PL376563A1 - Sposób wytwarzania częściowo metalizowanego elementu foliowego - Google Patents

Sposób wytwarzania częściowo metalizowanego elementu foliowego

Info

Publication number
PL376563A1
PL376563A1 PL376563A PL37656303A PL376563A1 PL 376563 A1 PL376563 A1 PL 376563A1 PL 376563 A PL376563 A PL 376563A PL 37656303 A PL37656303 A PL 37656303A PL 376563 A1 PL376563 A1 PL 376563A1
Authority
PL
Poland
Prior art keywords
tool
partially metallised
metallised film
producing
type element
Prior art date
Application number
PL376563A
Other languages
English (en)
Other versions
PL209345B1 (pl
Inventor
Heinrich Wild
Ludwig Brehm
Mathias Thäter
Original Assignee
Leonhard Kurz Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leonhard Kurz Gmbh & Co. Kg filed Critical Leonhard Kurz Gmbh & Co. Kg
Publication of PL376563A1 publication Critical patent/PL376563A1/pl
Publication of PL209345B1 publication Critical patent/PL209345B1/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/06—Veined printings; Fluorescent printings; Stereoscopic images; Imitated patterns, e.g. tissues, textiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/14—Security printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/10—Applying flat materials, e.g. leaflets, pieces of fabrics
    • B44C1/14—Metallic leaves or foils, e.g. gold leaf
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/08—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0092—Metallizing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
    • B41M5/245—Electroerosion or spark recording
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Vascular Medicine (AREA)
  • Textile Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Optical Elements Other Than Lenses (AREA)
PL376563A 2002-11-20 2003-11-20 Sposób wytwarzania częściowo metalizowanej folii PL209345B1 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10254029A DE10254029A1 (de) 2002-11-20 2002-11-20 Verfahren zur Herstellung eines partiell metallisierten Folienelements

Publications (2)

Publication Number Publication Date
PL376563A1 true PL376563A1 (pl) 2006-01-09
PL209345B1 PL209345B1 (pl) 2011-08-31

Family

ID=32308593

Family Applications (1)

Application Number Title Priority Date Filing Date
PL376563A PL209345B1 (pl) 2002-11-20 2003-11-20 Sposób wytwarzania częściowo metalizowanej folii

Country Status (11)

Country Link
US (1) US20060073277A1 (pl)
EP (1) EP1562755B1 (pl)
JP (1) JP2006511700A (pl)
KR (1) KR101106672B1 (pl)
CN (1) CN100355587C (pl)
AT (1) ATE524324T1 (pl)
AU (1) AU2003294630A1 (pl)
DE (1) DE10254029A1 (pl)
PL (1) PL209345B1 (pl)
RU (1) RU2343077C2 (pl)
WO (1) WO2004045859A1 (pl)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006035749A1 (de) * 2006-07-28 2008-01-31 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung mindestens eines Bauteils sowie Bauteil
US8398869B2 (en) * 2008-11-25 2013-03-19 Sikorsky Aircraft Corporation Transfer film and method for fabricating a circuit
FR2944717B1 (fr) * 2009-04-27 2012-08-17 Peugeot Citroen Automobiles Sa Procede de metallisation partielle d'une piece en matiere plastique, en particulier d'un masque de feu d'eclairage et/ou de signalisation de vehicule.
US20130337304A1 (en) 2011-02-26 2013-12-19 Etv Energy Ltd. Pouch cell comprising an empty-volume defining component
FI125906B (en) * 2012-01-30 2016-03-31 Stora Enso Oyj Method and apparatus for transferring an electrically conductive material in liquid form onto a substrate to be printed
CN103060806A (zh) * 2012-12-28 2013-04-24 苏州米达思精密电子有限公司 一种规则阵列的无连接点蚀刻补强铜片结构
CN103060808A (zh) * 2012-12-28 2013-04-24 苏州米达思精密电子有限公司 一种规则阵列的无连接点蚀刻补强钢片结构
US9859531B2 (en) 2015-02-06 2018-01-02 Ovonic Battery Company, Inc. Alkaline and non-aqueous proton-conducting pouch-cell batteries

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1152033A (en) * 1965-07-26 1969-05-14 E S & A Robinson Holdings Ltd Metallised Web
JPS5322113B2 (pl) * 1972-07-05 1978-07-06
DE2553385A1 (de) * 1975-11-27 1977-06-08 Siemens Ag Verfahren zum herstellen von praezisen mustern in duennen metallisierungen auf kunststoffolien
US4242378A (en) * 1979-03-29 1980-12-30 Reiko Co., Ltd. Method of making a decorated film with a metal layer in the form of a given pattern
US4354911A (en) * 1981-08-07 1982-10-19 Western Electric Company Inc. Method of selectively depositing a metal on a surface by means of sputtering
US4517045A (en) * 1981-09-11 1985-05-14 Beckett Donald E Apparatus for formation of packaging material
JPS5978987A (ja) * 1982-10-29 1984-05-08 マルイ工業株式会社 金属被膜上へのパタ−ン形成方法
JPS59215790A (ja) * 1983-05-23 1984-12-05 マルイ工業株式会社 印刷回路板の製造法
JPS61146590A (ja) * 1984-12-20 1986-07-04 Daicel Chem Ind Ltd 曲面蒸着フイルムのパタ−ニング法
US4610755A (en) * 1985-04-16 1986-09-09 Beckett Donald E Demetallizing method
JPS6365063A (ja) * 1986-09-08 1988-03-23 Ricoh Co Ltd 補助金属電極付き透明電極の形成方法
JPS63194388A (ja) * 1987-02-06 1988-08-11 株式会社豊田自動織機製作所 インクジエツト方式によるプリント基板作成方法
US4767489A (en) * 1987-03-25 1988-08-30 Pc Proto, Inc. Computer aided printer-etcher
CN1031402A (zh) * 1987-08-20 1989-03-01 安徽省肥西师范铝制品工艺厂 铝表面的化学处理方法
US4980240A (en) * 1989-04-20 1990-12-25 Honeywell Inc. Surface etched shadow mask
US5142383A (en) * 1990-01-25 1992-08-25 American Banknote Holographics, Inc. Holograms with discontinuous metallization including alpha-numeric shapes
US5090121A (en) * 1990-10-30 1992-02-25 Texas Instruments Incorporated Apparatus and method for fabricating cirucit pattern on conductive surface of circuit board
JPH04239714A (ja) * 1991-01-23 1992-08-27 Matsushita Electric Ind Co Ltd コンデンサ用金属化フィルムの製造方法
JP3353928B2 (ja) * 1993-01-29 2002-12-09 オリンパス光学工業株式会社 レジストパターン形成方法及び装置
DE4333546C2 (de) * 1993-10-01 1996-03-21 Klaus Kall Verfahren zum Beschichten einer transparenten Trägerplatte
US5470644A (en) * 1994-04-21 1995-11-28 Durant; David Apparatus and method for fabrication of printed circuit boards
US5757521A (en) * 1995-05-11 1998-05-26 Advanced Deposition Technologies, Inc. Pattern metallized optical varying security devices
US5800724A (en) * 1996-02-14 1998-09-01 Fort James Corporation Patterned metal foil laminate and method for making same
DE19739193B4 (de) * 1997-09-08 2006-08-03 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Sicherheitsfolien für Wertpapiere
DE19819571A1 (de) * 1998-04-30 1999-11-04 Giesecke & Devrient Gmbh Wertdokument mit Sicherheitselement
JP2002200833A (ja) * 2000-12-28 2002-07-16 Tobi Co Ltd 金属酸化物膜のパターン化方法
DE10121126A1 (de) * 2001-04-30 2002-11-07 Intec Holding Gmbh Identifikationsträger und Verfahren zu dessen Herstellung

Also Published As

Publication number Publication date
KR20050083922A (ko) 2005-08-26
US20060073277A1 (en) 2006-04-06
DE10254029A1 (de) 2004-06-09
AU2003294630A1 (en) 2004-06-15
RU2343077C2 (ru) 2009-01-10
ATE524324T1 (de) 2011-09-15
KR101106672B1 (ko) 2012-01-18
CN1726136A (zh) 2006-01-25
WO2004045859A1 (de) 2004-06-03
JP2006511700A (ja) 2006-04-06
PL209345B1 (pl) 2011-08-31
RU2005119160A (ru) 2005-12-10
CN100355587C (zh) 2007-12-19
EP1562755B1 (de) 2011-09-14
EP1562755A1 (de) 2005-08-17

Similar Documents

Publication Publication Date Title
WO2008005892A3 (en) Nanocrystal formation
CN100574569C (zh) 一种具有长短金手指电路板的生产方法
PL376563A1 (pl) Sposób wytwarzania częściowo metalizowanego elementu foliowego
TW200518246A (en) Substrate and method for manufacturing the same
SI1846253T1 (sl) Postopek za pripravo večslojnega telesa kot tudivečslojno telo
MY158793A (en) Critical dimension reduction and roughness control
WO2004074535A3 (de) Verbundwerkstoff aus intermetallischen phasen und keramik und herstellungsverfahren
DE60030524D1 (de) Pvd beschichtetes schneidwerkzeug und verfahren zu dessen herstellung
AU2003238418A1 (en) Open-pored metal coating for joint replacement implants and method for production thereof
WO2003038875A3 (de) Photolithographisches strukturierungsverfahren mit einer durch ein plasmaverfahren abgeschiedenen kohlenstoff-hartmaskenschicht mit diamantartiger härte
ATE557324T1 (de) Verfahren zur herstellung mehrschichtiger metallteile mithilfe der uv-liga-technik
TW200607419A (en) Production method of wiring sustrate having ultra-fine pattern, and wiring substrate
HK1122076A1 (en) Method for applying a metal on a substrate
EP0811771A3 (de) Verfahren zur Herstellung eines Aktuators
DE69920513D1 (de) Verfahren zur herstellung von mechanischen teilen durch aufteilung in schichten
WO2005002308A3 (fr) Pieces pour composants electroniques passifs et procede de fabrication
WO2003096122A3 (de) Verfahren zur herstellung einer einheit mit einer räumlichen oberflächenstrukturierung sowie verwendung dieses verfahrens
JP2006511700A5 (pl)
WO2003026025A3 (en) Synthesis of layers, coatings or films using collection layer
DE50310327D1 (de) Aterialdicke, verfahren zur herstellung einer solchen metallischen lage und zumindest teilweise aus solchen metallischen lagen hergestellter wabenk rper
TW200510241A (en) Process for fabricating micromachine
WO2004050951A3 (de) Scherheitsfolie und verfahren zur herstellung derselben
TW200715046A (en) A method of manufacturing an etched substrate
EP1491651A4 (en) OPEN MO NITRIDE ALLOY
TW200420759A (en) Method for electroplating metal wire