CN1694934A - 制备电子装置的方法和油墨 - Google Patents

制备电子装置的方法和油墨 Download PDF

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Publication number
CN1694934A
CN1694934A CNA03825204XA CN03825204A CN1694934A CN 1694934 A CN1694934 A CN 1694934A CN A03825204X A CNA03825204X A CN A03825204XA CN 03825204 A CN03825204 A CN 03825204A CN 1694934 A CN1694934 A CN 1694934A
Authority
CN
China
Prior art keywords
ink
parts
etch
monomers
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA03825204XA
Other languages
English (en)
Chinese (zh)
Inventor
A·J·霍珀
M·R·詹姆斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avecia Ltd
Original Assignee
Avecia Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avecia Ltd filed Critical Avecia Ltd
Publication of CN1694934A publication Critical patent/CN1694934A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Glass Compositions (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
CNA03825204XA 2002-09-20 2003-08-22 制备电子装置的方法和油墨 Pending CN1694934A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0221892.3A GB0221892D0 (en) 2002-09-20 2002-09-20 Process
GB0221892.3 2002-09-20

Publications (1)

Publication Number Publication Date
CN1694934A true CN1694934A (zh) 2005-11-09

Family

ID=9944478

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA03825204XA Pending CN1694934A (zh) 2002-09-20 2003-08-22 制备电子装置的方法和油墨

Country Status (11)

Country Link
US (1) US7427360B2 (cg-RX-API-DMAC7.html)
EP (1) EP1543083B1 (cg-RX-API-DMAC7.html)
JP (1) JP2005539391A (cg-RX-API-DMAC7.html)
KR (1) KR100966508B1 (cg-RX-API-DMAC7.html)
CN (1) CN1694934A (cg-RX-API-DMAC7.html)
AT (1) ATE335796T1 (cg-RX-API-DMAC7.html)
AU (1) AU2003260741A1 (cg-RX-API-DMAC7.html)
DE (1) DE60307485T2 (cg-RX-API-DMAC7.html)
GB (1) GB0221892D0 (cg-RX-API-DMAC7.html)
TW (1) TWI340754B (cg-RX-API-DMAC7.html)
WO (1) WO2004026977A1 (cg-RX-API-DMAC7.html)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103517566A (zh) * 2012-06-28 2014-01-15 昆山联滔电子有限公司 非导电载体上的导体轨道的制造方法
CN103762049A (zh) * 2013-11-01 2014-04-30 成都顺康三森电子有限责任公司 半导体陶瓷化学镀镍镍电极外沿去除的方法
CN104494310A (zh) * 2014-09-16 2015-04-08 苏州锐发打印技术有限公司 用于太阳能电池网格导线制作的3d打印系统及控制方法
CN105733361A (zh) * 2016-04-29 2016-07-06 珠海保税区天然宝杰数码科技材料有限公司 一种抗蚀刻喷墨墨水及其应用
CN106062099A (zh) * 2014-03-03 2016-10-26 爱克发-格法特公司 用于制造导电图案的抗蚀刻喷墨油墨
CN107075283A (zh) * 2014-09-29 2017-08-18 爱克发-格法特公司 金属制品的数字制造
CN111512452A (zh) * 2017-10-17 2020-08-07 科迪华公司 用于显示装置的具有高量子点浓度的油墨组合物
CN112135883A (zh) * 2018-03-02 2020-12-25 爱克发-格法特公司 用于制造印刷电路板的喷墨油墨

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JP5430051B2 (ja) 2005-12-28 2014-02-26 富士フイルム株式会社 インク組成物、インクジェット記録方法、平版印刷版の製造方法、及び平版印刷版
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DE102006022722B4 (de) 2006-05-12 2010-06-17 Hueck Engraving Gmbh & Co. Kg Verfahren und Vorrichtung zur Oberflächenstrukturierung eines Pressbleches oder eines Endlosbandes
US7803420B2 (en) 2006-12-01 2010-09-28 Applied Materials, Inc. Methods and apparatus for inkjetting spacers in a flat panel display
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KR101215459B1 (ko) * 2008-03-27 2012-12-26 도쿄 프린팅 잉크 엠에프지. 캄파니 리미티드 에칭 레지스트용 잉크젯 잉크 조성물
JP5518311B2 (ja) * 2008-08-26 2014-06-11 日新製鋼株式会社 エッチングレジスト用インクジェットインキ組成物
JP4335955B1 (ja) * 2008-05-16 2009-09-30 日立マクセル株式会社 エネルギー線硬化型インク組成物
ATE516693T1 (de) * 2008-11-04 2011-07-15 Rohm & Haas Elect Mat Verbesserte schmelzzusammensetzungen
CN101481616B (zh) * 2009-02-05 2013-07-10 广州市和携化工科技有限公司 金属及金属氧化物蚀刻油墨及其制备方法与应用
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JP5795200B2 (ja) * 2011-06-17 2015-10-14 株式会社フジキン 電気化学素子の製造方法及び電気化学素子の製造装置
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US9453139B2 (en) 2013-08-20 2016-09-27 Rohm And Haas Electronic Materials Llc Hot melt compositions with improved etch resistance
CN107922796B (zh) * 2015-07-06 2020-09-25 蓝星有机硅法国两合公司 自粘多层制品及其制备方法
EP3210946B1 (en) * 2016-02-29 2020-07-08 Agfa-Gevaert Method of manufacturing an etched glass article
EP3296368B1 (en) 2016-09-14 2020-11-11 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing printed circuit boards
EP3533844B1 (en) 2018-03-02 2022-09-28 Agfa-Gevaert Nv Inkjet inks for manufacturing printed circuit boards
US11359102B2 (en) * 2018-03-27 2022-06-14 Sun Chemical Corporation UV-curable compositions comprising cleavage type photoinitiators
KR20210081391A (ko) * 2018-11-20 2021-07-01 아그파-게바에르트 엔.브이. 인쇄 회로 기판 제조용 복사선 경화성 잉크젯 잉크
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EP3686252A1 (en) 2019-01-24 2020-07-29 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
US11596070B2 (en) 2019-02-14 2023-02-28 Orbotech Ltd. Apparatus for use in preparing a printed circuit board and photosensitive ink for in an ink jet printer
EP3757175A1 (en) 2019-06-28 2020-12-30 Agfa-Gevaert Nv Radiation curable inkjet ink for alkaline etching or plating applications
EP3757174B1 (en) 2019-06-28 2022-04-20 Agfa-Gevaert Nv Radiation curable inkjet ink for alkaline etching or plating applications
EP4055107A1 (en) 2019-11-07 2022-09-14 Agfa-Gevaert N.V. Radiation curable inkjet ink for manufacturing printed circuit boards
EP3901226A1 (en) 2020-04-21 2021-10-27 Agfa-Gevaert Nv Method of manufacturing printed circuit boards
EP4032958B1 (en) 2021-01-25 2025-10-01 Agfa-Gevaert Nv Radiation curable inkjet inks
EP4190866A1 (en) 2021-12-02 2023-06-07 Agfa-Gevaert Nv Radiation curable inkjet inks
WO2024017926A1 (en) 2022-07-19 2024-01-25 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
EP4558571B1 (en) 2022-07-19 2026-04-08 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
JP2025524829A (ja) 2022-07-19 2025-08-01 アグフア－ゲヴエルト，ナームローゼ・フエンノートシヤツプ プリント回路基板製造用硬化性インクジェット組成物
JP2025524832A (ja) 2022-07-19 2025-08-01 アグフア－ゲヴエルト，ナームローゼ・フエンノートシヤツプ プリント基板を製造するための硬化性インクジェット組成物
CN116239914A (zh) * 2022-09-09 2023-06-09 广东东溢新材料科技有限公司 一种水性白色油墨及其制备方法与应用
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WO2026014193A1 (ja) * 2024-07-12 2026-01-15 コニカミノルタ株式会社 活性エネルギー線硬化型インクジェットインク及びインクジェット記録方法

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103517566A (zh) * 2012-06-28 2014-01-15 昆山联滔电子有限公司 非导电载体上的导体轨道的制造方法
CN103762049A (zh) * 2013-11-01 2014-04-30 成都顺康三森电子有限责任公司 半导体陶瓷化学镀镍镍电极外沿去除的方法
CN106062099A (zh) * 2014-03-03 2016-10-26 爱克发-格法特公司 用于制造导电图案的抗蚀刻喷墨油墨
CN104494310A (zh) * 2014-09-16 2015-04-08 苏州锐发打印技术有限公司 用于太阳能电池网格导线制作的3d打印系统及控制方法
CN107075283A (zh) * 2014-09-29 2017-08-18 爱克发-格法特公司 金属制品的数字制造
CN105733361A (zh) * 2016-04-29 2016-07-06 珠海保税区天然宝杰数码科技材料有限公司 一种抗蚀刻喷墨墨水及其应用
CN111512452A (zh) * 2017-10-17 2020-08-07 科迪华公司 用于显示装置的具有高量子点浓度的油墨组合物
CN111512452B (zh) * 2017-10-17 2023-11-21 科迪华公司 用于显示装置的具有高量子点浓度的油墨组合物
CN112135883A (zh) * 2018-03-02 2020-12-25 爱克发-格法特公司 用于制造印刷电路板的喷墨油墨

Also Published As

Publication number Publication date
US7427360B2 (en) 2008-09-23
KR100966508B1 (ko) 2010-06-29
TWI340754B (en) 2011-04-21
US20060154033A1 (en) 2006-07-13
DE60307485D1 (de) 2006-09-21
JP2005539391A (ja) 2005-12-22
AU2003260741A1 (en) 2004-04-08
EP1543083A1 (en) 2005-06-22
EP1543083B1 (en) 2006-08-09
WO2004026977A1 (en) 2004-04-01
DE60307485T2 (de) 2007-04-12
TW200422356A (en) 2004-11-01
GB0221892D0 (en) 2002-10-30
KR20050057463A (ko) 2005-06-16
ATE335796T1 (de) 2006-09-15

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