GB1052449A - - Google Patents

Info

Publication number
GB1052449A
GB1052449A GB1052449DA GB1052449A GB 1052449 A GB1052449 A GB 1052449A GB 1052449D A GB1052449D A GB 1052449DA GB 1052449 A GB1052449 A GB 1052449A
Authority
GB
United Kingdom
Prior art keywords
carrier plate
soldered
ring
wafer
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of GB1052449A publication Critical patent/GB1052449A/en
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

1,052,449. Semi-conductor devices. ALLM€NNA SVENSKA ELEKTRISKA A.B. Oct. 11, 1963 [Oct. 15, 1962], No. 40143/63. Heading H1K. A device e.g. diode, transistor or thyristor comprises a semi-conductor wafer alloyed or soldered to one face of a larger carrier plate the other face of which is in pressure contact with a cooling body. The carrier plate is of a material with a thermal expansion coefficient within 50% of that of the wafer. In a typical diode (Fig. 1) the wafer is of P-type silicon and is bonded to carrier plate 11 and electrode 13 by aluminium and gold-antimony respectively. Suitable carrier plate materials for silicon or germanium wafers are tungsten, molybdenum, chromium, tantalum, and specified iron-nickel and iron-nickel cobalt alloys. Sintered tungsten or molybdenum, with or without copper as binder, are preferred. Ceramic ring 14 is attached to the carrier plate 11 via a fernico ring 17 which is silver-soldered to the ring and gold-tin soldered to the plate. The plate is clamped to the finned copper aluminium or silumin body 21 as indicated, by an internally threaded clamping ring engaging a thread on the body, or by being itself screwed into a threaded hole in the body.
GB1052449D 1962-10-15 Active GB1052449A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE1099862A SE311196B (en) 1962-10-15 1962-10-15

Publications (1)

Publication Number Publication Date
GB1052449A true GB1052449A (en)

Family

ID=20293189

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1052449D Active GB1052449A (en) 1962-10-15

Country Status (5)

Country Link
CH (1) CH427039A (en)
DE (1) DE1464425A1 (en)
GB (1) GB1052449A (en)
NL (1) NL299250A (en)
SE (1) SE311196B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4620215A (en) * 1982-04-16 1986-10-28 Amdahl Corporation Integrated circuit packaging systems with double surface heat dissipation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4620215A (en) * 1982-04-16 1986-10-28 Amdahl Corporation Integrated circuit packaging systems with double surface heat dissipation

Also Published As

Publication number Publication date
NL299250A (en)
SE311196B (en) 1969-06-02
DE1464425A1 (en) 1968-10-24
CH427039A (en) 1966-12-31

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