JP2008535227A - 高出力高効率パッケージ組込み型ダイオードランプ - Google Patents
高出力高効率パッケージ組込み型ダイオードランプ Download PDFInfo
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- JP2008535227A JP2008535227A JP2008503346A JP2008503346A JP2008535227A JP 2008535227 A JP2008535227 A JP 2008535227A JP 2008503346 A JP2008503346 A JP 2008503346A JP 2008503346 A JP2008503346 A JP 2008503346A JP 2008535227 A JP2008535227 A JP 2008535227A
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- diode lamp
- heat
- unit
- led
- led light
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 48
- 230000003287 optical effect Effects 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 6
- QVMHUALAQYRRBM-UHFFFAOYSA-N [P].[P] Chemical compound [P].[P] QVMHUALAQYRRBM-UHFFFAOYSA-N 0.000 claims description 2
- 239000012212 insulator Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000002210 silicon-based material Substances 0.000 claims 1
- 238000005286 illumination Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000012530 fluid Substances 0.000 description 6
- 239000003570 air Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/30—Semiconductor lasers
Abstract
【選択図】図3A
Description
Claims (20)
- 平坦部分のある熱伝導装置および該熱伝導装置の周囲に取り付けられる少なくとも1つの熱消散フィンから構成される熱伝導/熱消散ユニット、熱伝導装置の平坦部分に取り付けられるLED光ユニット、LED光ユニットによって発せられる光を集束させる光学ユニット、ならびに、LED光ユニットを制御する制御回路ユニットが含まれる場合において、ダイオードランプが電源に接続されている場合に、該制御回路ユニットが発光するLED光ユニットを選別して制御すると同時に、LED光ユニットの作動中に発生する熱が熱伝導装置の平坦部分から少なくとも一つの熱消散フィンまで伝導されるとともに、少なくとも一つの熱消散フィンによって消散される高出力かつ高効率パッケージ組込み型ダイオードランプ
- 電源が交流電源であるとともに、さらに制御回路ユニットに交流対直流コンバータが含まれる請求項1のダイオードランプ
- LED光チップに基板、該基板上に置かれる光発光ユニットならびに同基板上に置かれるそれぞれ2本の電極棒が含まれる請求項1のダイオードランプ
- LED光ユニットに少なくとも一つのLEDあるいは少なくとも一つのレーザーダイオードが含まれる請求項1のダイオードランプ
- 光ユニットに白色LEDが含まれる請求項1のダイオードランプ
- 白色LEDに青色LEDおよび燐蛍光体が含まれる請求項5のダイオードランプ
- 光ユニットに少なくとも一つの赤色LED、少なくとも一つの青色LEDならびに少なくとも一つの緑色LEDが含まれる請求項1のダイオードランプ
- 制御回路ユニットが少なくとも一つの赤色LED、少なくとも一つの青色LEDならびに少なくとも一つの緑色LEDを選別して制御する請求項8のダイオードランプ
- 基板がシリコン材料あるいは金属材料から形成される請求項1のダイオードランプ
- 光装置に熱伝導装置の平坦部分におかれる光発光ユニット、熱伝導装置の平坦部分におかれるそれぞれ2本の電極棒が含まれる請求項1のダイオードランプ
- 各絶縁体が各熱伝導装置と2本の電極棒のそれぞれとの間におかれる請求項10のダイオードランプ
- 熱伝導装置が熱伝導柱状体あるいは熱伝導パイプである請求項1のダイオードランプ
- 熱伝導装置が銅材料から形成される請求項1のダイオードランプ
- 少なくとも一つの各熱消散フィンが熱伝導装置の周囲に取り付けられる請求項1のダイオードランプ
- 少なくとも一つの各消散フィンが円盤状である請求項1のダイオードランプ
- 少なくとも一つの各消散フィンが不規則形状である請求項1のダイオードランプ
- 少なくとも一つの各消散フィンの上に少なくとも一つの貫通穴が形成される請求項1のダイオードランプ
- 平坦部分が熱伝導装置の端部に形成される請求項1のダイオードランプ
- 熱伝導装置の側壁に平坦部分が形成される請求項1のダイオードランプ
- ダイオードランプにさらに少なくとも一つの消散フィンを覆うようにしたケーシングが含まれる請求項1のダイオードランプ
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005100624504A CN1840958B (zh) | 2005-03-28 | 2005-03-28 | 系统构装的高功率高效率二极管灯泡 |
PCT/CN2005/000389 WO2006102785A1 (fr) | 2005-03-28 | 2005-03-28 | Lampe led de grande puissance et efficace |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008535227A true JP2008535227A (ja) | 2008-08-28 |
JP4991696B2 JP4991696B2 (ja) | 2012-08-01 |
Family
ID=43974045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008503346A Expired - Fee Related JP4991696B2 (ja) | 2005-03-28 | 2005-03-28 | 高出力高効率パッケージ組込み型ダイオードランプ |
Country Status (7)
Country | Link |
---|---|
US (3) | US7891837B2 (ja) |
EP (1) | EP1873447A4 (ja) |
JP (1) | JP4991696B2 (ja) |
KR (1) | KR100999843B1 (ja) |
CN (1) | CN1840958B (ja) |
AU (1) | AU2005329901B2 (ja) |
WO (1) | WO2006102785A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010287561A (ja) * | 2009-06-11 | 2010-12-24 | Yeh-Chiang Technology Corp | Ledランプ |
US8157421B2 (en) | 2009-06-11 | 2012-04-17 | Yeh-Chiang Technology Corp. | Light emitting diode lamp |
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WO2008064524A1 (en) * | 2006-11-30 | 2008-06-05 | Jen-Shyan Chen | Outdoor-type high-power light emitting diode illumination device |
KR101010590B1 (ko) * | 2006-12-30 | 2011-01-25 | 네오벌브 테크놀러지스 인크 | Led 조명장치 |
WO2008131584A1 (fr) * | 2007-04-27 | 2008-11-06 | Jenshyan Chen | Dispositif d'éclairage à diode électro-luminescente |
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JP4945433B2 (ja) * | 2007-12-28 | 2012-06-06 | シャープ株式会社 | 照明装置 |
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KR20120080022A (ko) * | 2011-01-06 | 2012-07-16 | 삼성엘이디 주식회사 | 조명 장치 |
KR101272346B1 (ko) * | 2011-01-25 | 2013-06-07 | 정춘식 | 히트파이프가 장착된 냉각장치 |
CN102927481B (zh) * | 2011-11-25 | 2013-11-20 | 俞国宏 | 一种大功率led灯具 |
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CN103594606A (zh) * | 2013-11-12 | 2014-02-19 | 广东工业大学 | 一种发光二极管飞盘状支架 |
TWI607175B (zh) * | 2013-11-21 | 2017-12-01 | 綠點高新科技股份有限公司 | Lighting device and radiator manufacturing method for lighting device |
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US10578293B2 (en) * | 2014-07-22 | 2020-03-03 | Signify Holding B.V. | Light source cooling body, light source assembly, a luminaire and method to manufacture a light source cooling or a light source assembly |
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CN110159979A (zh) * | 2019-06-21 | 2019-08-23 | 叶利苗 | 一种压差式绕组扩展散热的led路灯模组 |
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2005
- 2005-03-28 KR KR1020077023375A patent/KR100999843B1/ko not_active IP Right Cessation
- 2005-03-28 JP JP2008503346A patent/JP4991696B2/ja not_active Expired - Fee Related
- 2005-03-28 EP EP05732572A patent/EP1873447A4/en not_active Withdrawn
- 2005-03-28 US US11/887,427 patent/US7891837B2/en not_active Expired - Fee Related
- 2005-03-28 CN CN2005100624504A patent/CN1840958B/zh not_active Expired - Fee Related
- 2005-03-28 WO PCT/CN2005/000389 patent/WO2006102785A1/zh active Application Filing
- 2005-03-28 AU AU2005329901A patent/AU2005329901B2/en not_active Ceased
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2011
- 2011-01-13 US US13/006,015 patent/US8029158B2/en not_active Expired - Fee Related
- 2011-09-02 US US13/224,624 patent/US20110317423A1/en not_active Abandoned
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EP1467414A1 (en) * | 2001-12-29 | 2004-10-13 | Hangzhou Fuyang Xinying Dianzi Ltd. | A led and led lamp |
WO2004011848A2 (en) * | 2002-07-25 | 2004-02-05 | Dahm Jonathan S | Method and apparatus for using light emitting diodes for curing |
JP2004296245A (ja) * | 2003-03-26 | 2004-10-21 | Matsushita Electric Works Ltd | Ledランプ |
US20040213016A1 (en) * | 2003-04-25 | 2004-10-28 | Guide Corporation | Automotive lighting assembly cooling system |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2010287561A (ja) * | 2009-06-11 | 2010-12-24 | Yeh-Chiang Technology Corp | Ledランプ |
US8157421B2 (en) | 2009-06-11 | 2012-04-17 | Yeh-Chiang Technology Corp. | Light emitting diode lamp |
Also Published As
Publication number | Publication date |
---|---|
CN1840958A (zh) | 2006-10-04 |
US8029158B2 (en) | 2011-10-04 |
CN1840958B (zh) | 2012-07-04 |
US20110110088A1 (en) | 2011-05-12 |
AU2005329901B2 (en) | 2011-09-08 |
AU2005329901A1 (en) | 2006-10-05 |
US20090278460A1 (en) | 2009-11-12 |
US20110317423A1 (en) | 2011-12-29 |
KR100999843B1 (ko) | 2010-12-13 |
WO2006102785A1 (fr) | 2006-10-05 |
EP1873447A4 (en) | 2009-04-22 |
JP4991696B2 (ja) | 2012-08-01 |
US7891837B2 (en) | 2011-02-22 |
KR20080002823A (ko) | 2008-01-04 |
EP1873447A1 (en) | 2008-01-02 |
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