CN1536542A - 具有薄膜晶体管的平板显示器 - Google Patents
具有薄膜晶体管的平板显示器 Download PDFInfo
- Publication number
- CN1536542A CN1536542A CNA2003101240593A CN200310124059A CN1536542A CN 1536542 A CN1536542 A CN 1536542A CN A2003101240593 A CNA2003101240593 A CN A2003101240593A CN 200310124059 A CN200310124059 A CN 200310124059A CN 1536542 A CN1536542 A CN 1536542A
- Authority
- CN
- China
- Prior art keywords
- grain boundary
- channel region
- tft
- film transistor
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 57
- 239000013078 crystal Substances 0.000 claims abstract description 70
- 239000004065 semiconductor Substances 0.000 claims abstract description 10
- 238000002425 crystallisation Methods 0.000 claims description 76
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 25
- 229920005591 polysilicon Polymers 0.000 claims description 25
- 230000005012 migration Effects 0.000 claims description 5
- 238000013508 migration Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 156
- 230000008025 crystallization Effects 0.000 description 74
- 238000000034 method Methods 0.000 description 38
- 229910021417 amorphous silicon Inorganic materials 0.000 description 16
- 239000012528 membrane Substances 0.000 description 16
- 238000005401 electroluminescence Methods 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 10
- 238000009413 insulation Methods 0.000 description 9
- 239000012044 organic layer Substances 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000005224 laser annealing Methods 0.000 description 3
- 229920002521 macromolecule Polymers 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000004304 visual acuity Effects 0.000 description 3
- MBPCKEZNJVJYTC-UHFFFAOYSA-N 4-[4-(n-phenylanilino)phenyl]aniline Chemical compound C1=CC(N)=CC=C1C1=CC=C(N(C=2C=CC=CC=2)C=2C=CC=CC=2)C=C1 MBPCKEZNJVJYTC-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- -1 naphthalene-1-yl Chemical group 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007850 degeneration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000005499 laser crystallization Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- VVOPUZNLRVJDJQ-UHFFFAOYSA-N phthalocyanine copper Chemical compound [Cu].C12=CC=CC=C2C(N=C2NC(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2N1 VVOPUZNLRVJDJQ-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- NRYGNLJQFASBEF-UHFFFAOYSA-N thiophene-2,3-diol Chemical compound OC=1C=CSC=1O NRYGNLJQFASBEF-UHFFFAOYSA-N 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
- H01L27/1274—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
- H01L27/1285—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor using control of the annealing or irradiation parameters, e.g. using different scanning direction or intensity for different transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1296—Multistep manufacturing methods adapted to increase the uniformity of device parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20738/03 | 2003-04-02 | ||
KR20738/2003 | 2003-04-02 | ||
KR10-2003-0020738A KR100496300B1 (ko) | 2003-04-02 | 2003-04-02 | 박막 트랜지스터를 구비한 평판표시장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1536542A true CN1536542A (zh) | 2004-10-13 |
CN100517423C CN100517423C (zh) | 2009-07-22 |
Family
ID=33095608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003101240593A Expired - Lifetime CN100517423C (zh) | 2003-04-02 | 2003-12-31 | 具有薄膜晶体管的平板显示器 |
Country Status (3)
Country | Link |
---|---|
US (2) | US6876001B2 (zh) |
KR (1) | KR100496300B1 (zh) |
CN (1) | CN100517423C (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104701265A (zh) * | 2015-03-27 | 2015-06-10 | 深圳市华星光电技术有限公司 | 低温多晶硅tft基板结构及其制作方法 |
WO2018161624A1 (en) * | 2017-03-10 | 2018-09-13 | Boe Technology Group Co., Ltd. | Array substrate, fabrication method thereof, driving transistor and display panel |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100496297B1 (ko) * | 2003-03-06 | 2005-06-17 | 삼성에스디아이 주식회사 | 박막 트랜지스터를 구비한 평판표시장치 |
KR100490552B1 (ko) * | 2003-03-13 | 2005-05-17 | 삼성에스디아이 주식회사 | 박막 트랜지스터를 구비한 평판표시장치 |
US7385223B2 (en) * | 2003-04-24 | 2008-06-10 | Samsung Sdi Co., Ltd. | Flat panel display with thin film transistor |
TWI285783B (en) | 2004-07-09 | 2007-08-21 | Au Optronics Corp | Poly silicon layer structure and forming method thereof |
JP4751061B2 (ja) * | 2004-12-21 | 2011-08-17 | 東芝モバイルディスプレイ株式会社 | 液晶表示装置 |
GB0506899D0 (en) * | 2005-04-05 | 2005-05-11 | Plastic Logic Ltd | Multiple conductive layer TFT |
KR101219036B1 (ko) * | 2005-05-02 | 2013-01-07 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR20060121514A (ko) * | 2005-05-24 | 2006-11-29 | 삼성전자주식회사 | 유기발광 디스플레이 및 그 제조방법 |
KR100698692B1 (ko) * | 2005-07-20 | 2007-03-23 | 삼성에스디아이 주식회사 | 평판표시장치 |
TWI389316B (zh) * | 2005-09-08 | 2013-03-11 | Sharp Kk | 薄膜電晶體、半導體裝置、顯示器、結晶化方法及製造薄膜電晶體方法 |
US20070096646A1 (en) * | 2005-10-28 | 2007-05-03 | Van Nice Harold L | Electroluminescent displays |
US20070262311A1 (en) * | 2006-05-11 | 2007-11-15 | Toppoly Optoelectronics Corp. | Flat panel display and fabrication method and thereof |
US7557498B2 (en) * | 2006-05-17 | 2009-07-07 | Tpo Displays Corp. | System for displaying images including electroluminescent device and method for fabricating the same |
TWI317556B (en) * | 2006-11-10 | 2009-11-21 | Innolux Display Corp | Top emission type oled and method for fabricating same |
TWI371223B (en) * | 2008-02-20 | 2012-08-21 | Chimei Innolux Corp | Organic light emitting display device and fabrications thereof and electronic device |
US11437236B2 (en) * | 2016-01-08 | 2022-09-06 | The Trustees Of Columbia University In Thf City Of New York | Methods and systems for spot beam crystallization |
CN107146855A (zh) * | 2017-05-16 | 2017-09-08 | 京东方科技集团股份有限公司 | Oled基板及其制备方法、显示装置 |
KR102519086B1 (ko) * | 2017-10-25 | 2023-04-06 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
CN112735272B (zh) | 2020-12-30 | 2022-05-17 | 武汉华星光电技术有限公司 | 显示面板及显示装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3450376B2 (ja) * | 1993-06-12 | 2003-09-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP2814049B2 (ja) * | 1993-08-27 | 1998-10-22 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
US6337232B1 (en) | 1995-06-07 | 2002-01-08 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabrication of a crystalline silicon thin film semiconductor with a thin channel region |
US6573195B1 (en) * | 1999-01-26 | 2003-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device by performing a heat-treatment in a hydrogen atmosphere |
JP2001109399A (ja) | 1999-10-04 | 2001-04-20 | Sanyo Electric Co Ltd | カラー表示装置 |
KR100418745B1 (ko) | 2001-06-08 | 2004-02-19 | 엘지.필립스 엘시디 주식회사 | 실리콘 결정화방법 |
-
2003
- 2003-04-02 KR KR10-2003-0020738A patent/KR100496300B1/ko active IP Right Grant
- 2003-11-19 US US10/715,424 patent/US6876001B2/en not_active Expired - Lifetime
- 2003-12-31 CN CNB2003101240593A patent/CN100517423C/zh not_active Expired - Lifetime
-
2004
- 2004-11-17 US US10/989,643 patent/US7009207B2/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104701265A (zh) * | 2015-03-27 | 2015-06-10 | 深圳市华星光电技术有限公司 | 低温多晶硅tft基板结构及其制作方法 |
WO2018161624A1 (en) * | 2017-03-10 | 2018-09-13 | Boe Technology Group Co., Ltd. | Array substrate, fabrication method thereof, driving transistor and display panel |
US10644035B2 (en) | 2017-03-10 | 2020-05-05 | Boe Technology Group Co., Ltd. | Array substrate, fabrication method thereof, driving transistor and display panel |
US10943927B2 (en) | 2017-03-10 | 2021-03-09 | Beijing Boe Display Technology Co., Ltd. | Array substrate, fabrication method thereof, driving transistor and display panel |
Also Published As
Publication number | Publication date |
---|---|
US7009207B2 (en) | 2006-03-07 |
US20050087744A1 (en) | 2005-04-28 |
KR20040085889A (ko) | 2004-10-08 |
KR100496300B1 (ko) | 2005-06-17 |
US20040195570A1 (en) | 2004-10-07 |
US6876001B2 (en) | 2005-04-05 |
CN100517423C (zh) | 2009-07-22 |
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