CN1743245A - 基板装载箱体 - Google Patents
基板装载箱体 Download PDFInfo
- Publication number
- CN1743245A CN1743245A CNA2005100597808A CN200510059780A CN1743245A CN 1743245 A CN1743245 A CN 1743245A CN A2005100597808 A CNA2005100597808 A CN A2005100597808A CN 200510059780 A CN200510059780 A CN 200510059780A CN 1743245 A CN1743245 A CN 1743245A
- Authority
- CN
- China
- Prior art keywords
- substrate
- brace table
- framework
- supporting pin
- lower frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Pallets (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040068430 | 2004-08-30 | ||
KR1020040068430A KR100575160B1 (ko) | 2004-08-30 | 2004-08-30 | 기판 적재용 카세트 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1743245A true CN1743245A (zh) | 2006-03-08 |
Family
ID=36109566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2005100597808A Pending CN1743245A (zh) | 2004-08-30 | 2005-03-31 | 基板装载箱体 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006062747A (ko) |
KR (1) | KR100575160B1 (ko) |
CN (1) | CN1743245A (ko) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100388074C (zh) * | 2006-06-07 | 2008-05-14 | 友达光电股份有限公司 | 基板装载装置 |
CN105353541A (zh) * | 2015-10-16 | 2016-02-24 | 苏州尚牙电子有限公司 | 支撑杆和具备支撑杆的基板装载盒 |
CN105353542A (zh) * | 2015-10-16 | 2016-02-24 | 苏州尚牙电子有限公司 | 一种支撑杆和具备支撑杆的基板装载盒 |
CN108120388A (zh) * | 2016-11-30 | 2018-06-05 | 株式会社大福 | 检查装置 |
CN109693860A (zh) * | 2017-10-23 | 2019-04-30 | 合肥欣奕华智能机器有限公司 | 一种基板缓存装置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008041711A1 (fr) * | 2006-10-03 | 2008-04-10 | Asahi Glass Company, Limited | Boîte de transfert d'élément d'affichage |
JP5731808B2 (ja) * | 2010-12-06 | 2015-06-10 | 光洋サーモシステム株式会社 | ワーク積載装置 |
KR101045288B1 (ko) * | 2010-12-24 | 2011-07-01 | 음노선 | 유리 적재 장치 |
CN103403856B (zh) * | 2011-02-01 | 2016-04-13 | 泰拉半导体株式会社 | 基板支撑用的晶舟以及使用该晶舟的支撑单元 |
KR101306757B1 (ko) * | 2011-05-02 | 2013-09-10 | 주식회사 테라세미콘 | 기판 지지용 지지 유닛 및 이를 사용한 기판 처리 장치 |
KR101306751B1 (ko) * | 2011-04-29 | 2013-09-10 | 주식회사 테라세미콘 | 기판 지지용 홀더 및 이를 사용한 기판 처리 장치 |
KR101310096B1 (ko) * | 2011-04-29 | 2013-09-23 | 참엔지니어링(주) | 기판용 지지 유닛 및 이를 이용한 기판 처리 장치 |
TWM413959U (en) * | 2011-05-20 | 2011-10-11 | Forever Group Prec Ind Co Ltd | Fast Assembling protection Holder |
KR101297686B1 (ko) * | 2011-10-07 | 2013-08-21 | 주식회사 테라세미콘 | 기판 처리 장치 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3977491B2 (ja) | 1997-07-16 | 2007-09-19 | 淀川ヒューテック株式会社 | 基板用カセット |
JP2002154648A (ja) | 2000-11-15 | 2002-05-28 | Fuji Photo Film Co Ltd | 基板カセット |
KR100458054B1 (ko) | 2004-01-26 | 2004-11-20 | (주)애드컴텍 | 기판 적재용 카세트 |
KR100585023B1 (ko) * | 2004-03-24 | 2006-05-30 | 주식회사 에이디피엔지니어링 | 기판 수납 장치 |
-
2004
- 2004-08-30 KR KR1020040068430A patent/KR100575160B1/ko not_active IP Right Cessation
-
2005
- 2005-01-19 JP JP2005012013A patent/JP2006062747A/ja active Pending
- 2005-03-31 CN CNA2005100597808A patent/CN1743245A/zh active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100388074C (zh) * | 2006-06-07 | 2008-05-14 | 友达光电股份有限公司 | 基板装载装置 |
CN105353541A (zh) * | 2015-10-16 | 2016-02-24 | 苏州尚牙电子有限公司 | 支撑杆和具备支撑杆的基板装载盒 |
CN105353542A (zh) * | 2015-10-16 | 2016-02-24 | 苏州尚牙电子有限公司 | 一种支撑杆和具备支撑杆的基板装载盒 |
CN108120388A (zh) * | 2016-11-30 | 2018-06-05 | 株式会社大福 | 检查装置 |
CN113758436A (zh) * | 2016-11-30 | 2021-12-07 | 株式会社大福 | 检查装置 |
CN108120388B (zh) * | 2016-11-30 | 2022-01-14 | 株式会社大福 | 检查装置 |
CN109693860A (zh) * | 2017-10-23 | 2019-04-30 | 合肥欣奕华智能机器有限公司 | 一种基板缓存装置 |
CN109693860B (zh) * | 2017-10-23 | 2020-12-22 | 合肥欣奕华智能机器有限公司 | 一种基板缓存装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2006062747A (ja) | 2006-03-09 |
KR20060019777A (ko) | 2006-03-06 |
KR100575160B1 (ko) | 2006-04-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |