GB1229474A - - Google Patents

Info

Publication number
GB1229474A
GB1229474A GB1229474DA GB1229474A GB 1229474 A GB1229474 A GB 1229474A GB 1229474D A GB1229474D A GB 1229474DA GB 1229474 A GB1229474 A GB 1229474A
Authority
GB
United Kingdom
Prior art keywords
semi
heat sink
conductor element
electrical
june
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1229474A publication Critical patent/GB1229474A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

1,229,474. Semi-conductor devices. THEODOR KIEPE, ELEKTROTECHNISCHE FABRIK. 14 June, 1968 [16 June, 1967], No. 28602/68. Heading H1K. A heat sink for a semi-conductor element comprises a first part 1, to which a semi-conductor element 2 is fixed in electrical and thermal contact, and a second part 3 to which the first part 1 fixed in thermal but not in electrical contact, the second part having fins 3<SP>1</SP> to dissipate the heat generated by the semi-conductor element. The first part 1 of the heat sink is made of copper, coated with silver to resist corrosion, and the electrical insulation between the two parts of the heat sink is a mica sheet 4. The second part 3 may act as a base on which other devices, such as capacitors, &c., may be mounted.
GB1229474D 1967-06-16 1968-06-14 Expired GB1229474A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEK0062573 1967-06-16
DE19671614012 DE1614012A1 (en) 1967-06-16 1967-06-16 Arrangement for dissipating the heat generated in semiconductor elements such as diodes, thyristors and the like

Publications (1)

Publication Number Publication Date
GB1229474A true GB1229474A (en) 1971-04-21

Family

ID=25753695

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1229474D Expired GB1229474A (en) 1967-06-16 1968-06-14

Country Status (3)

Country Link
CH (1) CH478456A (en)
DE (1) DE1614012A1 (en)
GB (1) GB1229474A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2129613A (en) * 1982-10-18 1984-05-16 Raytheon Co Semiconductor structures and manufacturing methods

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2638909A1 (en) * 1976-08-28 1978-03-02 Semikron Gleichrichterbau SEMI-CONDUCTOR ARRANGEMENT

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2129613A (en) * 1982-10-18 1984-05-16 Raytheon Co Semiconductor structures and manufacturing methods

Also Published As

Publication number Publication date
DE1614012A1 (en) 1970-03-26
CH478456A (en) 1969-09-15

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Legal Events

Date Code Title Description
CSNS Application of which complete specification have been accepted and published, but patent is not sealed