cover might include a lens formed as a surface relief pattern. This is sometimes and commonly known as a Fresnel type lens.
  • this version also benefits from addition of a gel material between the undersurface of the cover and the base/thermal conductor. In this case, the thermal conductor is in greater contact with the gel but the operation and service is the same or similar.
  • FIG. 4 illustrates yet another version. This variation extends the principle of having a cover 41 with a complex curved underside.
  • the LED package includes a base 42 of steel material and a thermal conductor 43 of copper material. Electrical lead 44 passes through via lined with insulative material 45 to provide a wire bond to the top surface of the semiconductor. Light emitted from the semiconductor falls incident on lens 46 which is part of the optical elements formed into the undersurface of the cover. Space 47 between the base and the cover may be filled with gel or may be left with an air buffer. Curved surface 48 forms a parabolic section reflector.
  • the parabola shape may be used where it is desirable to couple the light into a highly collimated beam.
  • Ray trace diagram 49 shows that light which glances off the lens falls to the reflector where it rejoins the light propagating toward the top surface of the cover.
  • a parabolic shape is shown for this example, it is done so to illustrate one of possible shapes.
  • a conic section similarly provides acceptable function.
  • Figure 5 illustrates yet another important example.
  • a conic section reflector is formed directly into the thermal conductor element as a recess whereby the recess also has a flat portion or 'floor' to receive the semiconductor chip thereon.
  • a semiconductor diode can be placed into the floor of the recess while the walls of the conic section are made reflective via polishing or coating.
  • the semiconductor forms a strong thermal coupling with respect to the thermal conductor while being optically coupled to the top of the cover element by way of the reflector.
  • Light from the diode is reflected in a direction towards the top of the package ; away from the thermal conductor, while at the same time, heat is drawn downward away from the semiconductor.
  • a base 51 is provided as a foundation.
  • Cover element 52 couples thereto said base at the base periphery. This coupling may include a mechanical pressure fit or/and adhesive.
  • Thermal conductor 53 is formed with recess 54 partly in the shape of a conic section having a floor. A semiconductor sets in the recess on the floor of the thermal conductor in intimate thermal contact therewith.
  • Wire provides electrical contact from the lead to the top surface of the semiconductor chip.
  • Light emitted from the diode junction falls incident upon the reflector and is directed toward the lens in the top surface of the cover. Heat generated in the diode is drawn quickly away from the junction and into the bulk material from which the thermal conductor is formed. Heat thereafter is transmitted to a terminal end of the thermal conductor 55. This end may be put into contact with a heat sink of a greater system in agreement with design considerations.
  • An important aspect of some versions of the cover is further illustrated here. As it is desirable to provide precise alignment between a lens and the reflector/chip the cover and base elements may incorporate an indexing means 56 to assure the symmetry axes of these elements are colinear.
  • skirt 57 may provide mechanical interlocking between the base and the cover whereby it is not easily removed there from. Careful study of the diagram proves that the very bottom edge of the skirt does not extend downwardly as far as the terminal end of the thermal conductor as indicated in the drawing by dashed lines and 'D'. In this way, the thermal conductor is nicely exposed and may be easily coupled to heat sinks arranged with understanding of the designs. This is very important in versions where the thermal conductor is to be coupled to an exterior heat sink.
  • a stand alone LED package can be inserted into a well designed receptacle such that the thermal conductor portion of the LED package contacts a heat sink. Excellent thermal contact may be made between the thermal conductor and a heat sink which is part of an overall system design.
  • a transfer mechanism may include a cooling fins set built integrally with the thermal conductor.
  • a thermal conductor is made part of the LED package and forms excellent thermal coupling between the semiconductor chip and the air surroundings.
  • Figure 6 illustrates.
  • Base element 61 and cover element 62 having a lens formed thereon when pressed together form a cavity 63 into which a gel material is inserted in a similar fashion described in previous examples.
  • a thermal conductor 64 is arranged to provide a high flux thermal path from semiconductor 65 at a first terminal end to its opposite terminal end comprised of a cooling fins arrangement 66. Heat is efficiently drawn away from the diode junction and towards the cooling fins and thereafter transferred into the surrounding atmosphere.
  • Electrical lead 67 can be fashioned to cooperate with the base in the normal way while remaining aside of the cooling fins arrangement.
  • Some preferred versions of these thermal conductors includes devices made of copper or a copper alloy. Copper is a superior material having a very high thermal conductivity. It is inexpensive and easy to machine. Its lifetime and electrical properties cooperate in every way with the properties necessary for good LED package design. Thus it is a preferred material with the note that similar highly conductive materials may also be suitable.
  • high current, high brightness LEDs may be formed with a heat management arrangement for high performance.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne des diodes électroluminescentes disposés avec un boîtier présentant un mécanisme intégral de dissipation de chaleur. Un matériau présentant une conductivité thermique élevée est bien relié à une puce à semi-conducteur pour fournir un chemin d'extraction de la chaleur de ladite puce susceptible de surchauffer. Certains modes de réalisation comprennent des mécanismes de dissipation de chaleur pourvus d'une deuxième extrémité, ce qui facilite l'extraction de chaleur du boîtier du dispositif. Le chemin à conductivité élevée est formé intégralement avec des autres composants du boîtier DEL et ledit chemin coopère avec ces derniers afin de fournir un support additionnel pour la fonctionnalité DEL.
EP04706235A 2004-01-29 2004-01-29 Diode electroluminescente comportant des moyens integraux de dissipation de chaleur Withdrawn EP1709692A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2004/000201 WO2005083804A1 (fr) 2004-01-29 2004-01-29 Diode electroluminescente comportant des moyens integraux de dissipation de chaleur

Publications (1)

Publication Number Publication Date
EP1709692A1 true EP1709692A1 (fr) 2006-10-11

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Country Status (4)

Country Link
EP (1) EP1709692A1 (fr)
CN (1) CN1906773A (fr)
CA (1) CA2550308A1 (fr)
WO (1) WO2005083804A1 (fr)

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WO2005083804A1 (fr) 2005-09-09
CN1906773A (zh) 2007-01-31
CA2550308A1 (fr) 2005-09-09

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