GB0221892D0 - Process - Google Patents

Process

Info

Publication number
GB0221892D0
GB0221892D0 GBGB0221892.3A GB0221892A GB0221892D0 GB 0221892 D0 GB0221892 D0 GB 0221892D0 GB 0221892 A GB0221892 A GB 0221892A GB 0221892 D0 GB0221892 D0 GB 0221892D0
Authority
GB
United Kingdom
Prior art keywords
parts
etch
ink
alloy
resistant ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0221892.3A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avecia Ltd
Original Assignee
Avecia Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avecia Ltd filed Critical Avecia Ltd
Priority to GBGB0221892.3A priority Critical patent/GB0221892D0/en
Publication of GB0221892D0 publication Critical patent/GB0221892D0/en
Priority to CNA03825204XA priority patent/CN1694934A/zh
Priority to AT03797366T priority patent/ATE335796T1/de
Priority to EP03797366A priority patent/EP1543083B1/en
Priority to US10/528,582 priority patent/US7427360B2/en
Priority to AU2003260741A priority patent/AU2003260741A1/en
Priority to PCT/GB2003/003697 priority patent/WO2004026977A1/en
Priority to KR1020057004711A priority patent/KR100966508B1/ko
Priority to DE60307485T priority patent/DE60307485T2/de
Priority to JP2004537257A priority patent/JP2005539391A/ja
Priority to TW092125054A priority patent/TWI340754B/zh
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Glass Compositions (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
GBGB0221892.3A 2002-09-20 2002-09-20 Process Ceased GB0221892D0 (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
GBGB0221892.3A GB0221892D0 (en) 2002-09-20 2002-09-20 Process
JP2004537257A JP2005539391A (ja) 2002-09-20 2003-08-22 電子装置を製造する方法及びインク
US10/528,582 US7427360B2 (en) 2002-09-20 2003-08-22 Process and ink for making electronic devices
AT03797366T ATE335796T1 (de) 2002-09-20 2003-08-22 Verfahren und tinte zur herstellung elektronischer bauteile
EP03797366A EP1543083B1 (en) 2002-09-20 2003-08-22 Process and ink for making electronic devices
CNA03825204XA CN1694934A (zh) 2002-09-20 2003-08-22 制备电子装置的方法和油墨
AU2003260741A AU2003260741A1 (en) 2002-09-20 2003-08-22 Process and ink for making electronic devices
PCT/GB2003/003697 WO2004026977A1 (en) 2002-09-20 2003-08-22 Process and ink for making electronic devices
KR1020057004711A KR100966508B1 (ko) 2002-09-20 2003-08-22 전자 장치의 제조 방법 및 전자 장치 제조용 잉크
DE60307485T DE60307485T2 (de) 2002-09-20 2003-08-22 Verfahren und tinte zur herstellung elektronischer bauteile
TW092125054A TWI340754B (en) 2002-09-20 2003-09-10 Process and ink for making electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0221892.3A GB0221892D0 (en) 2002-09-20 2002-09-20 Process

Publications (1)

Publication Number Publication Date
GB0221892D0 true GB0221892D0 (en) 2002-10-30

Family

ID=9944478

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0221892.3A Ceased GB0221892D0 (en) 2002-09-20 2002-09-20 Process

Country Status (11)

Country Link
US (1) US7427360B2 (cg-RX-API-DMAC7.html)
EP (1) EP1543083B1 (cg-RX-API-DMAC7.html)
JP (1) JP2005539391A (cg-RX-API-DMAC7.html)
KR (1) KR100966508B1 (cg-RX-API-DMAC7.html)
CN (1) CN1694934A (cg-RX-API-DMAC7.html)
AT (1) ATE335796T1 (cg-RX-API-DMAC7.html)
AU (1) AU2003260741A1 (cg-RX-API-DMAC7.html)
DE (1) DE60307485T2 (cg-RX-API-DMAC7.html)
GB (1) GB0221892D0 (cg-RX-API-DMAC7.html)
TW (1) TWI340754B (cg-RX-API-DMAC7.html)
WO (1) WO2004026977A1 (cg-RX-API-DMAC7.html)

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EP3210946B1 (en) * 2016-02-29 2020-07-08 Agfa-Gevaert Method of manufacturing an etched glass article
CN105733361B (zh) * 2016-04-29 2019-05-03 珠海天威新材料股份有限公司 一种抗蚀刻喷墨墨水及其应用
EP3296368B1 (en) 2016-09-14 2020-11-11 Agfa-Gevaert Etch-resistant inkjet inks for manufacturing printed circuit boards
CN111512452B (zh) * 2017-10-17 2023-11-21 科迪华公司 用于显示装置的具有高量子点浓度的油墨组合物
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KR20200116151A (ko) * 2018-03-02 2020-10-08 아그파-게바에르트 엔.브이. 인쇄 회로 기판을 제조하기 위한 잉크젯 잉크
US11359102B2 (en) * 2018-03-27 2022-06-14 Sun Chemical Corporation UV-curable compositions comprising cleavage type photoinitiators
KR20210081391A (ko) * 2018-11-20 2021-07-01 아그파-게바에르트 엔.브이. 인쇄 회로 기판 제조용 복사선 경화성 잉크젯 잉크
US20210403738A1 (en) 2018-11-26 2021-12-30 Agfa-Gevaert Nv Novel photoinitiators
EP3656824A1 (en) 2018-11-26 2020-05-27 Agfa-Gevaert Nv Radiation curable inkjet for manufacturing printed circuit boards
EP3686252A1 (en) 2019-01-24 2020-07-29 Agfa-Gevaert Nv Radiation curable inkjet ink for manufacturing printed circuit boards
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EP3757175A1 (en) 2019-06-28 2020-12-30 Agfa-Gevaert Nv Radiation curable inkjet ink for alkaline etching or plating applications
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EP4032958B1 (en) 2021-01-25 2025-10-01 Agfa-Gevaert Nv Radiation curable inkjet inks
EP4190866A1 (en) 2021-12-02 2023-06-07 Agfa-Gevaert Nv Radiation curable inkjet inks
WO2024017926A1 (en) 2022-07-19 2024-01-25 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
EP4558571B1 (en) 2022-07-19 2026-04-08 Agfa-Gevaert Nv A curable inkjet composition for the manufacturing of printed circuit boards
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JP2025524832A (ja) 2022-07-19 2025-08-01 アグフア－ゲヴエルト，ナームローゼ・フエンノートシヤツプ プリント基板を製造するための硬化性インクジェット組成物
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Also Published As

Publication number Publication date
US7427360B2 (en) 2008-09-23
KR100966508B1 (ko) 2010-06-29
TWI340754B (en) 2011-04-21
US20060154033A1 (en) 2006-07-13
DE60307485D1 (de) 2006-09-21
JP2005539391A (ja) 2005-12-22
AU2003260741A1 (en) 2004-04-08
EP1543083A1 (en) 2005-06-22
CN1694934A (zh) 2005-11-09
EP1543083B1 (en) 2006-08-09
WO2004026977A1 (en) 2004-04-01
DE60307485T2 (de) 2007-04-12
TW200422356A (en) 2004-11-01
KR20050057463A (ko) 2005-06-16
ATE335796T1 (de) 2006-09-15

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