CH427039A - Halbleiteranordnung - Google Patents
HalbleiteranordnungInfo
- Publication number
- CH427039A CH427039A CH1224863A CH1224863A CH427039A CH 427039 A CH427039 A CH 427039A CH 1224863 A CH1224863 A CH 1224863A CH 1224863 A CH1224863 A CH 1224863A CH 427039 A CH427039 A CH 427039A
- Authority
- CH
- Switzerland
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE1099862A SE311196B (de) | 1962-10-15 | 1962-10-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH427039A true CH427039A (de) | 1966-12-31 |
Family
ID=20293189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1224863A CH427039A (de) | 1962-10-15 | 1963-10-03 | Halbleiteranordnung |
Country Status (5)
Country | Link |
---|---|
CH (1) | CH427039A (de) |
DE (1) | DE1464425A1 (de) |
GB (1) | GB1052449A (de) |
NL (1) | NL299250A (de) |
SE (1) | SE311196B (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4620215A (en) * | 1982-04-16 | 1986-10-28 | Amdahl Corporation | Integrated circuit packaging systems with double surface heat dissipation |
-
0
- NL NL299250D patent/NL299250A/xx unknown
- GB GB1052449D patent/GB1052449A/en active Active
-
1962
- 1962-10-15 SE SE1099862A patent/SE311196B/xx unknown
-
1963
- 1963-09-28 DE DE19631464425 patent/DE1464425A1/de active Pending
- 1963-10-03 CH CH1224863A patent/CH427039A/de unknown
Also Published As
Publication number | Publication date |
---|---|
SE311196B (de) | 1969-06-02 |
GB1052449A (de) | |
NL299250A (de) | |
DE1464425A1 (de) | 1968-10-24 |
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