GB886451A - Improvements in or relating to semi-conductors - Google Patents

Improvements in or relating to semi-conductors

Info

Publication number
GB886451A
GB886451A GB2564/60A GB256460A GB886451A GB 886451 A GB886451 A GB 886451A GB 2564/60 A GB2564/60 A GB 2564/60A GB 256460 A GB256460 A GB 256460A GB 886451 A GB886451 A GB 886451A
Authority
GB
United Kingdom
Prior art keywords
soldered
casing
plate
semi
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2564/60A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB886451A publication Critical patent/GB886451A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
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    • H01L2924/01019—Potassium [K]
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    • H01L2924/01023—Vanadium [V]
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    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
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    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
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    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

886,451. Semi-conductor devices. BOSCH G.m.b.H., ROBERT. Jan. 25, 1960 [Jan. 28, 1959], No. 2564/60. Class 37. In a semi-conductor device such as a diode or transistor, a semi-conductor body comprising at least one PN junction is soldered, directly or indirectly, on to a carrier of easily solderable metal which is held in a casing of poorly solderable metal having good heat conductivity, primarily by compression between contacting surfaces of carrier and casing, no separate fastening means being used. In the diode shown in Fig. 1, a carrier plate 13 of copper is a force-fit in a blind bore 12 in a casing 10 of aluminium comprising radial cooling ribs 11. To the plate 13 is tin soldered one surface of a nickel plate 16, to the other surface of which is soldered one side of a wafer 17 of N-type germanium which has had a pill of indium alloyed to its other side in vacuo at 530-550‹ C. A copper lead 20 has one end indium coated and soldered to the indium pill. After being washed and tested the device is sealed by an insulating annular disc 26 covered with a moulding composition 27, a few grains 24 of a drying medium, e.g. silica gel, being sealed in the enclosure. The nickel plate 16 may be replaced by a coating of nickel on at least one main surface of the carrier plate 13 ; alternatively, the nickel plate may be thick enough to constitute the carrier plate, in which case it is pressed into the bore 12 by means of a peripheral punch which does not damage the wafer. In the embodiment shown in Fig. 5, the nickel plate holding the germanium wafer 39 is soldered to the end of a blind bore 32 in a copper body 33 around which an aluminium casing 34 with cooling ribs 35 is formed by injection moulding. In addition to the clamping of the casing to the body on cooling, the former is keyed to the latter by an annular groove 40 in the body.
GB2564/60A 1959-01-28 1960-01-25 Improvements in or relating to semi-conductors Expired GB886451A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEB51886A DE1205626B (en) 1959-01-28 1959-01-28 Semiconductor device

Publications (1)

Publication Number Publication Date
GB886451A true GB886451A (en) 1962-01-10

Family

ID=6969700

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2564/60A Expired GB886451A (en) 1959-01-28 1960-01-25 Improvements in or relating to semi-conductors

Country Status (4)

Country Link
CH (1) CH376188A (en)
DE (1) DE1205626B (en)
FR (1) FR1244077A (en)
GB (1) GB886451A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1242758B (en) * 1961-04-07 1967-06-22 Siemens Ag Semiconductor arrangement, especially for high performance, in which a thin, disk-shaped semiconductor body is attached to a carrier plate
CN104485297B (en) * 2014-12-18 2017-04-05 中国空间技术研究院 Pill encapsulates light-sensitive device test conversion fixture

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1094755A (en) * 1955-01-20 1955-05-24
BE558969A (en) * 1956-07-04

Also Published As

Publication number Publication date
FR1244077A (en) 1960-10-21
CH376188A (en) 1964-03-31
DE1205626B (en) 1965-11-25

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