CN1761915A - 用于将厚膜成像的光致抗蚀剂组合物 - Google Patents
用于将厚膜成像的光致抗蚀剂组合物 Download PDFInfo
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- CN1761915A CN1761915A CNA2004800076471A CN200480007647A CN1761915A CN 1761915 A CN1761915 A CN 1761915A CN A2004800076471 A CNA2004800076471 A CN A2004800076471A CN 200480007647 A CN200480007647 A CN 200480007647A CN 1761915 A CN1761915 A CN 1761915A
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- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- WXNRYSGJLQFHBR-UHFFFAOYSA-N bis(2,4-dihydroxyphenyl)methanone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O WXNRYSGJLQFHBR-UHFFFAOYSA-N 0.000 description 1
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- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- LOUPRKONTZGTKE-UHFFFAOYSA-N cinchonine Natural products C1C(C(C2)C=C)CCN2C1C(O)C1=CC=NC2=CC=C(OC)C=C21 LOUPRKONTZGTKE-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
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- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical compound C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 1
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- HLJDCFJLAODBJA-UHFFFAOYSA-N phenyl 2,3,4-trihydroxybenzoate Chemical compound OC1=C(O)C(O)=CC=C1C(=O)OC1=CC=CC=C1 HLJDCFJLAODBJA-UHFFFAOYSA-N 0.000 description 1
- HBZMQFJTPHSKNH-UHFFFAOYSA-N phenyl 3,4,5-trihydroxybenzoate Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C=CC=CC=2)=C1 HBZMQFJTPHSKNH-UHFFFAOYSA-N 0.000 description 1
- ROMWNDGABOQKIW-UHFFFAOYSA-N phenyliodanuidylbenzene Chemical compound C=1C=CC=CC=1[I-]C1=CC=CC=C1 ROMWNDGABOQKIW-UHFFFAOYSA-N 0.000 description 1
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- 150000004961 triphenylmethanes Chemical class 0.000 description 1
- FAYMLNNRGCYLSR-UHFFFAOYSA-M triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/016—Diazonium salts or compounds
- G03F7/0166—Diazonium salts or compounds characterised by the non-macromolecular additives
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims (11)
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US10/393,925 US6852465B2 (en) | 2003-03-21 | 2003-03-21 | Photoresist composition for imaging thick films |
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CN (1) | CN100585492C (zh) |
MY (1) | MY127374A (zh) |
TW (1) | TWI341439B (zh) |
WO (1) | WO2004083962A2 (zh) |
Cited By (2)
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CN113736466A (zh) * | 2020-05-29 | 2021-12-03 | 新应材股份有限公司 | 蚀刻剂组合物、增粘剂、碱溶液、移除聚酰亚胺的方法以及蚀刻工艺 |
US11851597B2 (en) | 2020-05-29 | 2023-12-26 | Echem Solutions Corp. | Etchant composition, tackifier, alkaline solution, method of removing polyimide and etching process |
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US6852465B2 (en) * | 2003-03-21 | 2005-02-08 | Clariant International Ltd. | Photoresist composition for imaging thick films |
US20050074552A1 (en) * | 2003-10-07 | 2005-04-07 | Howard Ge | Photoresist coating process for microlithography |
TWI241001B (en) * | 2004-03-26 | 2005-10-01 | Advanced Semiconductor Eng | Method of improving adhesive characteristic between photoresist layer and substrate, and bumping process |
JP4586703B2 (ja) * | 2004-10-14 | 2010-11-24 | 住友化学株式会社 | 感放射線性樹脂組成物 |
JP4655864B2 (ja) * | 2004-10-14 | 2011-03-23 | 住友化学株式会社 | 感放射線性樹脂組成物 |
US7524606B2 (en) * | 2005-04-11 | 2009-04-28 | Az Electronic Materials Usa Corp. | Nanocomposite photoresist composition for imaging thick films |
US7247419B2 (en) * | 2005-04-11 | 2007-07-24 | Az Electronic Materials Usa Corp. | Nanocomposite photosensitive composition and use thereof |
US7255970B2 (en) * | 2005-07-12 | 2007-08-14 | Az Electronic Materials Usa Corp. | Photoresist composition for imaging thick films |
KR100896149B1 (ko) * | 2006-03-31 | 2009-05-11 | 주식회사 에이디피엔지니어링 | 배기 및 충진 장치 |
JP5631732B2 (ja) * | 2007-03-23 | 2014-11-26 | カウンスィル オブ サイエンティフィック アンド インダストリアル リサーチCouncil Of Scientific & Industrial Research | フォトリソグラフィクサブミクロンパターン化に有効な新規なジアゾナフトキノンスルホニク酸ビスフェノール誘導体、及びその作成方法 |
US20100151118A1 (en) * | 2008-12-17 | 2010-06-17 | Eastman Chemical Company | Carrier solvent compositions, coatings compositions, and methods to produce thick polymer coatings |
JP5814103B2 (ja) * | 2011-12-16 | 2015-11-17 | 東京応化工業株式会社 | 厚膜ホトレジストパターンの製造方法 |
US11385543B2 (en) | 2016-08-09 | 2022-07-12 | Merck Patent Gmbh | Enviromentally stable, thick film, chemically amplified resist |
CN108777769B (zh) * | 2018-05-31 | 2020-02-18 | 歌尔股份有限公司 | 相机曝光时间调整方法、装置及设备 |
CN118284852A (zh) | 2021-11-17 | 2024-07-02 | 默克专利股份有限公司 | 通过湿式化学蚀刻以改善金属结构制造的组合物和方法 |
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DE938233C (de) | 1953-03-11 | 1956-01-26 | Kalle & Co Ag | Lichtempfindliches Material fuer die photomechanische Herstellung von Druckformen |
NL95406C (zh) | 1954-08-20 | |||
NL247405A (zh) | 1959-01-15 | |||
NL131386C (zh) | 1959-08-29 | |||
US3201329A (en) | 1963-06-10 | 1965-08-17 | Burt And Redman | Carbonizing process and apparatus |
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-
2003
- 2003-03-21 US US10/393,925 patent/US6852465B2/en not_active Expired - Lifetime
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2004
- 2004-03-09 WO PCT/EP2004/002391 patent/WO2004083962A2/en active Application Filing
- 2004-03-09 CN CN200480007647A patent/CN100585492C/zh not_active Expired - Lifetime
- 2004-03-09 JP JP2006504597A patent/JP4756146B2/ja not_active Expired - Lifetime
- 2004-03-09 EP EP04718629A patent/EP1609025A2/en not_active Withdrawn
- 2004-03-18 TW TW093107298A patent/TWI341439B/zh not_active IP Right Cessation
- 2004-03-19 MY MYPI20040976A patent/MY127374A/en unknown
-
2005
- 2005-09-21 KR KR1020057017663A patent/KR101069784B1/ko active IP Right Grant
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2009
- 2009-12-11 JP JP2009281174A patent/JP5320631B2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113736466A (zh) * | 2020-05-29 | 2021-12-03 | 新应材股份有限公司 | 蚀刻剂组合物、增粘剂、碱溶液、移除聚酰亚胺的方法以及蚀刻工艺 |
US11851597B2 (en) | 2020-05-29 | 2023-12-26 | Echem Solutions Corp. | Etchant composition, tackifier, alkaline solution, method of removing polyimide and etching process |
Also Published As
Publication number | Publication date |
---|---|
WO2004083962A2 (en) | 2004-09-30 |
JP2006520922A (ja) | 2006-09-14 |
TWI341439B (en) | 2011-05-01 |
TW200428139A (en) | 2004-12-16 |
MY127374A (en) | 2006-11-30 |
JP5320631B2 (ja) | 2013-10-23 |
WO2004083962A3 (en) | 2004-12-02 |
JP4756146B2 (ja) | 2011-08-24 |
US6852465B2 (en) | 2005-02-08 |
KR101069784B1 (ko) | 2011-10-05 |
KR20050114668A (ko) | 2005-12-06 |
EP1609025A2 (en) | 2005-12-28 |
CN100585492C (zh) | 2010-01-27 |
JP2010102348A (ja) | 2010-05-06 |
US20040185368A1 (en) | 2004-09-23 |
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