CN1693404A - 用于电子装置的组合物 - Google Patents

用于电子装置的组合物 Download PDF

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Publication number
CN1693404A
CN1693404A CNA2005100783356A CN200510078335A CN1693404A CN 1693404 A CN1693404 A CN 1693404A CN A2005100783356 A CNA2005100783356 A CN A2005100783356A CN 200510078335 A CN200510078335 A CN 200510078335A CN 1693404 A CN1693404 A CN 1693404A
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China
Prior art keywords
composition
exposed
infrared radiation
described method
ground
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Pending
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CNA2005100783356A
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English (en)
Inventor
D·麦克科尔米克
J·W·诺维基
郑志明
W·奥哈拉
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National Starch and Chemical Investment Holding Corp
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National Starch and Chemical Investment Holding Corp
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Publication of CN1693404A publication Critical patent/CN1693404A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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Abstract

本发明涉及一种含有聚合树脂，导电填料和一种或多种近红外吸收添加剂并任选含有氧原子捕获剂或腐蚀抑制剂或两者兼有，以及其它添加剂如反应性或非反应性稀释剂，惰性填料，粘合促进剂的快速固化组合物。该组合物可以是导电的、电阻的或导电性各向异性的。在另一个实施方案中，本发明涉及一种通过将组合物暴露于近红外能量源来提高组合物固化速度的方法。

Description

用于电子装置的组合物
技术领域
本发明涉及一种提高用于电子装置的导电的、电阻的和导电性各向异性的组合物固化速度的方法，以及一种用于电子装置的快速固化的导电的、阻抗的或导电性各向异性的组合物。
背景技术
出于各种目的，导电的、电阻的和导电性各向异性的组合物被用于半导体组件和电子装置的制造和装配中。例如，导电粘合剂被用于将集成电路片粘合到底材上(冲模粘接粘合剂)或将电路组件粘合到印刷线路板上(表面装配导电粘合剂)，电阻材料在电路板中用于形成平面的或埋入的电阻器。导电粘合剂的固化时间对于电子设备的生产者至关重要。固化时间越快生产过程效率越高。传统的导电粘合剂用热方法来固化，包括对含有未固化粘合剂的装置进行热处理。这种热固化过程要求在设备方面增加显著的投入，例如固化炉，以及要求相对较长的时间。如果导电粘合剂可以比目前的热固化方法更快、更高效的固化，那将是非常有利的。
本发明的一个方面在于提供一种粘合至少一种第一电子组件到底材上的方法，其中至少该电子组件之一或者底材的至少一部分已经涂覆了导电粘合剂。该粘合剂任选含有一种近红外(“NIR”)吸收成分。该方法包括用NIR辐射能辐照所涂覆的粘合剂足以固化该粘合剂的时间，从而使其固化并将电子组件和底材粘合在一起。
本发明的另一个方面提供了一种含有效量的一种NIR吸收成分的组合物，以便在短持续时间内将该粘合剂暴露于辐射能量时，粘合剂会迅速固化。选用的NIR吸收成分可以溶解和/或分散在组合物里。
本发明的又一个方面提供了一种含有一种组合物例如能够通过辐照发生固化的导电粘合剂并任选含有一种NIR吸收成分的生产制品。
发明内容
本发明包括一种使用NIR固化提高导电的、电阻的和导电性各向异性的组合物例如导电粘合剂的固化速度的方法。本发明的进一步实施方案包括一种组合物，其含有粘合剂体系，导电填料和一种或多种NIR吸收成分，任选的氧原子捕获剂或腐蚀抑制剂或两者兼有，反应性或非反应性稀释剂，惰性填料，粘合促进剂。
具体实施方式
含有树脂，稀释剂，粘合促进剂，填料和其它成分的化学组合物用于电子组件如半导体组件的制作，例如，用作粘合剂，密封剂，或用于形成集成无源组件，如电阻器或电容器。所述的组合物可以用近红外(“NIR”)固化来快速固化。与之相对的中红外固化，通常是在红外炉里用波长5,000-30,000nm来进行；NIR固化是暴露在红外波长700-5,000nm下进行的。对于很多电子应用，粘合剂的固化应该使固化的组合物具有小于约2欧姆的电阻。然而，在某些电子工业应用中较高的电阻也是可以接受的。虽然本申请中所描述的都是导电粘合剂，但应该理解为本申请也包括其它导电，电阻和导电性各向异性的组合物，如导电油墨。本发明的组合物通常是树脂基的，可以含有如环氧树脂，环氧/氰酸酯混合物和丙烯酸酯的组分。已经发现使用NIR固化提供了一种比传统热方法固化(如在炉子里加热)意料不到的更快固化速度。此外，在某些情况下，在制剂中加入一种或多种NIR吸收添加剂提高了粘合剂暴露于NIR固化下的固化速度。在所述的情况下本发明含NIR吸收成分的粘合剂组合物提高了对NIR能量的吸收，从而促进了对粘合剂的热传递，进而优化了固化速度性能。本发明所述的粘合剂暴露于短时间的辐射能量发生再活化，提供了优异的在线性能和硬化速度，允许更快的生产速度。
该粘合剂组合物可以用于将电子组件粘合到任何底材上，如电路板。粘合剂可以覆盖在底材和/或要粘合的电子组件的任一或两个表面。底材和组件在固化之前通常邻近放置，中间是粘合剂。如果底材对于再活化所用的能量来说是透明的或半透明的，粘合剂应该首先夹在底材之间，然后可以使用NIR能量引发固化。如果底材相对于所用的能量是不透明的，粘合剂任何部位的部分暴露都可以引发其固化。
在所述的制剂中可用的示例性树脂为目前被广泛应用于工业的任何树脂，如乙烯树脂、丙烯酸树脂、酚醛树脂、环氧树脂、马来酰亚胺树脂、聚酰亚胺树脂，或含硅树脂。这些制剂和物理性能是本领域技术人员公知的。此外，氰酸酯可与环氧或其它树脂结合使用。
示例性反应性稀释剂可以是缩水甘油醚类，如1，4-丁二醇二环氧甘油醚；乙烯基醚类，如亚乙基乙烯基醚；乙烯基酯类，如亚乙基乙烯基酯；及丙烯酸酯类，如甲基丙烯酸甲酯。
示例性非反应稀释剂如丁基卡必醇。
示例性粘合促进剂为硅烷和聚乙烯醇缩丁醛。
氧原子捕获剂也可以用于组合物。本文定义的氧原子捕获剂指的是任何可以与氧原子反应以阻止氧原子在电化学电池阴极发生进一步反应的化合物。示例性氧原子捕获剂为对苯二酚，碳酰肼，三羟基苯，氨基酚，肼，焦棓酚，碳腙(carbohydrazone)，聚乙烯胺，环己二酮，羟胺，甲氧基丙胺，环己胺，二乙基乙醇胺，羟基烷基羟胺，四取代苯二胺，吗啉代己糖还原酮，酮-葡萄糖酸盐，硫酸氢胺，内酯衍生物，苯酚衍生物，取代喹啉。
为了阻止金属氧化物的形成，腐蚀抑制剂也可以使用。本文定义的腐蚀抑制剂指的是具有一对孤电子的化合物，如含氮、含硫、和含氧的化合物，它们能够与金属结合，并阻止其在电化学阴极上反应。示例性腐蚀抑制剂如1，10-phenathiodine，吩噻嗪，苯并三唑，苯并咪唑，巯基苯并噻唑，双氰胺，3-异丙氨基1-丁炔，炔丙基喹啉溴化物，3-苄氨基-1-丁炔，二炔丙基醚，二炔丙基硫醚，己酸炔丙基酯，二氨基庚烷，菲咯啉，胺，二胺，三胺，六亚甲基酰亚胺，十亚甲基酰亚胺，六亚甲基亚胺苯甲酸盐，六亚甲基亚胺-3，5-二硝基苯甲酸盐，六亚甲基四胺，d-肟基-b-乙烯基奎宁环，苯胺，6-N-乙基嘌呤，1-乙基氨基-2-十八烷基咪唑啉，吗啉，乙醇胺，氨基酚，8-羟基喹啉，吡啶及其衍生物，喹啉及其衍生物，吖啶，咪唑及其衍生物，甲苯胺，硫醇，苯硫酚及其衍生物，硫化物，亚砜，硫代磷酸酯，及硫脲。
本领域所公知的，某些氧原子捕获剂具有抑制腐蚀功能，同时某些腐蚀抑制剂也具有氧原子捕获剂的功能。
组合物中使用的填料可以根据特定的电路组件所需的电阻，电导率，电容，或介电性能的所需范围来变化。对填料的类型和数量作出正确选择来适应特定的最终应用所需电子性能是在本领域技术人员所掌握的专业技术范围之内。应该理解所有的电阻器必然具有一定的导电性，同时所有的导体具有一定的电阻性，电阻器和导体根据个体材料的特定性能形成一个电阻与导电的连续区。绝缘体和电容器也有这样的连续区。绝缘体可以作为真正的绝缘体或隔离组件，或是作为电容器，这要根据特定的介电常数来定。
示例性的导电填料可以是银、铜、金、钯、铂、炭黑、碳纤维、石墨、铝、铟锡氧化物、镀银的铜、镀银的铝、镀金属的玻璃球和掺锑的氧化锡。示例性的惰性填料包括滑石、二氧化硅、硅酸盐、氮化铝和云母。示例性的电容/绝缘填料，本文中也被当作惰性填料的有陶瓷、钛酸钡、和二氧化钛。此外导电性纳米填料，如碳纳米管和/或非导电纳米填料，如硅酸盐也可以使用。
组合物可以通过暴露在辐射NIR能量里来发生固化。辐射NIR能量可以通过很多来源供给，这对于本领域技术人员是显而易见的。例子有激光器、高压弧形氙灯，螺旋钨丝灯、陶瓷辐射加热器、钨卤灯。优选有近NIR光谱的辐射能量。灯和激光器都是NIR能量的有效来源。
在700至约5000nm处有波长峰值的NIR能量可以用于本发明实践中。能够制造实施本发明要求的辐射NIR能量的商业来源设备包括，但不限于Research Inc.(Eden Praire，MN)，Chromalox(Ogden，UT)，DRI(Clearwater，FL)，Advent Electric Inc.(Bridgeport，PA)，及Glo-Quartz Inc.(Mentor，OH)。
本发明的粘合剂制剂可以根据所需的表面积大小和覆盖重量来连续或不连续使用。特别的模式可以用来优化底材/粘合剂的接触方式。珠大小、厚度、分隔距离和模式随粘合剂而变化。粘合剂可以使用本领域公知的任何方法来施用于底材上，包括，但不局限于喷涂，辊涂、涂漆、干刷、浸涂、缝涂，涡喷、印刷(如喷墨印刷)，凸版印刷，挤塑、喷雾、凹版印刷(花纹轮子传递(patternwheel transfer))、静电喷涂、气相沉积、纤维化和/或丝网印刷。粘合组合物应用到底材上的方法不是实施本发明的关键。
固化效率，也就是粘合剂在短时间内固化的能力，取决于能量源(如灯或激光器)的功率、能量源距粘合剂的距离、能量源的数量等，这基于本文的公开内容是显而易见的。固化时间依赖粘合剂的接受能力，而接受能力依赖于粘合剂的覆盖重量或厚度及辐射源供给粘合剂的能量通量密度(如每单位面积的强度)。能量通量密度是指灯或能量源的距离，焦点，功率和强度。
优选地，配制粘合剂以便在接受小于1200瓦/平方英寸的NIR能量照射，更优选小于800瓦/平方英寸的NIR能量，持续时间小于10秒，优选小于5秒，更优选小于3秒时发生固化。优选热固性粘合剂，其在施用到底材上后接受短时间NIR能量，优选小于10秒，更优选小于2秒，尤其优选小于0.5秒即发生固化。
已经发现当一种合适的NIR吸收成分添加到某些常规粘合剂里时，可以使其固化速度在接受短时间辐射能量照射后得到意料不到快速提高。虽然一些传统的粘合剂对于NIR基本上是透明的，但含有环氧和任选的氰酸酯和一种NIR吸收成分的本发明粘合剂吸收并反射该能量。
NIR吸收成分包括那些染料、颜料、填料、聚合物和树脂或其它能够吸收能量并提供最理想的吸收、反射、发射和传导平衡的成分。可以举例的有炭黑、石墨、溶剂红(2`，3-二甲基-4-(2-羟基-萘基偶氮)偶氮-苯)，溶剂绿，染料如森林绿和和品蓝母炼胶染料，可商购自Clarint，花青基染料，氧化物如二氧化钛，四(二烷基氨基苯基)铵染料、squarylium染料、金属络合物、醌、偶氮、多苯基甲烷自由基、苝、芳香轮烯、芴化物及其混合物。所述能量吸收成分具有不同的吸收特性。例如，卤代1，4，5，8-四苯胺基蒽醌在860nm附近具有良好的吸收性，并且还可以吸收其它波长范围内的NIR。另一个例子是squaraine，具有在较长波长产生强的窄吸收波段的特性。特别提及的酞菁染料化合物已经被证实对可见光具有高透射比，对近红外提供了高效的截断。
优选的实施本发明所采用的NIR吸收成分是广泛的，包括NIR吸收剂如Epolight 1125(Epolene.Inc)，SDA6248(H.W.Sands Corp.)，SDA2072(H.W.SandsCorp.)和炭黑。炭黑可以使用不同的方法来制备，如加热炉黑法，煤气(管道)黑法及灯黑法。影响上述不同方法制备的炭黑对辐射能量的吸收性能的关键参数是初级颗粒平均粒径，表面化学和聚集体结构。实施本发明所用的NIR吸收成分典型的在约400nm-约100,000nm范围内有吸收，优选约700nm-约10,000nm，更优选约700nm-约5000nm。
NIR吸收成分可以在制备基础粘合剂的任意时间搅拌加入，或制备完基础粘合剂加入。添加量要根据添加剂的类型，大小和溶解或分散性能而定。添加剂的添加量是使粘合剂接受短时间辐射能量(典型的小于2秒)后发生固化的有效量。典型的，添加剂的量为在每100份粘合剂组合物中占约0.001-约10份。
颜料，如炭黑和石墨，天然的是颗粒状的，具有几分球形外表，平均粒径约0.01-约7微米。颜料颗粒会发生聚集，因此聚集体的粒径会大些。优选颜料聚集体粒径小于约500微米。聚集体粒径小于约100微米是优选的，更优选小于约50微米。
可以通过将期望的粘合剂与所选不同粒度和数量的添加剂混合来确定应用在本发明的导电性粘合剂中合适的NIR吸收成分。对于本领域技术人员显而易见的将NIR吸收成分与粘合剂混合的任何常规方法都可以用来制备本发明的粘合组合物，如用浆式混合机或高剪切混合机如Ross ME-100LC挤压机。起始粘合剂和含有NIR吸收成分的粘合剂接下来用辐射热源发出的光来加热各自的样品从而进行比较。合适的添加剂是那些具有合意的粘合强度和固化速度的添加剂。含有覆盖了吸收剂的填料和包封的吸收剂的粘合剂也包括在本发明范围之内。
本发明实施方案中粘合剂组合物含有至多约10重量％(但不等于0％)的能量吸收添加剂；约10-90重量％的树脂，约1-90重量％的填料；任选约0-50重量％的稀释剂；和约0-80重量％的惰性填料。
在另一个实施方案中，本发明是一种提高导电或电阻组合物固化速度的方法，包括向组合物中添加一种或多种近红外吸收添加剂。
本发明用以下非限制性实施例来作进一步说明。
实施例
实施例1.如表1所示用树脂和银填料制成三种不同导电粘合剂。
表1.粘合剂制剂
  制剂   1(wt％)   2(wt％)   3(wt％)
  环氧树脂/氰酸酯混合物   35   --   --
  环氧树脂   --   20   --
  丙烯酸酯   --   --   25
  银   65   80   75
有和没有添加剂的每个样品的固化时间通过在红外带状炉进行固化来测定，结果如表2所示。
表2.含和不含添加剂的粘合剂的固化
  固化温度(℃)   固化时间(秒)   制剂1   制剂1w/0.25wt％炭黑   制剂1w/1wt％绿染料   制剂3
  73   4   未固化
  120*   2   未固化   部分固化
  150   2   部分固化   完全固化   完全固化
  150   4   完全固化
  150   10   部分固化
  150   20   完全固化
  180   2   未固化
*固化在热板上进行
NIR实验和电阻测定方法如下：粘合剂样品夹在聚对苯二甲酸酸乙二酯(PET)底材中间，其中底部底材含有银墨衬垫并用雏菊链花纹连接，顶部底材含有不相连的银墨衬垫。底材之间放置成顶部银墨衬垫形成在底部底材上连接的墨垫间的桥梁。每个测试样品都含有由5个所述电桥组成的环路，电阻是横越这些环路测定的。这些样品的尺寸约1英寸长，1/16英寸宽。这些样品使用直线固化方法借助于NIR来固化，即允许样品在NIR灯源下以10-350英尺每分钟的有效线速度水平移动(等于8-0.225秒的暴露时间)，测定的固化温度根据NIR灯源功率在75-95℃之间变化。固化后，每个制剂的环路电阻用微欧姆计测量，结果如表3，4和5所示。
表3.无添加剂的导电粘合剂的环路电阻
  固化方法   固化温度(℃)   固化时间(秒)   制剂1   制剂2   制剂3
  热板   110   10   1.7-1.8   --   0.9
  热板   125   120   --   0.8   --
炭黑或NIR染料被添加到制剂中，样品用NIR固化，使用3200瓦灯，在800瓦/平方英寸下变化样品与灯的暴露距离。每个制剂的测定结果如表4A，4B和4C所示。
表4A-制剂1的环路电阻和固化时间
  炭黑(wt％)   --   --   --   0.25   0.25   --   --
  NIR染料(wt％)   --   --   --   --   --   0.5   1.0
  灯功率(％)   100   100   100   100   100   100   100
  灯距(内)   8   8   8   8   8   8   8
  固化时间(秒)   0.399   0.319   0.266   0.399   0.319   0.319   0.319
  环路电阻(欧姆)   1.2-1.5   3.8-4.0   4.4   1.2-1.3   2.0-2.7   1.2-1.6   1.4-1.6
表4B-制剂2的环路电阻和固化时间
  炭黑(wt％)   --   --   1.0   --
  NIR染料(wt％)   --   --   --   1.0
  灯功率(％)   30   60   60   60
  灯距(内)   16   16   16   16
  固化时间(秒)   5.32   1.12   1.12   1.12
  环路电阻(欧姆)   1.1-1.2   1.2-1.9   1.4   1.3-2.9
表4C-制剂3的环路电阻和固化时间
  炭黑(wt％)   --   --   --   0.25   --
  NIR染料(wt％)   --   --   --   --   1.0
  灯功率(％)   70   100   100   100   100
  灯距(内)   16   8   8   8   8
  固化时间(秒)   0.8   0.532   0.399   0.399   0.399
  环路电阻(欧姆)   1.1   1.3   6   --   --
如表2，3和4A-4C所示，未改性的导电粘合剂在接受了NIR辐射后的固化速度比用红外带状炉或热板提高许多。如表4A-4C所示，添加能量吸收添加剂给不同粘合剂带来了不同的益处。如表4A所示，给含有环氧/氰酸酯混合物的粘合剂添加炭黑或绿染料使其具有了快速的固化时间和理想的环路电阻水平。如表4B所示，环氧基粘合剂加或不加添加剂都产生了相似的电阻结果。最后，表4C表明不需加能量吸收添加剂，丙烯酸酯基粘合剂表现出快速固化。
实施例2.实施例1的制剂1在红外炉中不同温度和暴露时间下发生固化。在测试中，0.25重量％的炭黑和1重量％的绿染料被添加到样品中。结果如表5所示。
表5.用红外炉固化的制剂1的电阻
  制剂   温度(℃)   固化时间(秒)   电阻(欧姆)
  1   125   10   1.152
  1W/绿染料   125   10   0.893
  1W/炭黑   125   10   1.632
  1   125   2   无读数
  1W/绿染料   125   2   9×106
  1W/炭黑   125   2   无读数
  1   200   2   3.412
  1W/绿染料   200   2   1.063
  1W/炭黑   200   2   1.072
  1   200   1.334   8.32
  1W/绿染料   200   1.334   75
  1W/炭黑   200   1.334   5.54
  1   200   0.667   302
  1W/绿染料   200   0.667   33.65
  1W/炭黑   200   0.667   29.24
22次试验平均值
33次试验平均值
44次试验平均值
55次试验平均值
如表4A-4C和表5的比较结果来看，用NIR固化使粘合剂的电阻值比用红外带炉固化提高了。
可以对本发明作很多改动和变化，而不脱离本发明的实质和范围，这对于本领域技术人员来说是显而易见的。这里所描述的特定实施方案仅仅作为举例说明，本发明只受所附权利要求的字面含义，以及与权利要求所要求保护的内容属等同发明的所有范围的限制。

Claims (43)

1.一种固化用于电子装置的组合物的方法，包括将组合物施用到底材上，然后使组合物接受足够长时间的近红外辐射源照射以固化组合物的步骤。
2.权利要求1所述的方法，其中组合物是导电的、电阻的或导电性各向异性的。
3.权利要求1所述的方法，进一步包括在组合物施用到底材上之前，向该组合物添加近红外吸收添加剂的步骤。
4.权利要求1所述的方法，其中组合物暴露在近红外辐射源下的时间小于约10秒。
5.权利要求4所述的方法，其中组合物暴露在近红外辐射源下的时间小于2秒。
6.权利要求5所述的方法，其中组合物暴露在近红外辐射源下的时间小于0.5秒。
7.权利要求1所述的方法，其中组合物暴露于在约700nm-约5,000nm有波长峰的近红外辐射。
8.权利要求1所述的方法，其中组合物的固化时间足够使组合物的电阻小于约2欧姆。
9.权利要求8所述的方法，其中组合物的固化时间足够使组合物的电阻小于约1.5欧姆。
10.权利要求3所述的方法，其中近红外吸收添加剂选自宽带NIR吸收剂，炭黑、石墨、溶剂红(2`，3-二甲基-4-(2-羟基-萘基偶氮)偶氮-苯)，溶剂绿、染料、花青基染料、氧化物、二氧化钛、四(二烷基氨基苯基)铵染料、squarylium染料、金属络合物、醌、偶氮、多苯基甲烷自由基、苝、芳香轮烯、芴化物、卤代1，4，5，8-四苯胺基蒽醌、squaraine、酞菁染料及它们的混合物。
11.一种固化用于电子装置的组合物的方法，包括将组合物施用到底材上，把电子组件紧贴组合物放置，然后使组合物接受足够长时间的近红外辐射源照射以固化组合物的步骤。
12.权利要求11的方法，其中组合物是导电的、电阻的或导电性各向异性的。
13.权利要求11所述的方法，进一步包括在组合物施用到底材上之前，向该组合物添加近红外吸收添加剂的步骤。
14.权利要求11所述的方法，其中组合物暴露在近红外辐射源下的时间小于约10秒。
15.权利要求14所述的方法，其中组合物暴露在近红外辐射源下的时间小于2秒。
16.权利要求15所述的方法，其中组合物暴露在近红外辐射源下的时间小于0.5秒。
17.权利要求11所述的方法，其中组合物暴露于在约700nm-约5,000nm有波长峰的近红外辐射。
18.权利要求11所述的方法，其中组合物的固化时间足够使组合物的电阻小于约2欧姆。
19.权利要求18所述的方法，其中组合物的固化时间足够使组合物的电阻小于约1.5欧姆。
20.一种用于电子设备的组合物，含有有效量的近红外吸收成分以提高其暴露于近红外辐射时的固化速度。
21.权利要求20的组合物，其中组合物是导电的、电阻的或导电性各向异性的。
22.权利要求20的组合物，其中组合物含有一种或多种树脂和一种或多种填料。
23.权利要求22的组合物，其中所述一种或多种树脂选自环氧树脂，氰酸酯，丙烯酸酯及其混合物。
24.权利要求23的组合物，其中所述一种或多种填料选自银、铜、金、钯、铂、炭黑、碳纤维、石墨、铝、铟锡氧化物、镀银的铜、镀银的铝、镀金属的玻璃球、掺锑的氧化锡、滑石、二氧化硅、硅酸盐、氮化铝、云母、陶瓷、钛酸钡、二氧化钛、纳米填料、硅酸盐、碳纳米管及它们的混合物。
25.权利要求20所述的组合物，还含有腐蚀抑制剂、稀释剂、氧原子捕获剂、粘合促进剂或它们的混合物中的一种或多种。
26.权利要求20所述的组合物，其中近红外吸收添加剂选自宽带NIR吸收剂，炭黑、石墨、溶剂红(2`，3-二甲基-4-(2-羟基-萘基偶氮)偶氮-苯)、溶剂绿、染料、花青基染料、氧化物、二氧化钛、四(二烷基氨基苯基)铵染料、squarylium染料、金属络合物、醌、偶氮、多苯基甲烷自由基、苝、芳香轮烯、芴化物、卤代1，4，5，8-四苯胺基蒽醌、squaraine、酞菁染料及它们的混合物。
27.权利要求20所述的组合物，其中组合物暴露在近红外辐射源下小于10秒钟就可以固化。
28.权利要求27所述的组合物，其中组合物暴露在近红外辐射源下小于2秒钟就可以固化。
29.权利要求28所述的组合物，其中组合物暴露在近红外辐射源下小于约0.5秒钟就可以固化。
30.权利要求20所述的组合物，其中组合物暴露于在约700nm-约5,000nm有波长峰的近红外辐射下发生固化。
31.权利要求20所述的组合物，其暴露在约1200瓦/平方英寸的近红外能量下小于约10秒可以发生固化。
32.权利要求31所述的组合物，其暴露在约800瓦/平方英寸的近红外能量下小于约10秒可以发生固化。
33.权利要求20所述的组合物，其中近红外吸收成分包括有机染料。
34.权利要求20所述的组合物，其中近红外吸收成分包括一种或多种颜料。
35.权利要求34所述的组合物，其中颜料是炭黑。
36.权利要求34所述的组合物，其中颜料是石墨。
37.权利要求20所述的组合物，其中组合物是导电性粘合剂。
38.一种含有权利要求19所述的组合物的底材。
39.权利要求38所述的底材，其中组合物通过下述方式施用到底材的至少一个预定部位：喷涂，辊涂、涂漆、干刷、浸涂、缝涂、涡喷、印刷、凸版印刷、挤塑、喷雾、纤维化、凹版印刷、静电喷涂、气相沉积和/或丝网印刷。
40.权利要求38所述的底材，其中组合物是以非连续涂层使用的。
41.权利要求38所述的底材，其中组合物是以连续涂层使用的。
42.权利要求38所述的底材，其中底材是电子电路板。
43.一种含有权利要20所述组合物的电子装置。
CNA2005100783356A 2004-05-06 2005-05-08 用于电子装置的组合物 Pending CN1693404A (zh)

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