CN1805652B - 软性印刷电路板和多层软性印刷电路板及便携式电话终端 - Google Patents
软性印刷电路板和多层软性印刷电路板及便携式电话终端 Download PDFInfo
- Publication number
- CN1805652B CN1805652B CN200610000573XA CN200610000573A CN1805652B CN 1805652 B CN1805652 B CN 1805652B CN 200610000573X A CN200610000573X A CN 200610000573XA CN 200610000573 A CN200610000573 A CN 200610000573A CN 1805652 B CN1805652 B CN 1805652B
- Authority
- CN
- China
- Prior art keywords
- layer
- printed wiring
- flexible printed
- wiring board
- electric insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005004383 | 2005-01-11 | ||
JP2005-004383 | 2005-01-11 | ||
JP2005004383A JP4162659B2 (ja) | 2005-01-11 | 2005-01-11 | フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1805652A CN1805652A (zh) | 2006-07-19 |
CN1805652B true CN1805652B (zh) | 2012-04-25 |
Family
ID=36802402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610000573XA Active CN1805652B (zh) | 2005-01-11 | 2006-01-11 | 软性印刷电路板和多层软性印刷电路板及便携式电话终端 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4162659B2 (ja) |
KR (1) | KR100750019B1 (ja) |
CN (1) | CN1805652B (ja) |
TW (1) | TWI306726B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI607677B (zh) * | 2016-11-21 | 2017-12-01 | 同泰電子科技股份有限公司 | 可撓性線路板結構 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008010544A1 (fr) | 2006-07-19 | 2008-01-24 | B-Core Inc. | Symbole optique, article auquel est fixé un symbole optique, procédé pour fixer un symbole optique à un article, et procédé de reconnaissance d'un code par reconnaissance optique |
JP2008041960A (ja) * | 2006-08-07 | 2008-02-21 | Nissan Chem Ind Ltd | 電子回路部品の製造方法 |
JP4845705B2 (ja) * | 2006-12-19 | 2011-12-28 | 日東電工株式会社 | プリント配線基板、その製造方法および電子機器 |
CN101617575B (zh) * | 2007-02-20 | 2011-06-22 | 日立化成工业株式会社 | 挠性多层配线板 |
JP2008282352A (ja) | 2007-05-14 | 2008-11-20 | B-Core Inc | 遮蔽によるマーキング方法及び除去によるマーキング方法及び変色によるマーキング方法 |
US8383230B2 (en) | 2007-05-24 | 2013-02-26 | Arisawa Mfg. Co., Ltd. | Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board |
CN101801156B (zh) * | 2009-02-06 | 2013-02-27 | 周伯如 | 软性印刷电路板的制造方法及其结构 |
CN102186304A (zh) * | 2011-03-15 | 2011-09-14 | 珠海元盛电子科技股份有限公司 | 用于翻盖/滑盖手机的分层fpc及制作方法 |
CN102529271B (zh) * | 2011-12-23 | 2014-12-24 | 云南云天化股份有限公司 | 用于柔性电路板的聚酰亚胺薄膜及其制备方法 |
DE102013202037A1 (de) * | 2013-02-07 | 2014-08-07 | Olympus Winter & Ibe Gmbh | Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument |
KR20140148111A (ko) * | 2013-06-21 | 2014-12-31 | 삼성전기주식회사 | 경연성 인쇄회로기판 및 그 제조방법 |
WO2015116076A1 (en) * | 2014-01-30 | 2015-08-06 | Hewlett-Packard Development Company, Lp | Printed circuit board fluid ejection apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5516989A (en) * | 1994-05-16 | 1996-05-14 | Nippon Mektron, Ltd. | Structure of the flexing section of a multilayer flexible circuit board |
CN1421729A (zh) * | 2001-11-23 | 2003-06-04 | 三星电子株式会社 | 液晶显示模块 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002261450A (ja) | 2001-02-28 | 2002-09-13 | Shin Etsu Chem Co Ltd | 多層フレキシブル印刷配線板 |
KR101018944B1 (ko) | 2003-03-04 | 2011-03-02 | 니폰 제온 가부시키가이샤 | 다층 프린트 배선판의 제조방법 및 다층 프린트 배선판 |
KR100477378B1 (ko) * | 2003-03-21 | 2005-03-18 | 주식회사 에스아이 플렉스 | 다층 연성 인쇄회로기판의 제조방법 |
-
2005
- 2005-01-11 JP JP2005004383A patent/JP4162659B2/ja active Active
- 2005-12-15 TW TW094144455A patent/TWI306726B/zh active
-
2006
- 2006-01-10 KR KR1020060002492A patent/KR100750019B1/ko active IP Right Grant
- 2006-01-11 CN CN200610000573XA patent/CN1805652B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5516989A (en) * | 1994-05-16 | 1996-05-14 | Nippon Mektron, Ltd. | Structure of the flexing section of a multilayer flexible circuit board |
CN1421729A (zh) * | 2001-11-23 | 2003-06-04 | 三星电子株式会社 | 液晶显示模块 |
Non-Patent Citations (2)
Title |
---|
JP特开2003-133734A 2003.05.09 |
JP特开平10-67027A 1998.03.10 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI607677B (zh) * | 2016-11-21 | 2017-12-01 | 同泰電子科技股份有限公司 | 可撓性線路板結構 |
US10104778B2 (en) | 2016-11-21 | 2018-10-16 | Uniflex Technology Inc. | Flexible printed circuit board structure |
Also Published As
Publication number | Publication date |
---|---|
JP4162659B2 (ja) | 2008-10-08 |
KR100750019B1 (ko) | 2007-08-16 |
KR20060082043A (ko) | 2006-07-14 |
CN1805652A (zh) | 2006-07-19 |
JP2006196548A (ja) | 2006-07-27 |
TWI306726B (en) | 2009-02-21 |
TW200638813A (en) | 2006-11-01 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant |