WO2007019734A1 - Système efficace de puissance élevée dans une lampe à diode led en boîtier - Google Patents

Système efficace de puissance élevée dans une lampe à diode led en boîtier Download PDF

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Publication number
WO2007019734A1
WO2007019734A1 PCT/CN2005/001302 CN2005001302W WO2007019734A1 WO 2007019734 A1 WO2007019734 A1 WO 2007019734A1 CN 2005001302 W CN2005001302 W CN 2005001302W WO 2007019734 A1 WO2007019734 A1 WO 2007019734A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
diode
heat
guiding device
thermal
Prior art date
Application number
PCT/CN2005/001302
Other languages
English (en)
Chinese (zh)
Inventor
Jen-Shyan Chen
Original Assignee
Neobulb Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neobulb Technologies, Inc. filed Critical Neobulb Technologies, Inc.
Priority to US11/990,599 priority Critical patent/US7905644B2/en
Priority to EP05781696A priority patent/EP1923624A1/fr
Priority to JP2008526350A priority patent/JP2009505407A/ja
Priority to PCT/CN2005/001302 priority patent/WO2007019734A1/fr
Priority to AU2005335695A priority patent/AU2005335695A1/en
Priority to CA2619150A priority patent/CA2619150C/fr
Publication of WO2007019734A1 publication Critical patent/WO2007019734A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0091—Positioning aspects of the light source relative to the light guide

Definitions

  • the present invention relates to a light-emitting diode lamp, and in particular, to a system-in-package high efficiency, high power LED lamp. Background technique
  • LEDs light emitting diodes
  • shock resistance shock resistance
  • fast response fast response
  • mass production the current lighting equipment using light-emitting diodes as a light source has been continuously researched and developed.
  • the existing high-power LEDs have a problem of excessive temperature after a period of continuous illumination, so that the luminous efficiency of the LED itself is lowered, and the brightness cannot be improved. Therefore, various products that use high-power LEDs require a good heat dissipation mechanism. Summary of the invention
  • the light-emitting diode lamp of the present invention comprises a light-guiding device, and the light emitted by the diode light-emitting device can be led out in one direction or in multiple directions, so that the point light source generated by the diode light-emitting device is extended to Stable line or face.
  • a primary aspect of the present invention is to provide a high efficiency, high power LED lamp for system packaging.
  • a light-emitting diode lamp according to a preferred embodiment of the present invention comprises a light guiding device and a first packaged system.
  • the light guiding device has a first end and a second end.
  • the first package system is fixed to the first end of the light guide device and includes a first heat conduction/heat dissipation module and a first diode light emitting device.
  • the first heat conduction/heat dissipation module includes a first heat-conducting device and at least one first heat-dissipating device, and the first heat-conducting device has a first flat portion.
  • the at least one first heat dissipation fin is disposed around the first heat conduction device.
  • the first diode lighting device is disposed at a first flat portion of the first thermal guiding device and is electrically connectable to a power source, and the first diode lighting device is capable of transmitting the first electrical energy provided by the power source Convert to the first light.
  • the first diode lighting device emits The first light rays are incident into the light guiding device and are led out of the light guiding device by the light guiding device, and the heat generated by the first diode light emitting device when emitting light Leading from the first flat portion of the first thermal guide to the at least one first heat sink fin, and thereby dissipating heat from the at least one first heat sink fin.
  • the diode lamp of the present invention encloses the thermal conduction/heat dissipation module with the diode illuminator and incorporates a light guide.
  • the heat conduction/heat dissipation module can dissipate the heat generated by the diode light-emitting device to the surrounding air through the heat dissipation fins, thereby greatly improving the heat dissipation efficiency.
  • the light guiding device can guide the light incident by the diode light emitting device in one direction or multiple directions, so that the point light source generated by the light emitting device extends into a stable linear or planar lighting device.
  • FIG. 1 is a schematic illustration of a light emitting diode lamp in accordance with a preferred embodiment of the present invention.
  • FIG. 2 is a schematic illustration of an LED lamp in accordance with an embodiment of the present invention.
  • FIG. 3 is a structural diagram of a first diode lighting device in accordance with an embodiment of the present invention.
  • Figure 4 is a schematic illustration of a light guide plate as a light guide in accordance with one embodiment of the present invention. detailed description
  • a primary aspect of the present invention is to provide a high efficiency, high power light emitting diode lamp for system packaging.
  • the light-emitting diode lamp according to the invention comprises a light guiding device 2 and a first packaging system 4.
  • the light guiding device 2 has a first end and a second end.
  • the first package system 4 is fixed to the first end of the light guide device 2, and the first package system 4 includes a first heat conduction/heat dissipation 42 module and a first diode light-emitting device 44.
  • the first heat conduction/heat dissipation module 42 includes a first thermal conduction device 422 and at least one first heat dissipation fin 424.
  • the first thermal conduction device 422 has a first flat portion, and at least one first heat dissipation fin 424 is disposed on the first heat.
  • the first diode lighting device 44 is disposed on the first flat portion of the first thermal guiding device 422 and can be electrically connected to the power source, and the first diode lighting device 44 can convert the first electric energy provided by the power source into the first light.
  • the first diode lighting device 44 emits the first
  • the light 442 is 442
  • the first light 442 is incident into the light guiding device 2 and is led out of the light guiding device by the light guiding device, and the heat generated by the first diode lighting device 44 when emitting light is generated by the first thermal guiding device 422.
  • the first flat portion of itself is guided to the at least one first heat dissipation fin 424 and further radiated by the at least one first heat dissipation fin 424.
  • the LED lamp can further comprise a second packaging system 4b.
  • the second package system 4b is fixed to the second end of the light guide device 2 and includes a second heat conduction/heat dissipation module 42b and a second diode light-emitting device 44b.
  • the second heat conduction/heat dissipation module 42b includes a second heat conduction device 422b and at least one second heat dissipation fin 424b.
  • the second heat conduction device 422b has a second flat portion, and at least one second heat dissipation fin 424b is disposed on the second heat.
  • the second diode lighting device 44b is disposed at the second flat portion of the second thermal guiding device 42b and can be electrically connected to the power source, and the second diode lighting device 44b can convert the second electric energy provided by the power source into the second light. 442b.
  • the second diode lighting device 44b emits the second light 442b
  • the second light 442b is incident into the light guiding device 2 and is led out of the light guiding device, and the second diode lighting device 44b is illuminated.
  • the generated heat is directed by the second thermal conduction device 422b from its own second flat portion to the at least one second heat dissipation fin 424b, thereby being dissipated by the at least one second heat dissipation fin 424b.
  • the LED lamp of the present invention may further comprise a first sleeve (Sleeve) 8 and a second sleeve 8b.
  • first sleeve 8 fits into the first diode lighting device 44, and the other end of the first sleeve 8 fits into the first end of the light guiding device 2; one end of the second sleeve 8b fits into the second sleeve
  • the diode light-emitting device 44b has the other end of the second sleeve 8b fitted into the second end of the light guiding device 2.
  • FIG. 3 is a block diagram of a first diode lighting device in accordance with an embodiment of the present invention.
  • the first diode illuminating device 44 includes a first substrate 440 made of a semiconductor material, a metal material, a polymer material or a ceramic material, a first light emitting module 448, and two first electrodes 446.
  • the first light emitting module 448 and the two first electrodes 446 are respectively disposed on the first substrate 440 in an insulating manner.
  • the first light emitting modules 448 are respectively connected to the two first electrodes 446.
  • the second diode light emitting device comprises a second substrate made of a semiconductor material, a metal material, a polymer material or a ceramic material, a second light emitting module, and two second electrodes,
  • the two light emitting modules and the two second electrodes are respectively disposed on the second substrate in an insulating manner.
  • the second light emitting modules are respectively connected to the two second electrodes.
  • each of the first lighting module and the second lighting module comprises At least one light emitting diode or at least one laser diode.
  • each of the first thermal conductor and the second thermal conduction device can be a heat pipe or a heat column.
  • Each of the first heat guide and the second heat guide is made of a copper material, an aluminum material, or a material having a high thermal conductivity.
  • the light guiding means can be a tubular element, a cylindrical element or a light guiding plate. See Figure 4.
  • Figure 4 is a schematic view of the light guide plate 2 as a light guide.
  • the light guide plate 2 is a cube whose opposite corners are treated into two opposite planes.
  • the first package system 4 and the second package system 4b are fixed to the opposite two planes.
  • the light guide plate 2 can be used to derive a single light incident from the diode light-emitting device in the package system into a one-sided light source.
  • the diode lamp of the present invention encloses the thermal conduction/heat dissipation module with the diode illuminator and incorporates a light guide.
  • the heat conduction/heat dissipation module can quickly dissipate the heat generated by the diode light-emitting device into the surrounding air through the heat-dissipating fins, thereby greatly improving the heat dissipation efficiency and further improving the luminous efficiency.
  • the light guiding device can guide the light incident by the diode light emitting device in one direction or multiple directions, so that the point light source generated by the light emitting device extends into a stable linear shape or a planar shape. Therefore, in comparison with the prior art, the system package light-emitting diode lamp containing the light guide device according to the present invention is more suitable for use in a diode lamp illumination device requiring high power, high efficiency, and a wide range.

Abstract

L’invention concerne un système efficace de puissance élevée dans une diode LED en boîtier. La lampe à diode LED conforme au brevet inclut un dispositif de guidage de lumière (2). Le dispositif lumineux de diode (44) convertit l'énergie électrique en lumière incidente sur au moins l'une des extrémités du dispositif de guidage de lumière (2), puis la lumière est guidée hors du dispositif de guidage de lumière (2) grâce au dispositif de guidage de lumière (2). La chaleur en provenance du module lumineux de diode (44) peut être conduite depuis la partie plate du moyen de conduction de chaleur (422) vers au moins une des ailettes de dissipation de chaleur (424) et peut être dissipée par les ailettes de dissipation de chaleur (424).
PCT/CN2005/001302 2005-08-19 2005-08-19 Système efficace de puissance élevée dans une lampe à diode led en boîtier WO2007019734A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US11/990,599 US7905644B2 (en) 2005-08-19 2005-08-19 System in package high power high efficiency light-emitting diode lamp
EP05781696A EP1923624A1 (fr) 2005-08-19 2005-08-19 Système efficace de puissance élevée dans une lampe à diode led en boîtier
JP2008526350A JP2009505407A (ja) 2005-08-19 2005-08-19 パッケージ型高出力高効率ｌｅｄランプ
PCT/CN2005/001302 WO2007019734A1 (fr) 2005-08-19 2005-08-19 Système efficace de puissance élevée dans une lampe à diode led en boîtier
AU2005335695A AU2005335695A1 (en) 2005-08-19 2005-08-19 An efficient high-power system-in-package led lamp
CA2619150A CA2619150C (fr) 2005-08-19 2005-08-19 Dispositif dans lampe en emballage a diodes electroluminescentes de haute puissance et a haut rendement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2005/001302 WO2007019734A1 (fr) 2005-08-19 2005-08-19 Système efficace de puissance élevée dans une lampe à diode led en boîtier

Publications (1)

Publication Number Publication Date
WO2007019734A1 true WO2007019734A1 (fr) 2007-02-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2005/001302 WO2007019734A1 (fr) 2005-08-19 2005-08-19 Système efficace de puissance élevée dans une lampe à diode led en boîtier

Country Status (5)

Country Link
EP (1) EP1923624A1 (fr)
JP (1) JP2009505407A (fr)
AU (1) AU2005335695A1 (fr)
CA (1) CA2619150C (fr)
WO (1) WO2007019734A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015062135A1 (fr) * 2013-10-29 2015-05-07 蔡鸿 Structure de dissipation thermique de source de lumière à del et son procédé de dissipation thermique

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2270298Y (zh) * 1995-07-04 1997-12-10 杨兴旺 一种配电盘用长寿节能指示灯
CN1359137A (zh) * 2001-12-29 2002-07-17 葛世潮 超导热管灯
CN1605795A (zh) * 2004-10-19 2005-04-13 陈振贤 具高散热效率的照明装置
CN1637343A (zh) * 2004-01-08 2005-07-13 日本板硝子株式会社 线照明器件和图像扫描器件

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6125266Y2 (fr) * 1980-02-01 1986-07-29
KR100991827B1 (ko) * 2001-12-29 2010-11-10 항조우 후양 신잉 띠앤즈 리미티드 Ｌｅｄ 및 ｌｅｄ램프
JP2005164909A (ja) * 2003-12-02 2005-06-23 Citizen Electronics Co Ltd 光ファイバーモジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2270298Y (zh) * 1995-07-04 1997-12-10 杨兴旺 一种配电盘用长寿节能指示灯
CN1359137A (zh) * 2001-12-29 2002-07-17 葛世潮 超导热管灯
CN1637343A (zh) * 2004-01-08 2005-07-13 日本板硝子株式会社 线照明器件和图像扫描器件
CN1605795A (zh) * 2004-10-19 2005-04-13 陈振贤 具高散热效率的照明装置

Also Published As

Publication number Publication date
EP1923624A1 (fr) 2008-05-21
AU2005335695A1 (en) 2007-02-22
CA2619150C (fr) 2011-08-02
JP2009505407A (ja) 2009-02-05
CA2619150A1 (fr) 2007-02-22

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