CN1819208A - 半导体存储装置 - Google Patents

半导体存储装置 Download PDF

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Publication number
CN1819208A
CN1819208A CNA2005101378579A CN200510137857A CN1819208A CN 1819208 A CN1819208 A CN 1819208A CN A2005101378579 A CNA2005101378579 A CN A2005101378579A CN 200510137857 A CN200510137857 A CN 200510137857A CN 1819208 A CN1819208 A CN 1819208A
Authority
CN
China
Prior art keywords
upper electrode
recess
capacitor
film
dram unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005101378579A
Other languages
English (en)
Chinese (zh)
Inventor
佐藤英则
能宗弘安
藤石义隆
关川宏昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Publication of CN1819208A publication Critical patent/CN1819208A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/01—Manufacture or treatment
    • H10D1/045—Manufacture or treatment of capacitors having potential barriers, e.g. varactors
    • H10D1/047—Manufacture or treatment of capacitors having potential barriers, e.g. varactors of conductor-insulator-semiconductor capacitors, e.g. trench capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
    • H10B12/0387—Making the trench

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Memories (AREA)
CNA2005101378579A 2004-12-28 2005-12-28 半导体存储装置 Pending CN1819208A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004379735 2004-12-28
JP2004379735A JP4781673B2 (ja) 2004-12-28 2004-12-28 半導体記憶装置

Publications (1)

Publication Number Publication Date
CN1819208A true CN1819208A (zh) 2006-08-16

Family

ID=36610422

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005101378579A Pending CN1819208A (zh) 2004-12-28 2005-12-28 半导体存储装置

Country Status (3)

Country Link
US (1) US8106437B2 (enExample)
JP (1) JP4781673B2 (enExample)
CN (1) CN1819208A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101752381B (zh) * 2008-12-10 2013-07-24 上海华虹Nec电子有限公司 Otp器件结构及其制备方法
CN115811881A (zh) * 2021-09-13 2023-03-17 长鑫存储技术有限公司 半导体结构的制造方法和半导体结构

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008042195A (ja) * 2006-08-02 2008-02-21 Qimonda Ag 書換え可能な不揮発性メモリセル
DE102006036098A1 (de) * 2006-08-02 2008-02-07 Infineon Technologies Ag Wiederprogrammierbare nichtflüchtige Speicherzelle
TWI418018B (zh) * 2009-11-03 2013-12-01 Taiwan Memory Corp 電子裝置及其製造方法、記憶體裝置
JP5758729B2 (ja) * 2011-07-27 2015-08-05 ローム株式会社 半導体装置
JP2015228418A (ja) * 2014-05-30 2015-12-17 ルネサスエレクトロニクス株式会社 半導体集積回路装置およびその製造方法
US10211347B2 (en) * 2017-06-23 2019-02-19 Qualcomm Incorporated Transcap device architecture with reduced control voltage and improved quality factor

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5237528A (en) * 1982-11-04 1993-08-17 Hitachi, Ltd. Semiconductor memory
US4939104A (en) * 1984-10-31 1990-07-03 Texas Instruments, Incorporated Method for forming a buried lateral contact
JPS63258060A (ja) * 1987-04-15 1988-10-25 Nec Corp 半導体記憶装置
US4958318A (en) * 1988-07-08 1990-09-18 Eliyahou Harari Sidewall capacitor DRAM cell
US6468855B2 (en) * 1998-08-14 2002-10-22 Monolithic System Technology, Inc. Reduced topography DRAM cell fabricated using a modified logic process and method for operating same
US6573548B2 (en) 1998-08-14 2003-06-03 Monolithic System Technology, Inc. DRAM cell having a capacitor structure fabricated partially in a cavity and method for operating same
TWI268601B (en) * 2002-02-14 2006-12-11 Matsushita Electric Industrial Co Ltd Semiconductor device and its manufacturing method increasing the active area of capacitor without increasing the substrate area
US6897508B2 (en) * 2002-05-01 2005-05-24 Sundew Technologies, Llc Integrated capacitor with enhanced capacitance density and method of fabricating same
JP4451594B2 (ja) * 2002-12-19 2010-04-14 株式会社ルネサステクノロジ 半導体集積回路装置及びその製造方法
JP2004311853A (ja) * 2003-04-10 2004-11-04 Matsushita Electric Ind Co Ltd 半導体装置とその製造方法
TWI223413B (en) * 2003-11-11 2004-11-01 United Microelectronics Corp SRAM cell structure and manufacturing method thereof
US7019348B2 (en) * 2004-02-26 2006-03-28 Taiwan Semiconductor Manufacturing Co., Ltd. Embedded semiconductor product with dual depth isolation regions
JP2006049413A (ja) * 2004-08-02 2006-02-16 Fujitsu Ltd 半導体装置及びその製造方法
JP4476068B2 (ja) * 2004-08-02 2010-06-09 株式会社椿本チエイン ベアリングローラチェーン

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101752381B (zh) * 2008-12-10 2013-07-24 上海华虹Nec电子有限公司 Otp器件结构及其制备方法
CN115811881A (zh) * 2021-09-13 2023-03-17 长鑫存储技术有限公司 半导体结构的制造方法和半导体结构

Also Published As

Publication number Publication date
US20060138512A1 (en) 2006-06-29
JP2006186185A (ja) 2006-07-13
US8106437B2 (en) 2012-01-31
JP4781673B2 (ja) 2011-09-28

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