CN1625930A - 芯片取下装置、装配系统和从晶片上取下芯片的方法 - Google Patents
芯片取下装置、装配系统和从晶片上取下芯片的方法 Download PDFInfo
- Publication number
- CN1625930A CN1625930A CNA038030640A CN03803064A CN1625930A CN 1625930 A CN1625930 A CN 1625930A CN A038030640 A CNA038030640 A CN A038030640A CN 03803064 A CN03803064 A CN 03803064A CN 1625930 A CN1625930 A CN 1625930A
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- Prior art keywords
- chip
- instrument
- take
- takes
- turning tool
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000012545 processing Methods 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000012432 intermediate storage Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000012423 maintenance Methods 0.000 claims 1
- 230000002349 favourable effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/799—Apparatus for disconnecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10203601A DE10203601A1 (de) | 2002-01-30 | 2002-01-30 | Chipentnahmevorrichtung, Chipentnahmesystem, Bestücksystem und Verfahren zum Entnehmen von Chips von einem Wafer |
DE10203601.2 | 2002-01-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1625930A true CN1625930A (zh) | 2005-06-08 |
CN100386014C CN100386014C (zh) | 2008-04-30 |
Family
ID=27588144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB038030640A Expired - Lifetime CN100386014C (zh) | 2002-01-30 | 2003-01-02 | 芯片取下装置、装配系统和从晶片上取下芯片的方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20030161711A1 (zh) |
EP (1) | EP1470747B2 (zh) |
JP (1) | JP2005517289A (zh) |
KR (1) | KR20040073598A (zh) |
CN (1) | CN100386014C (zh) |
DE (1) | DE10203601A1 (zh) |
WO (1) | WO2003065783A1 (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101689526B (zh) * | 2007-05-07 | 2012-07-11 | 综合制造科技有限公司 | 物件处理装置 |
CN105895567A (zh) * | 2015-02-16 | 2016-08-24 | 利益高科技有限公司 | 用于输送和倒装部件的设备和方法 |
WO2016161703A1 (zh) * | 2015-04-07 | 2016-10-13 | 嘉兴景焱智能装备技术有限公司 | 芯片倒装装置 |
CN106783717A (zh) * | 2016-12-23 | 2017-05-31 | 合肥矽迈微电子科技有限公司 | 芯片倒装贴片设备及方法 |
CN106783668A (zh) * | 2015-11-25 | 2017-05-31 | 京元电子股份有限公司 | 半导体元件翻面装置及其测试设备 |
CN107863314A (zh) * | 2016-09-21 | 2018-03-30 | 先进装配系统有限责任两合公司 | Fcob芯片在芯片‑传递装置的暂时存储 |
CN109699167A (zh) * | 2017-10-20 | 2019-04-30 | 先进装配系统有限责任两合公司 | 用于具有取出工具和翻转工具的芯片-传递装置的补充工具 |
CN109729708A (zh) * | 2017-10-20 | 2019-05-07 | 先进装配系统有限责任两合公司 | 模块化元件操纵装置 |
CN110817434A (zh) * | 2019-11-25 | 2020-02-21 | 广州市心鉴智控科技有限公司 | 手表镜片翻面装置 |
CN114556535A (zh) * | 2019-10-11 | 2022-05-27 | 松下知识产权经营株式会社 | 部件供给装置 |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004007703B3 (de) | 2004-02-16 | 2005-06-23 | Mühlbauer Ag | Vorrichtung und Verfahren zum Überprüfen und Umdrehen elektronischer Bauelemente |
KR100700704B1 (ko) * | 2005-05-20 | 2007-03-27 | 한미반도체 주식회사 | 반도체 제조공정용 플립퍼링장치 |
WO2007048445A1 (de) * | 2005-10-26 | 2007-05-03 | Alphasem Gmbh | Verfahren und vorrichtung zum ablegen von elektronischen bauteilen, insbesondere halbleiterchips auf einem substrat |
DE102006002367B3 (de) * | 2006-01-17 | 2007-10-04 | Mühlbauer Ag | Vorrichtung und Verfahren zur Übertragung einer Mehrzahl von Chips von einem Wafer auf ein Substrat |
DE502006006481D1 (de) | 2006-04-12 | 2010-04-29 | Kulicke & Soffa Die Bonding Gm | Verfahren und vorrichtung zum ablegen von elektronischen bauteilen, insbesondere halbleiterchips auf einem substrat |
US8167524B2 (en) * | 2007-11-16 | 2012-05-01 | Asm Assembly Automation Ltd | Handling system for inspecting and sorting electronic components |
SG156544A1 (en) | 2008-04-17 | 2009-11-26 | Semiconductor Technologies | Component handler |
DE102008051947B3 (de) * | 2008-10-16 | 2010-04-29 | Siemens Electronics Assembly Systems Gmbh & Co. Kg | Zuführeinrichtung zum Zuführen von Bauteilen zu einem Bestückautomaten |
KR101127884B1 (ko) * | 2009-08-19 | 2012-03-22 | 주식회사 쎄크 | 반도체 칩 반전장치 |
KR101134918B1 (ko) * | 2009-12-09 | 2012-04-17 | 주식회사 고려반도체시스템 | 반도체 칩의 이송 방법 및 반도체 칩의 이송용 피커 장치 |
US20130200915A1 (en) * | 2012-02-06 | 2013-08-08 | Peter G. Panagas | Test System with Test Trays and Automated Test Tray Handling |
JP2015050286A (ja) * | 2013-08-30 | 2015-03-16 | 株式会社東芝 | 剥離装置及び剥離方法 |
JP6405120B2 (ja) * | 2014-05-21 | 2018-10-17 | 株式会社Fuji | 部品実装システム |
DE102015013500A1 (de) | 2015-10-16 | 2017-04-20 | Mühlbauer Gmbh & Co. Kg | Bildgebender Sensor für eine Bauteilhandhabungsvorrichtung |
DE102015013495B4 (de) | 2015-10-16 | 2018-04-26 | Mühlbauer Gmbh & Co. Kg | Empfangseinrichtung für Bauteile und Verfahren zum Entnehmen fehlerhafter Bauteile aus dieser |
DE102015013494B3 (de) | 2015-10-16 | 2017-04-06 | Mühlbauer Gmbh & Co. Kg | Bauteilhandhabungsvorrichtung und Verfahren zum Entnehmen von Bauteilen von einem strukturierten Bauteilvorrat und zum Ablegen an einer Empfangseinrichtung |
JP5975556B1 (ja) | 2015-12-11 | 2016-08-23 | 上野精機株式会社 | 移載装置 |
JP6312270B2 (ja) * | 2016-03-25 | 2018-04-18 | 株式会社写真化学 | デバイスチップを用いた電子デバイスの製造方法およびその製造装置 |
CN107887293B (zh) | 2016-09-30 | 2020-06-16 | 上海微电子装备(集团)股份有限公司 | 一种批处理键合装置及键合方法 |
CN107887295B (zh) * | 2016-09-30 | 2019-07-23 | 上海微电子装备(集团)股份有限公司 | 一种芯片键合装置及键合方法 |
US10672638B2 (en) | 2017-01-27 | 2020-06-02 | International Business Machines Corporation | Picking up irregular semiconductor chips |
WO2018188731A1 (de) | 2017-04-11 | 2018-10-18 | Muehlbauer GmbH & Co. KG | Bauteil-empfangseinrichtung mit optischem sensor |
DE102017008869B3 (de) * | 2017-09-21 | 2018-10-25 | Mühlbauer Gmbh & Co. Kg | Bauteilzentrierung |
EP3503172B1 (en) * | 2017-12-20 | 2024-04-03 | Nexperia B.V. | Apparatus and system |
DE102018006760A1 (de) | 2018-08-27 | 2020-02-27 | Mühlbauer Gmbh & Co. Kg | Inspektion beim Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger |
JP7257296B2 (ja) * | 2019-09-06 | 2023-04-13 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
DE102019125127A1 (de) * | 2019-09-18 | 2021-03-18 | Mühlbauer Gmbh & Co. Kg | Bauteilhandhabung, Bauteilinspektion |
DE102019125134A1 (de) | 2019-09-18 | 2021-03-18 | Mühlbauer Gmbh & Co. Kg | Bauteilhandhabung, Bauteilinspektion |
KR102316940B1 (ko) * | 2019-11-08 | 2021-10-25 | 세메스 주식회사 | 다이 이송 모듈 및 이를 포함하는 다이 본딩 장치 |
KR102386337B1 (ko) * | 2019-11-08 | 2022-04-13 | 세메스 주식회사 | 다이 이송 모듈 및 이를 포함하는 다이 본딩 장치 |
DE102020202208A1 (de) | 2020-02-20 | 2021-08-26 | Asm Assembly Systems Gmbh & Co. Kg | Greifmodul für einen Drehbestückungskopf |
AR118939A1 (es) * | 2020-05-15 | 2021-11-10 | Marisa Rosana Lattanzi | Máquina combinada para elaborar separadores laminares de productos que se contienen en cajas y cajones |
DE102021111953A1 (de) | 2021-05-07 | 2022-11-10 | Mühlbauer Gmbh & Co. Kg | Optische Bauteilinspektion |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4372802A (en) * | 1980-06-02 | 1983-02-08 | Tokyo Denki Kagaku Kogyo Kabushiki Kaisha | Apparatus for mounting chip type circuit elements on printed circuit boards |
JPS60114708A (ja) * | 1983-11-26 | 1985-06-21 | Takeda Chem Ind Ltd | 固形製剤の搬送装置 |
US4626167A (en) * | 1984-03-22 | 1986-12-02 | Thomson Components-Mostek Corporation | Manipulation and handling of integrated circuit dice |
JP2537770B2 (ja) * | 1984-08-31 | 1996-09-25 | 松下電器産業株式会社 | 電子部品の装着方法 |
JPH0590789A (ja) * | 1991-09-26 | 1993-04-09 | Japan Tobacco Inc | ワーク実装機 |
JP3024457B2 (ja) * | 1993-09-30 | 2000-03-21 | 松下電器産業株式会社 | 電子部品実装装置および電子部品実装方法 |
DE9407004U1 (de) * | 1994-04-26 | 1994-10-27 | Siemens AG, 80333 München | Vorrichtung zum Bestücken von Leiterplatten mit Bauelementen |
JP3152091B2 (ja) * | 1994-12-02 | 2001-04-03 | 松下電器産業株式会社 | 電子部品実装装置 |
KR100319546B1 (ko) | 1996-02-29 | 2002-02-19 | 알파젬 아게 | 부품을수용,배향및조립하는방법및장치 |
US6173750B1 (en) | 1998-02-18 | 2001-01-16 | Hover-Davis, Inc. | Method and apparatus for removing die from a wafer and conveying die to a pickup location |
JP4027042B2 (ja) * | 1999-05-06 | 2007-12-26 | 松下電器産業株式会社 | 部品搭載装置及びその方法 |
-
2002
- 2002-01-30 DE DE10203601A patent/DE10203601A1/de not_active Withdrawn
-
2003
- 2003-01-02 WO PCT/DE2003/000003 patent/WO2003065783A1/de active Application Filing
- 2003-01-02 EP EP03701466.9A patent/EP1470747B2/de not_active Expired - Lifetime
- 2003-01-02 CN CNB038030640A patent/CN100386014C/zh not_active Expired - Lifetime
- 2003-01-02 KR KR10-2004-7011576A patent/KR20040073598A/ko not_active Application Discontinuation
- 2003-01-02 JP JP2003565221A patent/JP2005517289A/ja active Pending
- 2003-01-28 US US10/352,082 patent/US20030161711A1/en not_active Abandoned
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101689526B (zh) * | 2007-05-07 | 2012-07-11 | 综合制造科技有限公司 | 物件处理装置 |
US8727693B2 (en) | 2007-05-07 | 2014-05-20 | Manufacturing Integration Technology Ltd | Apparatus for object processing |
CN105895567A (zh) * | 2015-02-16 | 2016-08-24 | 利益高科技有限公司 | 用于输送和倒装部件的设备和方法 |
CN105895567B (zh) * | 2015-02-16 | 2019-04-16 | 利益高科技有限公司 | 用于输送和倒装部件的设备和方法 |
WO2016161703A1 (zh) * | 2015-04-07 | 2016-10-13 | 嘉兴景焱智能装备技术有限公司 | 芯片倒装装置 |
CN106783668A (zh) * | 2015-11-25 | 2017-05-31 | 京元电子股份有限公司 | 半导体元件翻面装置及其测试设备 |
CN107863314A (zh) * | 2016-09-21 | 2018-03-30 | 先进装配系统有限责任两合公司 | Fcob芯片在芯片‑传递装置的暂时存储 |
CN107863314B (zh) * | 2016-09-21 | 2021-10-26 | 先进装配系统有限责任两合公司 | Fcob芯片在芯片-传递装置的暂时存储 |
CN106783717A (zh) * | 2016-12-23 | 2017-05-31 | 合肥矽迈微电子科技有限公司 | 芯片倒装贴片设备及方法 |
CN109699167A (zh) * | 2017-10-20 | 2019-04-30 | 先进装配系统有限责任两合公司 | 用于具有取出工具和翻转工具的芯片-传递装置的补充工具 |
CN109729708A (zh) * | 2017-10-20 | 2019-05-07 | 先进装配系统有限责任两合公司 | 模块化元件操纵装置 |
CN109699167B (zh) * | 2017-10-20 | 2020-11-06 | 先进装配系统有限责任两合公司 | 用于具有取出工具和翻转工具的芯片-传递装置的补充工具 |
CN109729708B (zh) * | 2017-10-20 | 2020-11-06 | 先进装配系统有限责任两合公司 | 模块化元件操纵装置 |
CN114556535A (zh) * | 2019-10-11 | 2022-05-27 | 松下知识产权经营株式会社 | 部件供给装置 |
CN110817434A (zh) * | 2019-11-25 | 2020-02-21 | 广州市心鉴智控科技有限公司 | 手表镜片翻面装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2003065783A1 (de) | 2003-08-07 |
DE10203601A1 (de) | 2003-08-14 |
EP1470747B2 (de) | 2021-12-01 |
US20030161711A1 (en) | 2003-08-28 |
EP1470747B1 (de) | 2014-05-14 |
JP2005517289A (ja) | 2005-06-09 |
EP1470747A1 (de) | 2004-10-27 |
KR20040073598A (ko) | 2004-08-19 |
CN100386014C (zh) | 2008-04-30 |
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Address after: Munich, Germany Patentee after: ASM Assembly Systems GmbH & Co. KG Address before: Munich, Germany Patentee before: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GmbH & Co.KG |
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