ATE557324T1 - Verfahren zur herstellung mehrschichtiger metallteile mithilfe der uv-liga-technik - Google Patents

Verfahren zur herstellung mehrschichtiger metallteile mithilfe der uv-liga-technik

Info

Publication number
ATE557324T1
ATE557324T1 AT09807920T AT09807920T ATE557324T1 AT E557324 T1 ATE557324 T1 AT E557324T1 AT 09807920 T AT09807920 T AT 09807920T AT 09807920 T AT09807920 T AT 09807920T AT E557324 T1 ATE557324 T1 AT E557324T1
Authority
AT
Austria
Prior art keywords
layer
openings
metal parts
layer metal
new
Prior art date
Application number
AT09807920T
Other languages
English (en)
Inventor
Jean-Charles Fiaccabrino
Gilles Rey-Mermet
Original Assignee
Nivarox Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40260842&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE557324(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nivarox Sa filed Critical Nivarox Sa
Application granted granted Critical
Publication of ATE557324T1 publication Critical patent/ATE557324T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/26—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Micromachines (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Metal Extraction Processes (AREA)
AT09807920T 2008-08-20 2009-07-23 Verfahren zur herstellung mehrschichtiger metallteile mithilfe der uv-liga-technik ATE557324T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08162693A EP2157476A1 (de) 2008-08-20 2008-08-20 Herstellungsverfahren von mehrstufigen Metallteilen durch UV-LIGA-Technik
PCT/EP2009/059476 WO2010020515A1 (fr) 2008-08-20 2009-07-23 Procédé de fabrication de pièces métalliques multi-niveaux par la technique liga-uv

Publications (1)

Publication Number Publication Date
ATE557324T1 true ATE557324T1 (de) 2012-05-15

Family

ID=40260842

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09807920T ATE557324T1 (de) 2008-08-20 2009-07-23 Verfahren zur herstellung mehrschichtiger metallteile mithilfe der uv-liga-technik

Country Status (10)

Country Link
US (1) US9250533B2 (de)
EP (2) EP2157476A1 (de)
JP (1) JP5508420B2 (de)
KR (1) KR20110042121A (de)
CN (1) CN102124409B (de)
AT (1) ATE557324T1 (de)
HK (1) HK1160232A1 (de)
RU (1) RU2496129C2 (de)
TW (1) TWI507814B (de)
WO (1) WO2010020515A1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2182096A1 (de) * 2008-10-28 2010-05-05 Nivarox-FAR S.A. Heterogenes LIGA-Verfahren
BRPI1007684B1 (pt) 2009-05-19 2020-03-17 Koninklijke Philips N.V. Sistema configurado para habilitar um indivíduo a alterar conscientemente um ou mais parâmetros respiratórios
EP2405300A1 (de) * 2010-07-09 2012-01-11 Mimotec S.A. Herstellungsverfahren von mehrschichtigen Metallteilen mit Hilfe eines Verfahrens vom Typ LIGA, und mit dieser Methode hergestellte Teile
KR20130143586A (ko) 2010-10-12 2013-12-31 코닌클리케 필립스 엔.브이. 유기 전자 디바이스의 제조 방법
CN102147569B (zh) * 2010-12-02 2012-10-10 天津海鸥表业集团有限公司 多层结构的微部件及固化的su8光刻胶薄片的加工方法
EP2672319A1 (de) 2012-06-06 2013-12-11 Mimotec S.A. Herstellungsverfahren von dreidimensionalen Metallmikroteilen durch Wachstum in einem gemischten Hohlraum, und durch dieses Verfahren erhaltene Mikroteile
EP2767869A1 (de) * 2013-02-13 2014-08-20 Nivarox-FAR S.A. Verfahren zur Herstellung eines mikromechanischen Monoblock-Bauteils, das mindestens zwei verschiedene Ebenen umfasst
EP3231898B1 (de) * 2014-12-12 2019-10-09 Citizen Watch Co., Ltd. Verfahren zur herstellung von elektrogeformten komponenten
EP3035129B1 (de) * 2014-12-19 2020-11-04 The Swatch Group Research and Development Ltd Herstellungsverfahren eines Dekorelements für eine Uhr oder ein Schmuckstück
EP3266738B1 (de) 2016-07-06 2019-03-06 The Swatch Group Research and Development Ltd. Herstellungsverfahren für ein uhrenbauteil, das mit einer mehrstufigen habillage ausgestattet ist
EP3454122B1 (de) * 2017-09-11 2020-02-19 Patek Philippe SA Genève Herstellungsverfahren mithilfe der liga-technologie einer metall-mikrostruktur mit mindestens zwei stufen
EP3467151B1 (de) * 2017-10-06 2020-06-17 Nivarox-FAR S.A. Form für galvanoplastik, und ihr herstellungsverfahren
EP3508916B1 (de) * 2018-01-05 2022-03-02 Mimotec S.A. Herstellungsmethode einer mehrstufigen mikroform für die galvanoformung
EP3547027B1 (de) * 2018-03-29 2022-01-05 Mimotec S.A. Herstellungsmethode einer mehrstufigen mikroform für die galvanoformung von mikromechanischen komponenten
EP3614205A1 (de) * 2018-08-22 2020-02-26 Nivarox-FAR S.A. Verfahren zur herstellung einer uhrkomponente, und nach diesem verfahren hergestellte komponente
EP3839626B1 (de) 2019-12-18 2023-10-11 Nivarox-FAR S.A. Verfahren zur herstellung einer uhrkomponente
EP3839624B1 (de) 2019-12-18 2023-09-13 Nivarox-FAR S.A. Verfahren zur herstellung einer uhrkomponente
EP3839627B1 (de) 2019-12-18 2023-07-26 Mimotec S.A. Herstellungsmethode einer mikroform für die galvanoformung von mikromechanischen komponenten
EP3839625A1 (de) 2019-12-18 2021-06-23 Nivarox-FAR S.A. Verfahren zur herstellung einer uhrkomponente und nach diesem verfahren hergestellte komponente
NL2024542B1 (en) * 2019-12-20 2021-09-02 Veco B V Electroforming process
CN114824037A (zh) * 2022-04-22 2022-07-29 西安闻泰信息技术有限公司 发光二极管的键合方法、发光二极管以及发光面板
KR20240031738A (ko) * 2022-09-01 2024-03-08 주식회사 익스톨 관통 비아 금속 배선 형성방법

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Also Published As

Publication number Publication date
US20110146070A1 (en) 2011-06-23
JP5508420B2 (ja) 2014-05-28
TW201013329A (en) 2010-04-01
JP2012500337A (ja) 2012-01-05
EP2157476A1 (de) 2010-02-24
EP2316056A1 (de) 2011-05-04
US9250533B2 (en) 2016-02-02
CN102124409A (zh) 2011-07-13
WO2010020515A1 (fr) 2010-02-25
KR20110042121A (ko) 2011-04-22
EP2316056B1 (de) 2012-05-09
RU2011110423A (ru) 2012-09-27
HK1160232A1 (zh) 2012-08-10
RU2496129C2 (ru) 2013-10-20
CN102124409B (zh) 2016-04-20
TWI507814B (zh) 2015-11-11

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