CN1649082A - 平面显示装置的制造装置 - Google Patents
平面显示装置的制造装置 Download PDFInfo
- Publication number
- CN1649082A CN1649082A CNA2004100983358A CN200410098335A CN1649082A CN 1649082 A CN1649082 A CN 1649082A CN A2004100983358 A CNA2004100983358 A CN A2004100983358A CN 200410098335 A CN200410098335 A CN 200410098335A CN 1649082 A CN1649082 A CN 1649082A
- Authority
- CN
- China
- Prior art keywords
- laser
- mentioned
- intensity distribution
- optical axis
- optical element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 46
- 230000003287 optical effect Effects 0.000 claims abstract description 189
- 238000009826 distribution Methods 0.000 claims abstract description 135
- 238000007493 shaping process Methods 0.000 claims abstract description 102
- 230000007246 mechanism Effects 0.000 claims abstract description 48
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 37
- 239000010703 silicon Substances 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000012545 processing Methods 0.000 claims abstract description 21
- 239000010409 thin film Substances 0.000 claims abstract description 21
- 238000009434 installation Methods 0.000 claims description 39
- 230000033228 biological regulation Effects 0.000 claims description 31
- 238000001514 detection method Methods 0.000 claims description 24
- 239000010408 film Substances 0.000 claims description 17
- 239000007787 solid Substances 0.000 claims description 14
- 230000005855 radiation Effects 0.000 claims description 12
- 230000010355 oscillation Effects 0.000 claims description 6
- 230000006872 improvement Effects 0.000 claims description 4
- 238000004033 diameter control Methods 0.000 claims description 3
- 230000010365 information processing Effects 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 20
- 230000008859 change Effects 0.000 description 14
- 238000012937 correction Methods 0.000 description 11
- 230000001678 irradiating effect Effects 0.000 description 11
- 238000002425 crystallisation Methods 0.000 description 10
- 230000008025 crystallization Effects 0.000 description 10
- 238000013461 design Methods 0.000 description 10
- 239000012528 membrane Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 229910021417 amorphous silicon Inorganic materials 0.000 description 9
- 238000004088 simulation Methods 0.000 description 9
- 238000000137 annealing Methods 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229920005591 polysilicon Polymers 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 239000011435 rock Substances 0.000 description 4
- 238000009827 uniform distribution Methods 0.000 description 4
- 239000000284 extract Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Recrystallisation Techniques (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004022444A JP4567984B2 (ja) | 2004-01-30 | 2004-01-30 | 平面表示装置の製造装置 |
JP2004022444 | 2004-01-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1649082A true CN1649082A (zh) | 2005-08-03 |
CN100343951C CN100343951C (zh) | 2007-10-17 |
Family
ID=34805660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100983358A Active CN100343951C (zh) | 2004-01-30 | 2004-12-03 | 平面显示装置的制造装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7193693B2 (zh) |
JP (1) | JP4567984B2 (zh) |
KR (1) | KR100711155B1 (zh) |
CN (1) | CN100343951C (zh) |
TW (1) | TWI262598B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7557050B2 (en) | 2005-04-06 | 2009-07-07 | Samsung Electroncis Co., Ltd. | Method of manufacturing polysilicon thin film and method of manufacturing thin film transistor having the same |
CN1848365B (zh) * | 2005-04-06 | 2010-04-07 | 三星电子株式会社 | 多晶硅薄膜制造方法和具有其的薄膜晶体管的制造方法 |
CN101104223B (zh) * | 2006-07-10 | 2012-05-23 | 彩霸阳光株式会社 | 激光加工装置 |
CN108262565A (zh) * | 2016-12-27 | 2018-07-10 | 株式会社迪思科 | 激光装置 |
CN109243968A (zh) * | 2017-07-10 | 2019-01-18 | 三星显示有限公司 | 激光晶化装置的监控系统及监控方法 |
CN109643009A (zh) * | 2016-08-31 | 2019-04-16 | 亮锐控股有限公司 | 具有定制的光照图案的基于激光器的光源 |
CN114994850A (zh) * | 2022-04-25 | 2022-09-02 | 深圳市路远智能装备有限公司 | 一种光路校准方法 |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4406540B2 (ja) * | 2003-03-28 | 2010-01-27 | シャープ株式会社 | 薄膜トランジスタ基板およびその製造方法 |
KR100753568B1 (ko) * | 2003-06-30 | 2007-08-30 | 엘지.필립스 엘시디 주식회사 | 비정질 반도체층의 결정화방법 및 이를 이용한 액정표시소자의 제조방법 |
US7405815B1 (en) * | 2003-11-04 | 2008-07-29 | The Boeing Company | Systems and methods for characterizing laser beam quality |
US7374985B2 (en) * | 2003-11-20 | 2008-05-20 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus and method for manufacturing semiconductor device |
TW200541078A (en) * | 2004-03-31 | 2005-12-16 | Adv Lcd Tech Dev Ct Co Ltd | Crystallization apparatus, crystallization method, device, optical modulation element, and display apparatus |
JP2007221062A (ja) * | 2006-02-20 | 2007-08-30 | Sharp Corp | 半導体デバイスの製造方法および製造装置 |
US7397546B2 (en) * | 2006-03-08 | 2008-07-08 | Helicos Biosciences Corporation | Systems and methods for reducing detected intensity non-uniformity in a laser beam |
US7941237B2 (en) * | 2006-04-18 | 2011-05-10 | Multibeam Corporation | Flat panel display substrate testing system |
JP5030524B2 (ja) * | 2006-10-05 | 2012-09-19 | 株式会社半導体エネルギー研究所 | レーザアニール方法及びレーザアニール装置 |
JP5126471B2 (ja) * | 2007-03-07 | 2013-01-23 | 株式会社ジャパンディスプレイイースト | 平面表示装置の製造方法 |
JP5581563B2 (ja) * | 2007-03-08 | 2014-09-03 | 株式会社日立製作所 | 照明装置並びにそれを用いた欠陥検査装置及びその方法並びに高さ計測装置及びその方法 |
JP5376707B2 (ja) * | 2008-01-24 | 2013-12-25 | 株式会社半導体エネルギー研究所 | レーザアニール装置 |
US8723073B2 (en) * | 2008-02-07 | 2014-05-13 | Cymer, Llc | Illumination apparatus and method for controlling energy of a laser source |
WO2012008103A1 (ja) | 2010-07-16 | 2012-01-19 | パナソニック株式会社 | 結晶性半導体膜の製造方法及び結晶性半導体膜の製造装置 |
KR101777289B1 (ko) * | 2010-11-05 | 2017-09-12 | 삼성디스플레이 주식회사 | 연속측면고상화(Sequential Lateral Solidification:SLS)를 이용한 결정화 장치 |
US9255891B2 (en) * | 2012-11-20 | 2016-02-09 | Kla-Tencor Corporation | Inspection beam shaping for improved detection sensitivity |
EP3067132A1 (en) * | 2015-03-11 | 2016-09-14 | SLM Solutions Group AG | Method and apparatus for producing a three-dimensional work piece with thermal focus shift compensation of the laser |
US10016843B2 (en) | 2015-03-20 | 2018-07-10 | Ultratech, Inc. | Systems and methods for reducing pulsed laser beam profile non-uniformities for laser annealing |
KR102509883B1 (ko) * | 2015-06-29 | 2023-03-13 | 아이피지 포토닉스 코포레이션 | 비정질 실리콘 기재의 균일한 결정화를 위한 섬유 레이저-기반 시스템 |
US10324045B2 (en) | 2016-08-05 | 2019-06-18 | Kla-Tencor Corporation | Surface defect inspection with large particle monitoring and laser power control |
CN106783536B (zh) * | 2016-11-29 | 2021-11-30 | 京东方科技集团股份有限公司 | 激光退火设备、多晶硅薄膜和薄膜晶体管的制备方法 |
JP6419901B1 (ja) * | 2017-06-20 | 2018-11-07 | 株式会社アマダホールディングス | レーザ加工機 |
CN108581243B (zh) * | 2018-05-15 | 2020-06-09 | 大族激光科技产业集团股份有限公司 | 激光焦点偏移量消除方法 |
KR102154609B1 (ko) * | 2018-11-06 | 2020-09-10 | 주식회사 이솔 | 레이저빔을 이용하여 가공대상물을 베이킹(baking) 가공 하는 레이저 시스템 및 이를 이용한 가공 방법 |
DE102019102512A1 (de) * | 2019-01-31 | 2020-08-06 | Trumpf Laser- Und Systemtechnik Gmbh | Lasersystem |
US11703460B2 (en) | 2019-07-09 | 2023-07-18 | Kla Corporation | Methods and systems for optical surface defect material characterization |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07185861A (ja) * | 1993-12-27 | 1995-07-25 | Matsushita Electric Ind Co Ltd | レーザ加工装置 |
JPH11162868A (ja) * | 1997-12-02 | 1999-06-18 | Toshiba Corp | レ−ザ照射装置 |
JPH11283933A (ja) | 1998-01-29 | 1999-10-15 | Toshiba Corp | レ―ザ照射装置,非単結晶半導体膜の製造方法及び液晶表示装置の製造方法 |
JP2000042777A (ja) * | 1998-07-29 | 2000-02-15 | Sumitomo Heavy Ind Ltd | レーザビームのドリフト補正装置及びこれを用いたレーザ加工装置、並びに加工用レーザビームのドリフト補正方法 |
TW457553B (en) * | 1999-01-08 | 2001-10-01 | Sony Corp | Process for producing thin film semiconductor device and laser irradiation apparatus |
TW444247B (en) * | 1999-01-29 | 2001-07-01 | Toshiba Corp | Laser beam irradiating device, manufacture of non-single crystal semiconductor film, and manufacture of liquid crystal display device |
JP2001102323A (ja) * | 1999-09-30 | 2001-04-13 | Matsushita Electric Ind Co Ltd | レーザアニール装置および薄膜トランジスタの製造方法 |
JP4358998B2 (ja) | 2001-02-01 | 2009-11-04 | 株式会社日立製作所 | 薄膜トランジスタ装置およびその製造方法 |
JP2003053578A (ja) | 2001-08-15 | 2003-02-26 | Sumitomo Heavy Ind Ltd | レーザビームのプロファイル調整方法及び装置 |
JP3903761B2 (ja) * | 2001-10-10 | 2007-04-11 | 株式会社日立製作所 | レ−ザアニ−ル方法およびレ−ザアニ−ル装置 |
JP4279498B2 (ja) * | 2002-02-28 | 2009-06-17 | 株式会社 液晶先端技術開発センター | 半導体薄膜の形成方法、半導体薄膜の形成装置および結晶化方法 |
JP2003347236A (ja) * | 2002-05-28 | 2003-12-05 | Sony Corp | レーザ照射装置 |
JP2004165598A (ja) | 2002-06-05 | 2004-06-10 | Hitachi Displays Ltd | アクティブ・マトリクス型表示装置とその製造方法 |
TW575866B (en) * | 2002-06-05 | 2004-02-11 | Hitachi Ltd | Display device with active-matrix transistor and method for manufacturing the same |
JP2004202516A (ja) * | 2002-12-24 | 2004-07-22 | Matsushita Electric Ind Co Ltd | レーザ加工装置およびレーザ加工方法 |
JP4215563B2 (ja) * | 2003-05-19 | 2009-01-28 | 日本電気株式会社 | 半導体薄膜改質方法 |
JP2005217209A (ja) * | 2004-01-30 | 2005-08-11 | Hitachi Ltd | レーザアニール方法およびレーザアニール装置 |
-
2004
- 2004-01-30 JP JP2004022444A patent/JP4567984B2/ja not_active Expired - Fee Related
- 2004-10-12 TW TW093130892A patent/TWI262598B/zh not_active IP Right Cessation
- 2004-11-18 KR KR1020040094396A patent/KR100711155B1/ko not_active IP Right Cessation
- 2004-11-19 US US10/991,482 patent/US7193693B2/en active Active
- 2004-12-03 CN CNB2004100983358A patent/CN100343951C/zh active Active
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7557050B2 (en) | 2005-04-06 | 2009-07-07 | Samsung Electroncis Co., Ltd. | Method of manufacturing polysilicon thin film and method of manufacturing thin film transistor having the same |
CN1848365B (zh) * | 2005-04-06 | 2010-04-07 | 三星电子株式会社 | 多晶硅薄膜制造方法和具有其的薄膜晶体管的制造方法 |
CN101104223B (zh) * | 2006-07-10 | 2012-05-23 | 彩霸阳光株式会社 | 激光加工装置 |
CN109643009A (zh) * | 2016-08-31 | 2019-04-16 | 亮锐控股有限公司 | 具有定制的光照图案的基于激光器的光源 |
CN109643009B (zh) * | 2016-08-31 | 2021-09-03 | 亮锐控股有限公司 | 具有定制的光照图案的基于激光器的光源 |
CN108262565A (zh) * | 2016-12-27 | 2018-07-10 | 株式会社迪思科 | 激光装置 |
CN109243968A (zh) * | 2017-07-10 | 2019-01-18 | 三星显示有限公司 | 激光晶化装置的监控系统及监控方法 |
CN109243968B (zh) * | 2017-07-10 | 2023-09-19 | 三星显示有限公司 | 激光晶化装置的监控系统及监控方法 |
CN114994850A (zh) * | 2022-04-25 | 2022-09-02 | 深圳市路远智能装备有限公司 | 一种光路校准方法 |
CN114994850B (zh) * | 2022-04-25 | 2024-05-24 | 深圳市路远智能装备有限公司 | 一种光路校准方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI262598B (en) | 2006-09-21 |
KR20050078188A (ko) | 2005-08-04 |
TW200534486A (en) | 2005-10-16 |
US20050170569A1 (en) | 2005-08-04 |
CN100343951C (zh) | 2007-10-17 |
JP4567984B2 (ja) | 2010-10-27 |
KR100711155B1 (ko) | 2007-04-24 |
JP2005217210A (ja) | 2005-08-11 |
US7193693B2 (en) | 2007-03-20 |
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Owner name: PANASONIC LCD CO., LTD. Free format text: FORMER OWNER: IPS ALPHA SUPPORT CO., LTD. Effective date: 20111212 Owner name: IPS ALPHA SUPPORT CO., LTD. Effective date: 20111212 |
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Effective date of registration: 20111212 Address after: Chiba County, Japan Co-patentee after: Panasonic Liquid Crystal Display Co.,Ltd. Patentee after: Hitachi Displays, Ltd. Address before: Chiba County, Japan Co-patentee before: IPS pioneer support complex, Inc. Patentee before: Hitachi Displays, Ltd. Effective date of registration: 20111212 Address after: Chiba County, Japan Co-patentee after: IPS pioneer support complex, Inc. Patentee after: Hitachi Displays, Ltd. Address before: Chiba County, Japan Patentee before: Hitachi Displays, Ltd. |
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Owner name: JAPAN DISPLAY, INC. Free format text: FORMER NAME: APAN DISPLAY EAST, INC. Owner name: APAN DISPLAY EAST, INC. Free format text: FORMER NAME: HITACHI DISPLAY CO., LTD. |
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Address after: Chiba County, Japan Patentee after: JAPAN DISPLAY Inc. Patentee after: Panasonic Liquid Crystal Display Co.,Ltd. Address before: Chiba County, Japan Patentee before: Japan Display East Inc. Patentee before: Panasonic Liquid Crystal Display Co.,Ltd. Address after: Chiba County, Japan Patentee after: Japan Display East Inc. Patentee after: Panasonic Liquid Crystal Display Co.,Ltd. Address before: Chiba County, Japan Patentee before: Hitachi Displays, Ltd. Patentee before: Panasonic Liquid Crystal Display Co.,Ltd. |
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Address after: Tokyo, Japan Patentee after: JAPAN DISPLAY Inc. Patentee after: Panasonic Liquid Crystal Display Co.,Ltd. Address before: Chiba County, Japan Patentee before: JAPAN DISPLAY Inc. Patentee before: Panasonic Liquid Crystal Display Co.,Ltd. |
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Application publication date: 20050803 Assignee: BOE TECHNOLOGY GROUP Co.,Ltd. Assignor: JAPAN DISPLAY Inc.|Panasonic Liquid Crystal Display Co.,Ltd. Contract record no.: 2013990000688 Denomination of invention: Apparatus for manufacturing flat panel display devices Granted publication date: 20071017 License type: Common License Record date: 20131016 |
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Effective date of registration: 20231018 Address after: Tokyo Patentee after: JAPAN DISPLAY Inc. Patentee after: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA Address before: Tokyo Patentee before: JAPAN DISPLAY Inc. Patentee before: Panasonic Liquid Crystal Display Co.,Ltd. |