CN1531093A - 多输出超小型功率变换装置 - Google Patents
多输出超小型功率变换装置 Download PDFInfo
- Publication number
- CN1531093A CN1531093A CNA2004100085114A CN200410008511A CN1531093A CN 1531093 A CN1531093 A CN 1531093A CN A2004100085114 A CNA2004100085114 A CN A2004100085114A CN 200410008511 A CN200410008511 A CN 200410008511A CN 1531093 A CN1531093 A CN 1531093A
- Authority
- CN
- China
- Prior art keywords
- magnetic
- power converter
- substrate
- coil
- multiple output
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/81201—Compression bonding
- H01L2224/81205—Ultrasonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/19015—Structure including thin film passive components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
Abstract
Description
Claims (10)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-069954 | 2003-03-14 | ||
JP2003069954 | 2003-03-14 | ||
JP2003069954 | 2003-03-14 | ||
JP2003147107A JP2004343976A (ja) | 2003-03-14 | 2003-05-26 | 多出力超小型電力変換装置 |
JP2003147107 | 2003-05-26 | ||
JP2003-147107 | 2003-05-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1531093A true CN1531093A (zh) | 2004-09-22 |
CN1531093B CN1531093B (zh) | 2011-11-16 |
Family
ID=32911467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004100085114A Expired - Fee Related CN1531093B (zh) | 2003-03-14 | 2004-03-11 | 多输出超小型功率变换装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20040179383A1 (zh) |
JP (1) | JP2004343976A (zh) |
CN (1) | CN1531093B (zh) |
DE (1) | DE102004011958A1 (zh) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101071677B (zh) * | 2006-03-31 | 2011-06-08 | Tdk株式会社 | 薄膜器件 |
CN101110293B (zh) * | 2006-06-20 | 2011-12-14 | 富士电机株式会社 | 超小型电力变换装置及其制造方法 |
CN101071679B (zh) * | 2006-03-31 | 2011-12-21 | Tdk株式会社 | 薄膜器件 |
CN101529707B (zh) * | 2007-01-19 | 2011-12-28 | 株式会社村田制作所 | Dc-dc转换器模块 |
CN101197538B (zh) * | 2006-12-07 | 2012-07-04 | 富士电机株式会社 | 微型功率变换器 |
CN101688846B (zh) * | 2007-05-31 | 2013-05-29 | 恩德莱斯和豪瑟尔测量及调节技术分析仪表两合公司 | 电感式电导率传感器 |
CN103168413A (zh) * | 2011-06-10 | 2013-06-19 | 株式会社村田制作所 | 多沟道型dc-dc转换器 |
CN104347586A (zh) * | 2014-09-15 | 2015-02-11 | 武汉新芯集成电路制造有限公司 | 集成电感电容的电路结构 |
CN105321675A (zh) * | 2014-06-27 | 2016-02-10 | 沃思电子埃索斯有限责任两合公司 | 感应元件 |
CN106024722A (zh) * | 2015-03-25 | 2016-10-12 | 英飞凌科技美国公司 | 具有使用导电片段的集成输出电感器的半导体封装体 |
CN109411454A (zh) * | 2017-10-05 | 2019-03-01 | 成都芯源系统有限公司 | 用于多相功率变换器的电路封装 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7456525B2 (en) * | 2004-07-09 | 2008-11-25 | Honeywell International Inc. | Multi-output power supply device for power sequencing |
KR100768919B1 (ko) * | 2004-12-23 | 2007-10-19 | 삼성전자주식회사 | 전원 생성 장치 |
JP4609152B2 (ja) * | 2005-03-30 | 2011-01-12 | 富士電機システムズ株式会社 | 超小型電力変換装置 |
DE102005014929B4 (de) * | 2005-04-01 | 2008-04-17 | Newlogic Technologies Gmbh | Integrierte Spule und integrierter Transformator |
DE102006025194A1 (de) * | 2006-05-29 | 2007-12-06 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | Induktiver Leitfähigkeitssensor |
JP2008153456A (ja) * | 2006-12-18 | 2008-07-03 | Fuji Electric Device Technology Co Ltd | インダクタおよびその製造方法 |
JP5194749B2 (ja) * | 2007-12-05 | 2013-05-08 | 富士電機株式会社 | 超小型電力変換装置 |
JP2009246159A (ja) * | 2008-03-31 | 2009-10-22 | Fuji Electric Device Technology Co Ltd | 多出力磁気誘導素子およびそれを備えた多出力超小型電力変換装置 |
JP5084801B2 (ja) | 2009-08-31 | 2012-11-28 | 株式会社村田製作所 | インダクタおよびdc−dcコンバータ |
US9999129B2 (en) | 2009-11-12 | 2018-06-12 | Intel Corporation | Microelectronic device and method of manufacturing same |
JP5782919B2 (ja) * | 2011-08-25 | 2015-09-24 | サンケン電気株式会社 | 半導体装置 |
DE102012003364A1 (de) | 2012-02-22 | 2013-08-22 | Phoenix Contact Gmbh & Co. Kg | Planarer Übertrager |
JP5880697B2 (ja) * | 2012-05-15 | 2016-03-09 | 株式会社村田製作所 | 多チャンネル型dc−dcコンバータ |
KR101372088B1 (ko) * | 2012-07-19 | 2014-03-07 | 엘지이노텍 주식회사 | 코일 및 무선전력 송신장치 |
US9565768B2 (en) * | 2015-03-25 | 2017-02-07 | Infineon Technologies Americas Corp. | Semiconductor package with integrated output inductor on a printed circuit board |
PL226676B1 (pl) | 2015-06-29 | 2017-08-31 | Akademia Górniczo Hutnicza Im Stanisława Staszica W Krakowie | Przetwornica izolacyjna |
US10476380B2 (en) * | 2018-01-15 | 2019-11-12 | Ford Global Technologies, Llc | Common-mode choke for paralleled power semiconductor |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004274004A (ja) * | 2003-01-16 | 2004-09-30 | Fuji Electric Device Technology Co Ltd | 超小型電力変換装置 |
-
2003
- 2003-05-26 JP JP2003147107A patent/JP2004343976A/ja not_active Withdrawn
-
2004
- 2004-02-23 US US10/782,755 patent/US20040179383A1/en not_active Abandoned
- 2004-03-11 DE DE102004011958A patent/DE102004011958A1/de not_active Ceased
- 2004-03-11 CN CN2004100085114A patent/CN1531093B/zh not_active Expired - Fee Related
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101071679B (zh) * | 2006-03-31 | 2011-12-21 | Tdk株式会社 | 薄膜器件 |
CN101071677B (zh) * | 2006-03-31 | 2011-06-08 | Tdk株式会社 | 薄膜器件 |
CN101110293B (zh) * | 2006-06-20 | 2011-12-14 | 富士电机株式会社 | 超小型电力变换装置及其制造方法 |
CN101197538B (zh) * | 2006-12-07 | 2012-07-04 | 富士电机株式会社 | 微型功率变换器 |
CN101529707B (zh) * | 2007-01-19 | 2011-12-28 | 株式会社村田制作所 | Dc-dc转换器模块 |
CN101688846B (zh) * | 2007-05-31 | 2013-05-29 | 恩德莱斯和豪瑟尔测量及调节技术分析仪表两合公司 | 电感式电导率传感器 |
CN103168413B (zh) * | 2011-06-10 | 2016-08-03 | 株式会社村田制作所 | 多沟道型dc-dc转换器 |
CN103168413A (zh) * | 2011-06-10 | 2013-06-19 | 株式会社村田制作所 | 多沟道型dc-dc转换器 |
US9553509B2 (en) | 2011-06-10 | 2017-01-24 | Murata Manufacturing Co., Ltd. | Multichannel DC-DC converter |
CN105321675A (zh) * | 2014-06-27 | 2016-02-10 | 沃思电子埃索斯有限责任两合公司 | 感应元件 |
CN105321675B (zh) * | 2014-06-27 | 2019-08-13 | 沃思电子埃索斯有限责任两合公司 | 感应元件 |
CN104347586A (zh) * | 2014-09-15 | 2015-02-11 | 武汉新芯集成电路制造有限公司 | 集成电感电容的电路结构 |
CN104347586B (zh) * | 2014-09-15 | 2017-06-06 | 武汉新芯集成电路制造有限公司 | 集成电感电容的电路结构 |
CN106024722A (zh) * | 2015-03-25 | 2016-10-12 | 英飞凌科技美国公司 | 具有使用导电片段的集成输出电感器的半导体封装体 |
US10074620B2 (en) | 2015-03-25 | 2018-09-11 | Infineon Technologies Americas Corp. | Semiconductor package with integrated output inductor using conductive clips |
CN106024722B (zh) * | 2015-03-25 | 2019-12-10 | 英飞凌科技美国公司 | 具有使用导电片段的集成输出电感器的半导体封装体 |
CN109411454A (zh) * | 2017-10-05 | 2019-03-01 | 成都芯源系统有限公司 | 用于多相功率变换器的电路封装 |
CN109411454B (zh) * | 2017-10-05 | 2021-05-18 | 成都芯源系统有限公司 | 用于多相功率变换器的电路封装 |
Also Published As
Publication number | Publication date |
---|---|
DE102004011958A1 (de) | 2004-09-23 |
CN1531093B (zh) | 2011-11-16 |
JP2004343976A (ja) | 2004-12-02 |
US20040179383A1 (en) | 2004-09-16 |
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