CN1726136A - 制造局部金属化薄膜元件的方法 - Google Patents
制造局部金属化薄膜元件的方法 Download PDFInfo
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- CN1726136A CN1726136A CNA2003801063900A CN200380106390A CN1726136A CN 1726136 A CN1726136 A CN 1726136A CN A2003801063900 A CNA2003801063900 A CN A2003801063900A CN 200380106390 A CN200380106390 A CN 200380106390A CN 1726136 A CN1726136 A CN 1726136A
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Abstract
本发明涉及一种用于制造局部金属化薄膜元件的方法和装置,还涉及由所述方法制造的局部金属化薄膜元件。根据的本发明包括:生成一个数字化记录(332),该数字化记录定义了一个根据所述数字化记录计算出的局部金属化的图形形状,设定了工具(38)的移动以及用于控制所述工具(38)的控制数据,在工具移动路径上使工具(38)以及一个单层或多层的薄膜体(30)相对于彼此移动,并且借助于工具(38)对金属层(31)进行局部脱金属化处理,尤其是通过使用蚀刻树脂的蚀刻剂(52)并对金属层(31)进行腐蚀来进行脱金属化处理,所述脱金属化处理由控制数据来控制。
Description
本发明涉及一种用于制造局部金属化薄膜元件的方法和装置,尤其是用于制造冲压薄膜、层压薄膜或光学可变的安全元件,还涉及一种局部金属化薄膜元件,尤其是冲压薄膜、层压薄膜或光学可变的安全元件。
WO99/13157描述了一种用于有价证券和债券的局部金属化的安全薄膜,以及制造这种薄膜的方法。这种用于集成到或敷设到有价证券和债券上的安全薄膜包括一个半透明的载体膜和一个敷设到其上、并具有无金属的区域的金属涂层。为了制造这种局部金属化薄膜,通过凹雕工艺,用具有高比例色素的印墨来局部印制一个载体膜,然后使印墨干燥以形成多孔的、凸起的印墨敷设层。然后在以上述方式印刷敷设的载体膜上形成一个薄的金属覆盖层。然后,通过用一种液体来清洗,并且可以结合一种机械操作,从而去除位于印墨敷设层上方或者渗透到其中的覆盖层。然后载体膜被干燥并可以按尺寸来切割。因此,在最初未提供印墨的区域内,金属覆盖层保留在载体膜上,其厚度可能在0.01μm至1μm之间。
WO02/31214公开了另一种制造局部金属化薄膜的可能的方法。在该方法中,首先对载体材料进行清洁并使其形成晶核。该处理步骤是对局部构造的金属层与载体材料之间的良好粘附预先提供额外补偿。
在敷设实际的功能层之前,通过凹雕印刷工艺来敷设一种可溶于任何溶剂,例如水、酒精、酮或酯的印墨。然后执行清洁和成核步骤。
通过内嵌(INLINE)等离子体或克罗纳(corona)工艺来处理印刷后的基片。该处理规定薄膜表面是游离于印墨、并且在生成最终极性组的同时被激活的着色残余。此外,在真空中进行等离子体初步处理的同时,还通过溅镀或蒸镀敷设一个薄的金属层或金属氧化物层,作为接合介质。为此目的尤其适用Cr、Al、Ag、Ni、Ti、TiO2、SiOx以及CrOx。
然后敷设一个Cu层,以在载体膜上形成图样层。随后通过机械清洗操作去除印墨,以获得所希望的构造。接着对该图样层进行电镀后续增强处理。
现在本发明的目的在于提供一种局部金属化薄膜元件,它可以被特别廉价地制造,尤其是提供一种局部金属化的冲压薄膜或层压薄膜。
该目标通过下述用于制造局部金属化薄膜元件的方法来实现,其中生成一个定义了局部金属化的图形形状的数字数据集,根据该数字数据集计算出一个工具路径和用于驱动工具的控制数据,所述工具以及单层或多层薄膜体根据所述工具路径相对于彼此移动,并且由控制数据所控制的工具形成了金属层的局部脱金属化,尤其是通过使用腐蚀剂或抗蚀剂、或者通过腐蚀掉金属层来实现脱金属化。该目标还通过一种根剧上述方法制造的局部金属化薄膜元件、尤其是冲压薄膜或层压薄膜来实现。该目标还进一步通过下述用于制造局部金属化薄膜元件的装置来实现,该装置具有一个控制装置、一个或多个引导装置、以及至少一个工具,其中所述控制装置根据一个定义了局部金属化的图形形状的数字数据集计算出一个工具路径和用于驱动工具的控制数据,所述引导装置使所述工具以及单层或多层薄膜体根据所述工具路径相对于彼此移动,并且由控制数据所控制的工具形成了金属层的局部脱金属化,尤其是通过使用腐蚀剂或抗蚀剂、或者通过腐蚀掉金属层来实现脱金属化。
在此,本发明不仅可以用于制造冲压薄膜或层压薄膜,而且可以用于制造具有局部成形的金属层的任意种类的装饰薄膜或功能薄膜。该方面的一个例子是内模(inmold)薄膜,它被用来通过内模工艺装饰三维的物体。
本发明还可以用于制造光学可变的安全元件,它可以通过移膜工艺应用于安全产品,例如钞票、信用卡、现金卡或文件。也可以将光学可变的元件作为保密或授权身份认证敷设到物体,例如CD或包装上。
本发明实现了能够基本上自动化进行的局部金属化薄膜元件生产的优点,从而一方面提高了生产过程的速度,另一方面降低了生产过程的成本。
除此之外,还可以免于使用昂贵的工具,例如凹版印刷筛鼓。可以更灵活地对生产中的变化做出反应,从而进一步降低生产过程的成本。在安全应用的领域中还得到了其他的优点。制造凹版印刷筛鼓需要专门的供应商。
另外的优点在于可以通过改变数字数据集以简单的方式对薄膜元件进行个性化生产。这在小规模生产中、并且对于图像可变和数据可变的信息提供了特别的优点。当不需要重复生产时进一步节省了成本,并且省去了初步印刷阶段的加工操作。
本发明具有优点的设计在所附的权利要求中说明。
有利的是首先为一个薄膜基体提供一个金属层,然后在数字化控制下利用工具将腐蚀剂敷设到金属层上,以对金属层进行局部脱金属化。在局部脱金属化之后将腐蚀剂去除。作为替代,可以为薄膜基体提供一个金属层,然后在数字化控制下利用工具将抗蚀剂敷设到金属层上,以局部覆盖金属层。然后通过脱金属化将未被覆盖的金属层去除。还可以在数字化控制下利用工具将清洗掩模敷设到薄膜体上,以局部覆盖薄膜体,然后为薄膜体设置一个金属层。然后通过在清洗掩模的区域内进行清洗操作来局部去除金属层。
上述实施方式具有很高的加工速度。除了需要执行的工艺步骤外,还可以将这些工艺步骤简单地集成到用于局部金属化薄膜元件的已有生产工艺中,或者与这些工艺相结合。此外,根据所涉及的相应技术问题还可以具有进一步的成本优势。
有利的是还可以为薄膜基体提供一个金属层,然后通过电火花腐蚀用工具去除金属层。
这种操作过程具有成本优势,因为可以免于使用腐蚀剂、抗蚀剂等。另外减少了所需操作步骤的数目,从而缩短了薄膜元件的生产时间。
已经证明特别具有优点的是,用碳针作为工具按照工具路径在单层或多层薄膜体上方移动,并根据控制数据在碳针和接地元件之间形成一个电势差,以局部腐蚀掉金属层。这里为了实现特别好的结果,以3到4V之间的电势差对含有铝的金属层进行腐蚀,以及用约为6V的电势差来腐蚀含有铬的金属层,得到特别好的效果。
当计算工具路径和/或控制数据时考虑到碳针和接地元件的设置,可以进一步得到特别好的加工结果。
还已经证明,通过激光束作为工具来局部侵蚀金属层也是有利的。
在此,工具可以通过一个辊子将腐蚀剂、抗蚀剂或清洗掩模敷设到薄膜体上。工具也可以通过将腐蚀剂、抗蚀剂或清洗掩模喷涂到薄膜体上从而将其敷设到薄膜体上。
已经发现根据本发明的工艺特别适用于制造厚度小于1μm的局部金属层。
将金属层敷设到薄膜体的整个表面区域上是具有优点的,可以采用特别简单和廉价的方法,如蒸镀金属层。但是将金属层局部敷设到部分表面区域上(例如用金属色素印刷到其上)在特定应用条件下也是具有优点的。因此可以仅在这样的区域内提供金属层:即在该区域内敷设的金属实际上随后也将基本被保留。在某些情况下,通过这种局部敷设的金属层,可以进一步加快处理时间,并能够节省相当多的腐蚀剂、抗蚀剂或类似物。
利用本发明所述方法进行数字化脱金属处理的金属层不仅包括金属和金属合金,还包括任意的其他高反射率材料。因此,根据本发明,“金属层”这一术语应解释为包含高反射率材料的层。
下面借助于参照附图的多个实施例,以示例的方式来描述本发明,图中:
图1示出了穿过根据本发明的局部金属化薄膜元件的横截面示意图,
图2示出了根据本发明的第一个实施例的制造方法的示意图,
图3示出了根据本发明的用于制造局部金属化薄膜元件的装置的电路框图,
图4a至4d示出了穿过根据本发明的第二个实施例的薄膜元件的横截面示意图,以说明本发明的制造方法,
图5示出了根据本发明的第二个实施例的制造方法的示意图,
图6a至6c示出了穿过根据本发明的第三个实施例的薄膜元件的横截面示意图,以说明本发明的制造方法,
图7示出了根据本发明的第三个实施例的制造方法的示意图,
图8a至8c穿过根据本发明的第四个实施例的薄膜元件的横截面示意图,以说明本发明的制造方法,
图9示出了根据本发明的第四个实施例的制造方法的示意图。
图1示出了一个薄膜元件1,它包括一个载体层11,一个保护漆层和/或释放层12,一个复制层13,一个吸收层14,一个间隔层15,一个局部反射层16,一个粘合剂层17和一个粘接层18。
薄膜元件1是一个冲压薄膜,尤其是热冲压薄膜,借助于该冲压薄膜来敷设由层12至18所形成的装饰元件。载体层11例如包括PET。它用于将光学可变元件敷设到在生产过程中要保护目标对象上,并且在将光学可变元件敷设到要保护的目标对象上之后以适当的方式去除。
复制层13由一种热塑性材料构成。一个或多个衍射结构被嵌入到复制层13中,通过冲压工具置入到复制层的热塑性材料内。所述衍射结构最好是能够通过衍射效应产生全息图或类似图形的结构。但是作为对衍射结构的替代,也可以在层13中嵌入无光泽(matt)结构,宏观结构,无色对称(achromatic-symmetrical)结构,例如正弦光栅(sine gratings),无色非对称(achromatic-asymmetrical)结构,例如炫耀光栅结构(blaze structures)或活动图形(kineforms)。
层14、15和16形成了一个薄膜层序列,它通过干涉产生了与观察角度有关的颜色偏移。除了如图1所示可以由一个吸收层(透射率最好在30%到50%之间)、一个作为产生颜色改变的层(λ/4或λ/2层)的透明间隔层、以及一个反射层构成这种薄膜层序列之外,还可以由一系列高折射率和低折射率的层来构成这种薄膜层序列。在这种类型的层结构的情况下,不需要再使用吸收层。
反射层6由一个局部金属层构成。反射层16可包含下列金属之一或者下列金属的合金:Cr、Al、Ag、Ni、Cu和Ti。在这种情况下反射层16借助于图2至图9所示的工艺来制造。
这里也可以省去层12、13、14和15以及层17。薄膜元件1还可以是层压薄膜,具有粘接剂层,而不是载体层11、保护和/或释放层12。
图2示出了一种用于制造局部金属化薄膜元件的生产设备。该生产设备具有两个薄膜辊21和24、一个金属化站点22和一个脱金属化站点23。
金属化站点22为传送给它的薄膜体镀上一个薄金属层。在这种情况下,金属化站点22最好通过蒸镀在传送给它的薄膜体的整个表面区域上进行镀层。但金属化站点22也可以仅对该薄膜进行局部金属化处理,在这种工艺中例如借助于一个蒸镀掩模覆盖传送给它的薄膜体的部分区域。
以这种方式设置了薄金属层的薄膜体被传送到脱金属化站点23,脱金属化站点23以数字方式对金属层的局部区域进行脱金属化处理。在这种情况下脱金属化站点23按照图3所示的装置来设计。
图2所示的生产设备还可以包括其他的工作站点,例如用于形成图1所示的层12至15以及层17至18的站点。此外,生产过程也可以是不连续的过程,使得在一个或多个上述站点之间,薄膜被卷起并送入到中间贮藏库。
图3示出了用于制造局部金属化元件的装置,它包括一个控制装置33、一个电压源40、一个接地元件39、一个开关元件34、一个碳针38、一个辊子37以及两个引导装置35和36。
图3还示出了一个多层薄膜体30,它包括一个薄膜基体32和一个金属层31。所述薄膜基体32例如可以由图1中的层11至15构成。
控制装置33包括一个或多个微处理器、存储元件和外设单元、以及运行在上述硬件平台上的控制程序。在上述硬件平台上执行这些控制程序的过程中,实现了下述控制装置33的功能。
从功能性的观点来看,控制装置33包括一个数据存储器332、一个输入单元331、一个计算单元333和一个控制单元334。
存储在存储器单元332中的是一个数字数据集,它定义了局部金属化的图形形状。该数据集由输入单元331生成,并被存储到存储器单元332中。
输入单元331包括一个例如通过串行或并行总线或者通过计算机网络接收数据的接口设备。但输入单元331也可以包括一个图形用户界面,借助于这个图形用户界面可以由用户指定局部金属化的图形形状。
计算单元333根据存储在存储器单元332中的数字数据集计算出相关的工具路径和用于驱动工具的控制数据,所述控制数据用于按照局部金属化的图形形状引导工具,并根据所述图形形状由工具形成数字化的脱金属化处理。
控制单元334根据所计算出的数据以下列方式确定引导装置35和36:使得碳针38和薄膜体30按照工具路径彼此相对移动。此外,在移动的过程中,控制单元334根据所计算出的数据以下列方式控制开关元件34:使得碳针38按照局部金属化的图形形状通过对金属层31进行电火花腐蚀,对金属层31进行局部脱金属化处理。
开关元件34将控制单元331的控制信号转换为馈送给碳针38的电压脉冲,所述开关元件34例如包括适当的晶体管电路或继电器。
接地元件39用于在金属层31和电压源40之间形成电气接触。所述接地元件39例如包括一个或多个由导电材料制成的辊子,这些辊子被压到金属层31上。
引导装置35包括一个带有相关电子调节系统的伺服电机,所述伺服电机将碳针38相对于薄膜的纵向方向横向移动。引导装置36也包括一个带有相关电子调节系统的伺服电机,所述伺服电机用于移动辊子37,从而使薄膜体30在纵向方向上移动。
碳针38在金属层31上方以精确限定的间隔被引导。这里引导装置35也可以包括一个适当的调节装置,它连续地监控并调节所述间隔。
碳针38距离金属层31的间隔最好在0到200μm之间。
当金属层31含有铝时,电压源40的电压最好在3到4V之间。当金属层31含有铬时,电压源40的电压最好约为6V。
碳针38也可以由其他导电材料、例如银或铜制成的针来代替。
引导装置35不仅可以使碳针38在横向方向上移动,而且也可以在纵向方向上移动。在这种情况下,也可以省去引导装置36和辊子37。碳针38也可以由激光来代替,所述激光由开关元件34所启动,并通过汽化来蚀刻金属层31。
现在参考图4a至4b以及图5来描述本发明的另一实施例,其中通过使用腐蚀剂来进行局部脱金属化处理。
图5示出了两个薄膜辊50和54以及三个处理站点51至53。
处理站点51是一个金属化站点,它被设计为与图2中的金属化站点类似。
图4a所示的薄膜由一个载体42和一个传送到处理站点51的薄膜基体43构成。薄膜基体43例如可以包括图1中的层12至15。但是薄膜基体43也可以包括单个载体层。
处理站点51将一个金属层44敷设到薄膜基体43上。所得到的薄膜体43(图4b)现在被传送到处理站点52。
处理站点52与图2中的脱金属化站点相类似,其不同之处在于,接地元件39和碳针38由一个按照开关元件34的驱动将腐蚀剂敷设到金属层4上的装置来代替。具有优点的是,在这种情况下将腐蚀剂以小液滴的形式喷涂到金属层44上。由控制元件34所驱动的工具例如包括压电元件或汽化元件,当施加电压脉冲时,该元件在装有腐蚀剂的小室内产生压力脉冲,从而使腐蚀剂的小液滴从连接到所述小室的喷嘴中排出。
腐蚀性溶液或酸,例如腐蚀性苏打或腐蚀性碳酸钾溶液,适于用作上述工艺中的腐蚀剂,其重量百分比浓度在2%到10%之间。
如图4c所述,通过在区域45内敷设腐蚀剂来对金属层44进行脱金属化处理。
现在以这种方式处理的薄膜体41被送至处理站点53,该站点是一个清洗站点,用于从薄膜体41去除腐蚀剂残余物和残渣。在清洗站点53中,薄膜体41例如被传送通过一个或多个装有溶剂的水槽,然后被干燥。
现在参照图6a至6c以及图7来描述本发明的另一个实施例,其中通过使用抗蚀剂来进行数字局部脱金属化处理。
图7示出了两个薄膜辊70和75以及四个处理站点71至74。
处理站点71类似于处理站点52,其区别在于,将抗蚀剂而不是腐蚀剂喷射到金属层上。如6a所示,将抗蚀剂64喷射到一个包括载体61、薄膜基体62以及金属层63的薄膜体60上。
抗蚀剂64包括下列材料中的任一种:PVC、丙烯酸脂、聚酰胺、紫外丙烯酸脂(UV-acrylates)以及聚亚安酯。
这里也可以通过辊子将抗蚀剂64转印到金属层63上,而不是喷射到金属层63上。例如可以通过激光打印机或电复印过程的热效应将粉末形式的抗蚀剂局部敷设到金属层63上。
然后将薄膜传送到处理站点72,它是一个热处理站点,使抗蚀剂64硬化。根据相应选择抗蚀剂,也可以省去处理站点72。
然后将薄膜传送到处理站点73,它是一个脱金属化站点。在这个处理站点中,例如通过酸或腐蚀性溶液将没有受到抗蚀剂64保护的区域内的金属层63去除。因此如图6b所示,在经过处理站点73处理之后,现在薄膜仅在区域65内具有局部金属化层63。
这对于已经存在或者已经被预印刷的图像信息特别具有优点,如文字数字或全息衍射、或者用抗蚀剂以对正关系来处理的颜色信息,从而允许在后续处理过程中实现精确匹配的金属化或脱金属化处理。
然后将薄膜传送到处理站点74。处理站点74时一个清洗站点,它通过溶剂来去除抗蚀剂层64,然后对薄膜进行干燥处理。
然而,也可以不把薄膜传送到处理站点74,而使抗蚀剂层64留在薄膜上。已经证明这种处理过程是有利的,因为抗蚀层64可以用作要进一步敷设的层的粘接剂层。因此层64实现了双重功能,即抗蚀剂层的功能和粘接剂层的功能。
现在参照图8a至8c以及图9来描述本发明的另一个实施例,其中通过使用清洗掩模来进行数字脱金属化处理。
图9示出了两个薄膜辊90和95以及四个处理站点91至94。
图8a所示的薄膜由薄膜体80构成,该薄膜体包括一个薄膜基体82和一个载体81,所述薄膜被传送到处理站点91。薄膜基体82类似于图5所示的薄膜基体43被构造。
处理站点91类似于图7所示的处理站点71,其区别在于,处理站点91将清洗掩模而不是抗蚀剂敷设到薄膜体80。如图8a所示,处理站点91将一个清洗掩模敷设到薄膜体80的区域85内。清洗掩模83最好包括一个基于聚合体的清洗掩模。可用作清洗掩模的材料例如可以是甲基纤维素、羧甲基纤维素、聚丙烯酸钠盐或聚乙烯吡咯烷酮,也可以采用多糖或者能够形成薄膜并且是水溶性的其他天然材料。
然后将薄膜传送到处理站点92,该站点通过干燥使清洗掩模83硬化。这里也可以省去处理站点92。
然后将薄膜传送到处理站点93,它是一个金属化站点,并且如图8b所示,该站点将金属层84敷设到所提供的薄膜体上。在这种情况下,处理站点93可以类似于图5中的处理站点51被设计。
然后将薄膜传送到处理站点94,它是一个清洗站点。这里覆盖着该薄膜的清洗掩模83和金属层84的成分通过清洗和后续的干燥被去除,从而使区域85内的如图8c所示的薄膜和金属层84被局部去除。
Claims (17)
1.用于制造局部金属化薄膜元件(1)的方法,其特征在于,
生成一个定义了局部金属化的图形形状的数字数据集(332),根据该数字数据集(332)计算出(333)一个工具路径和用于驱动工具的控制数据,所述工具(38)以及一个单层或多层的薄膜体(30,41,60,80)根据所述工具路径相对于彼此移动,并且由控制数据所控制的工具(38)形成了金属层(16,31,44,63,84)的局部脱金属化,尤其是通过使用腐蚀剂(52)或抗蚀剂(71)、或者通过腐蚀掉(23)金属层(16,31,44,63,84)来实现脱金属化。
2.如权利要求1所述的制造局部金属化薄膜元件(1)的方法,其特征在于,为一个薄膜基体(43)提供(51)一个金属层(44),以形成所述的单层或多层的薄膜体(41),用所述工具将腐蚀剂敷设(52)到所述金属层上,以对金属层(44)进行局部脱金属化处理,并且在局部脱金属化步骤之后去除(53)腐蚀剂。
3.如权利要求1所述的制造局部金属化薄膜元件(1)的方法,其特征在于,为一个薄膜基体(62)提供一个金属层(63),以形成所述的单层或多层的薄膜体(60),用所述工具来敷设抗蚀剂(64),以局部覆盖所述金属层(63),并且通过脱金属化处理来去除(73)未被覆盖的金属层(63)。
4.如权利要求1所述的制造局部金属化薄膜元件(1)的方法,其特征在于,用所述工具来敷设(91)一个清洗掩模(83),以局部覆盖单层或多层的薄膜体(80),然后为单层或多层的薄膜体(80)提供(93)一个金属层(84),并通过清洗工艺局部去除(94)清洗掩模(83)的区域内的金属层(84)。
5.如权利要求1所述的制造局部金属化薄膜元件(1)的方法,其特征在于,为一个薄膜基体(32)提供(22)一个金属层(31),以形成所述的单层或多层的薄膜体(30),并且所述工具(38)通过电火花腐蚀局部去除(23)金属层(31)。
6.如权利要求5所述的制造局部金属化薄膜元件(1)的方法,其特征在于,将一个碳针(38)作为工具按照所述工具路径在单层或多层的薄膜体(30)的上方移动,并且根据所述控制数据在碳针(38)与一个接地元件(39)之间形成一个电势差,以蚀刻金属层(31)。
7.如权利要求6所述的制造局部金属化薄膜元件(1)的方法,其特征在于,当计算(333)所述工具路径和控制数据时考虑所述碳针(38)与接地元件(31)的设置。
8.如权利要求1所述的制造局部金属化薄膜元件(1)的方法,其特征在于,所述工具通过激光束来局部蚀刻金属层。
9.如权利要求1所述的制造局部金属化薄膜元件(1)的方法,其特征在于,所述工具通过辊子将腐蚀剂、抗蚀剂或清洗掩模敷设到薄膜体上。
10.如权利要求1所述的制造局部金属化薄膜元件(1)的方法,其特征在于,所述工具通过喷涂将腐蚀剂、抗蚀剂或清洗掩模敷设(52,71,91)到薄膜体(41,60,80)上。
11.如权利要求1所述的制造局部金属化薄膜元件(1)的方法,其特征在于,腐蚀剂、抗蚀剂或清洗掩模以对正关系被敷设。
12.如权利要求1所述的制造局部金属化薄膜元件(1)的方法,其特征在于,所述金属层(16,31,44,63,84)的厚度小于1μm。
13.如权利要求1所述的制造局部金属化薄膜元件(1)的方法,其特征在于,所述金属层在整个表面区域上被敷设,尤其是通过金属沉积在整个表面区域上被敷设。
14.如权利要求1所述的制造局部金属化薄膜元件(1)的方法,其特征在于,所述金属层被局部敷设。
15.如权利要求1所述的制造局部金属化薄膜元件(1)的方法,其特征在于,所述金属层由一层高反射率的材料构成。
16.一种局部金属化薄膜元件(1),尤其是冲压薄膜或层压薄膜,其特征在于,所述局部金属化薄膜元件(1)根据权利要求1所述的方法来制造。
17.用于制造局部金属化薄膜元件(1),尤其是冲压薄膜或层压薄膜的装置,其特征在于,
该装置具有一个控制装置(33),一个或多个引导装置(35,36),以及至少一个工具(38),所述控制装置(33)根据一个定义了局部金属化的图形形状的数字数据集(332)计算出(333)一个工具路径和用于驱动工具的控制数据,所述一个或多个引导装置(35,36)使所述工具(38)以及一个单层或多层的薄膜体(30,41,60,80)根据所述工具路径相对于彼此移动,并且由控制数据所控制的工具(38)形成了金属层(16,31,44,63,84)的局部脱金属化,尤其是通过使用腐蚀剂(52)或抗蚀剂(71)、或者通过腐蚀掉(23)金属层(16,31,44,63,84)来实现脱金属化。
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CN102421939A (zh) * | 2009-04-27 | 2012-04-18 | 标致·雪铁龙汽车公司 | 塑料工件、特别是运输工具照射灯和/或信号灯灯罩的部分金属化方法 |
CN102421939B (zh) * | 2009-04-27 | 2013-10-16 | 标致·雪铁龙汽车公司 | 塑料工件、特别是运输工具照射灯和/或信号灯灯罩的部分金属化方法 |
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PL209345B1 (pl) | 2011-08-31 |
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KR101106672B1 (ko) | 2012-01-18 |
CN100355587C (zh) | 2007-12-19 |
RU2343077C2 (ru) | 2009-01-10 |
DE10254029A1 (de) | 2004-06-09 |
RU2005119160A (ru) | 2005-12-10 |
KR20050083922A (ko) | 2005-08-26 |
EP1562755A1 (de) | 2005-08-17 |
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