GB1365448A - Fluid heat transfer apparatus for semi conducting devices - Google Patents

Fluid heat transfer apparatus for semi conducting devices

Info

Publication number
GB1365448A
GB1365448A GB2304772A GB2304772A GB1365448A GB 1365448 A GB1365448 A GB 1365448A GB 2304772 A GB2304772 A GB 2304772A GB 2304772 A GB2304772 A GB 2304772A GB 1365448 A GB1365448 A GB 1365448A
Authority
GB
United Kingdom
Prior art keywords
heat transfer
transfer apparatus
fluid heat
transistor
conducting devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2304772A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Space and Mission Systems Corp
Original Assignee
TRW Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TRW Inc filed Critical TRW Inc
Priority to GB2304772A priority Critical patent/GB1365448A/en
Publication of GB1365448A publication Critical patent/GB1365448A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1365448 Heat pipes TRW Inc 17 May 1972 23047/72 Heading F4U [Also in Division H1] A heat pipe structure for use in cooling a transistor 11 disposed on a beryllium oxide base 10 and having transistor leads 17, 18, 19 with wire attachments 20, 21, comprises first and second capillary wick members 22, 24 located within a housing 12, 13. As shown, the lower wick member 22 is adjacent the transistor 11. The wick is preferably formed of high purity silica glass cloth. The working fluid is pentane
GB2304772A 1972-05-17 1972-05-17 Fluid heat transfer apparatus for semi conducting devices Expired GB1365448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2304772A GB1365448A (en) 1972-05-17 1972-05-17 Fluid heat transfer apparatus for semi conducting devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2304772A GB1365448A (en) 1972-05-17 1972-05-17 Fluid heat transfer apparatus for semi conducting devices

Publications (1)

Publication Number Publication Date
GB1365448A true GB1365448A (en) 1974-09-04

Family

ID=10189251

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2304772A Expired GB1365448A (en) 1972-05-17 1972-05-17 Fluid heat transfer apparatus for semi conducting devices

Country Status (1)

Country Link
GB (1) GB1365448A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4233645A (en) * 1978-10-02 1980-11-11 International Business Machines Corporation Semiconductor package with improved conduction cooling structure
GB2199650A (en) * 1986-12-22 1988-07-13 Sundstrand Corp Cooling electronic components
EP1873447A1 (en) * 2005-03-28 2008-01-02 NeoBulb Technologies, Inc. An efficient high-power led lamp

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4233645A (en) * 1978-10-02 1980-11-11 International Business Machines Corporation Semiconductor package with improved conduction cooling structure
GB2199650A (en) * 1986-12-22 1988-07-13 Sundstrand Corp Cooling electronic components
GB2199650B (en) * 1986-12-22 1990-11-14 Sundstrand Corp Heat dissipating mounting for electronic components
EP1873447A1 (en) * 2005-03-28 2008-01-02 NeoBulb Technologies, Inc. An efficient high-power led lamp
EP1873447A4 (en) * 2005-03-28 2009-04-22 Neobulb Technologies Inc An efficient high-power led lamp

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee