CH406443A - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
CH406443A
CH406443A CH1293462A CH1293462A CH406443A CH 406443 A CH406443 A CH 406443A CH 1293462 A CH1293462 A CH 1293462A CH 1293462 A CH1293462 A CH 1293462A CH 406443 A CH406443 A CH 406443A
Authority
CH
Switzerland
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
CH1293462A
Other languages
English (en)
Inventor
Emeis Reimer Dr Dipl-Phys
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH406443A publication Critical patent/CH406443A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
CH1293462A 1961-12-30 1962-11-06 Halbleiteranordnung CH406443A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1961S0077373 DE1236660C2 (de) 1961-12-30 1961-12-30 Halbleiteranordnung mit einem plattenfoermigen, im wesentlichen einkristallinen halbleiterkoerper

Publications (1)

Publication Number Publication Date
CH406443A true CH406443A (de) 1966-01-31

Family

ID=7506765

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1293462A CH406443A (de) 1961-12-30 1962-11-06 Halbleiteranordnung

Country Status (6)

Country Link
US (1) US3293509A (de)
BE (1) BE626623A (de)
CH (1) CH406443A (de)
DE (1) DE1236660C2 (de)
GB (1) GB977284A (de)
NL (1) NL286498A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2015247A1 (de) * 1969-03-31 1970-10-08

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3378735A (en) * 1963-06-12 1968-04-16 Siemens Ag Semiconductor device housing with spring contact means and improved thermal characteristics
US3460002A (en) * 1965-09-29 1969-08-05 Microwave Ass Semiconductor diode construction and mounting
CH438497A (de) * 1966-03-11 1967-06-30 Bbc Brown Boveri & Cie Halbleiteranordnung
US3476986A (en) * 1966-09-17 1969-11-04 Nippon Electric Co Pressure contact semiconductor devices
GB1297046A (de) * 1969-08-25 1972-11-22
US4769744A (en) * 1983-08-04 1988-09-06 General Electric Company Semiconductor chip packages having solder layers of enhanced durability
DE3421672A1 (de) * 1984-06-09 1985-12-12 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Wechsellastbestaendiges, schaltbares halbleiterbauelement
GB2215125B (en) * 1988-02-22 1991-04-24 Mitsubishi Electric Corp Semiconductor device
US5245248A (en) * 1991-04-09 1993-09-14 Northeastern University Micro-emitter-based low-contact-force interconnection device
US5220725A (en) * 1991-04-09 1993-06-22 Northeastern University Micro-emitter-based low-contact-force interconnection device
US5660570A (en) * 1991-04-09 1997-08-26 Northeastern University Micro emitter based low contact force interconnection device
EP2089901A4 (de) 2006-11-09 2011-05-18 Interplex Qlp Inc Mikroschaltungsgehäuse mit duktiler schicht
CN104647824A (zh) * 2015-03-09 2015-05-27 上海松发合金材料有限公司 一种集成吊顶金属扣板材料

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2889498A (en) * 1955-11-08 1959-06-02 Westinghouse Electric Corp Semiconductor rectifier assembly
US2956214A (en) * 1955-11-30 1960-10-11 Bogue Elec Mfg Co Diode
DE1098103B (de) * 1959-01-14 1961-01-26 Standard Elektrik Lorenz Ag Verfahren zum Einbau eines elektrischen Halbleiterelementes in ein Gehaeuse

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2015247A1 (de) * 1969-03-31 1970-10-08

Also Published As

Publication number Publication date
DE1236660C2 (de) 1975-05-22
NL286498A (de) 1900-01-01
US3293509A (en) 1966-12-20
BE626623A (de) 1900-01-01
GB977284A (en) 1964-12-02
DE1236660B (de) 1975-05-22

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