GB1006930A - Improved semiconductor device encapsulation and cooling structure therefor - Google Patents

Improved semiconductor device encapsulation and cooling structure therefor

Info

Publication number
GB1006930A
GB1006930A GB3656961A GB3656961A GB1006930A GB 1006930 A GB1006930 A GB 1006930A GB 3656961 A GB3656961 A GB 3656961A GB 3656961 A GB3656961 A GB 3656961A GB 1006930 A GB1006930 A GB 1006930A
Authority
GB
United Kingdom
Prior art keywords
semi
heat sink
heat dissipating
envelope
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3656961A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Clevite Corp
Original Assignee
Clevite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clevite Corp filed Critical Clevite Corp
Publication of GB1006930A publication Critical patent/GB1006930A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1,006,930. Semi-conductor devices. CLEVITE CORPORATION. Oct. 11, 1961 [Nov. 3, 19601, No. 36569/61. Heading H1K. An encapsulation for a semi-conductor device has a heat dissipating structure with a well into which fits a cylindrical envelope containing the device, and has a post in thermal contact with the heat dissipating structure adjacent the envelope but spaced therefrom and which extends into the envelope to support and make thermal contact with the semi-conductor device. The embodiment shown in Fig. 1 comprises a diode substantially as described in Specification 934,301 mounted within an annularly finned heat sink which may be force cooled. A longitudinally finned heat sink may instead by used. Another form of heat sink is threaded so that it may be screwed into a metal chassis and the heat dissipating capacity thus increased. The invention is not restricted to the use of the diode structures of Specification 934,301 and another form is shown in Fig. 5 in which the semi-conductor device 16 is soldered to its two leads.
GB3656961A 1960-11-03 1961-10-11 Improved semiconductor device encapsulation and cooling structure therefor Expired GB1006930A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6707660A 1960-11-03 1960-11-03

Publications (1)

Publication Number Publication Date
GB1006930A true GB1006930A (en) 1965-10-06

Family

ID=22073559

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3656961A Expired GB1006930A (en) 1960-11-03 1961-10-11 Improved semiconductor device encapsulation and cooling structure therefor

Country Status (1)

Country Link
GB (1) GB1006930A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10182688B2 (en) 2013-05-28 2019-01-22 Falcon Waterfree Technologies, Llc Splash-reducing and velocity-increasing cartridge exit
US10184235B2 (en) 2013-05-28 2019-01-22 Falcon Waterfree Technologies, Llc Directional fluid inlet
US10197430B2 (en) 2014-01-20 2019-02-05 Falcon Waterfree Technologies, Llc Visual indicator
US10273675B2 (en) 2013-04-26 2019-04-30 Falcon Waterfree Technologies, Llc Hybrid trap with water injection

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10273675B2 (en) 2013-04-26 2019-04-30 Falcon Waterfree Technologies, Llc Hybrid trap with water injection
US10975560B2 (en) 2013-04-26 2021-04-13 Falcon Water Technologies, LLC Hybrid trap with water injection
US10182688B2 (en) 2013-05-28 2019-01-22 Falcon Waterfree Technologies, Llc Splash-reducing and velocity-increasing cartridge exit
US10184235B2 (en) 2013-05-28 2019-01-22 Falcon Waterfree Technologies, Llc Directional fluid inlet
US10197430B2 (en) 2014-01-20 2019-02-05 Falcon Waterfree Technologies, Llc Visual indicator

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