SE311196B - - Google Patents
Info
- Publication number
- SE311196B SE311196B SE1099862A SE1099862A SE311196B SE 311196 B SE311196 B SE 311196B SE 1099862 A SE1099862 A SE 1099862A SE 1099862 A SE1099862 A SE 1099862A SE 311196 B SE311196 B SE 311196B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1052449D GB1052449A (xx) | 1962-10-15 | ||
| NL299250D NL299250A (xx) | 1962-10-15 | ||
| SE1099862A SE311196B (xx) | 1962-10-15 | 1962-10-15 | |
| DE19631464425 DE1464425A1 (xx) | 1962-10-15 | 1963-09-28 | |
| CH1224863A CH427039A (de) | 1962-10-15 | 1963-10-03 | Halbleiteranordnung |
| FR950519A FR1372216A (fr) | 1962-10-15 | 1963-10-14 | Dispositif semi-conducteur |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE1099862A SE311196B (xx) | 1962-10-15 | 1962-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE311196B true SE311196B (xx) | 1969-06-02 |
Family
ID=20293189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE1099862A SE311196B (xx) | 1962-10-15 | 1962-10-15 |
Country Status (5)
| Country | Link |
|---|---|
| CH (1) | CH427039A (xx) |
| DE (1) | DE1464425A1 (xx) |
| GB (1) | GB1052449A (xx) |
| NL (1) | NL299250A (xx) |
| SE (1) | SE311196B (xx) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4620215A (en) * | 1982-04-16 | 1986-10-28 | Amdahl Corporation | Integrated circuit packaging systems with double surface heat dissipation |
-
0
- GB GB1052449D patent/GB1052449A/en active Active
- NL NL299250D patent/NL299250A/xx unknown
-
1962
- 1962-10-15 SE SE1099862A patent/SE311196B/xx unknown
-
1963
- 1963-09-28 DE DE19631464425 patent/DE1464425A1/de active Pending
- 1963-10-03 CH CH1224863A patent/CH427039A/de unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NL299250A (xx) | |
| GB1052449A (xx) | |
| CH427039A (de) | 1966-12-31 |
| DE1464425A1 (xx) | 1968-10-24 |