CN1507649A - 保持装置、保持方法、曝光装置以及器件制造方法 - Google Patents

保持装置、保持方法、曝光装置以及器件制造方法 Download PDF

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Publication number
CN1507649A
CN1507649A CNA02804844XA CN02804844A CN1507649A CN 1507649 A CN1507649 A CN 1507649A CN A02804844X A CNA02804844X A CN A02804844XA CN 02804844 A CN02804844 A CN 02804844A CN 1507649 A CN1507649 A CN 1507649A
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CN
China
Prior art keywords
mentioned
maintaining part
graticule
mask
zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA02804844XA
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English (en)
Chinese (zh)
Inventor
c原恒幸
萩原恒幸
充
吉元宏充
人
堀川浩人
夫
水谷英夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN1507649A publication Critical patent/CN1507649A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
CNA02804844XA 2001-02-13 2002-02-13 保持装置、保持方法、曝光装置以及器件制造方法 Pending CN1507649A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP36130/2001 2001-02-13
JP2001036130 2001-02-13

Publications (1)

Publication Number Publication Date
CN1507649A true CN1507649A (zh) 2004-06-23

Family

ID=18899450

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA02804844XA Pending CN1507649A (zh) 2001-02-13 2002-02-13 保持装置、保持方法、曝光装置以及器件制造方法

Country Status (5)

Country Link
US (2) US7081946B2 (US20040100624A1-20040527-M00003.png)
JP (1) JP4196675B2 (US20040100624A1-20040527-M00003.png)
KR (1) KR100855527B1 (US20040100624A1-20040527-M00003.png)
CN (1) CN1507649A (US20040100624A1-20040527-M00003.png)
WO (1) WO2002065519A1 (US20040100624A1-20040527-M00003.png)

Cited By (1)

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CN105826211A (zh) * 2016-05-11 2016-08-03 苏州日月新半导体有限公司 半导体产品、制造该半导体产品的治具及方法

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NL1023717C2 (nl) * 2003-06-20 2004-12-21 Fei Co Preparaatdrager voor het dragen van een met een elektronenbundel te doorstralen preparaat.
JP4314462B2 (ja) * 2003-07-25 2009-08-19 信越化学工業株式会社 フォトマスクブランク用基板の製造方法
JP4232018B2 (ja) * 2003-07-25 2009-03-04 信越化学工業株式会社 フォトマスクブランク用基板の選定方法
TWI329779B (en) * 2003-07-25 2010-09-01 Shinetsu Chemical Co Photomask blank substrate, photomask blank and photomask
JP2005043836A (ja) * 2003-07-25 2005-02-17 Shin Etsu Chem Co Ltd フォトマスクブランク用基板の選定方法
JP4411100B2 (ja) * 2004-02-18 2010-02-10 キヤノン株式会社 露光装置
JP4411158B2 (ja) * 2004-07-29 2010-02-10 キヤノン株式会社 露光装置
US7196775B2 (en) * 2004-08-23 2007-03-27 Asml Holding N.V. Patterned mask holding device and method using two holding systems
JP4803576B2 (ja) * 2004-09-29 2011-10-26 Ｈｏｙａ株式会社 マスクブランク用基板、マスクブランク、露光用マスク、半導体デバイスの製造方法、及びマスクブランク用基板の製造方法
DE102005046135B4 (de) * 2004-09-29 2017-04-13 Hoya Corp. Substrat für Maskenrohling, Maskenrohling, Belichtungsmaske und Herstellungsverfahren für Maskenrohlingssubstrat
JP2006261156A (ja) * 2005-03-15 2006-09-28 Canon Inc 原版保持装置およびそれを用いた露光装置
TWI510869B (zh) * 2005-03-29 2015-12-01 尼康股份有限公司 曝光裝置、曝光裝置的製造方法以及元件的製造方法
WO2006133800A1 (en) 2005-06-14 2006-12-21 Carl Zeiss Smt Ag Lithography projection objective, and a method for correcting image defects of the same
KR100819556B1 (ko) * 2006-02-20 2008-04-07 삼성전자주식회사 웨이퍼 스테이지, 이를 갖는 노광설비 및 이를 사용한 웨이퍼 평평도 보정 방법
US20070268476A1 (en) * 2006-05-19 2007-11-22 Nikon Corporation Kinematic chucks for reticles and other planar bodies
US7675607B2 (en) * 2006-07-14 2010-03-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8610980B2 (en) 2007-06-29 2013-12-17 Canon Kabushiki Kaisha Table generating apparatus, table generating method, image processing apparatus, and image processing method
CN102016991A (zh) * 2008-05-07 2011-04-13 Lg电子株式会社 用于调整记录介质的倾斜的方法和设备
US8159654B2 (en) * 2009-06-03 2012-04-17 Matsushita Seiki Co., Ltd. Pressure body and pellicle mounting apparatus
NL2006536A (en) * 2010-05-13 2011-11-15 Asml Netherlands Bv A substrate table, a lithographic apparatus, a method of flattening an edge of a substrate and a device manufacturing method.
NL2006565A (en) 2010-06-30 2012-01-02 Asml Holding Nv Reticle clamping system.
JPWO2012115002A1 (ja) * 2011-02-22 2014-07-07 株式会社ニコン 保持装置、露光装置、及びデバイスの製造方法
CN113035768A (zh) 2012-11-30 2021-06-25 株式会社尼康 搬送系统
KR102502727B1 (ko) * 2015-11-09 2023-02-23 삼성전자주식회사 레티클 및 그를 포함하는 노광 장치
JP6788125B2 (ja) 2017-02-10 2020-11-18 エーエスエムエル ホールディング エヌ．ブイ． レチクルクランプデバイス
JP7419030B2 (ja) * 2019-11-18 2024-01-22 キヤノン株式会社 保持装置、露光装置、及び物品の製造方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105826211A (zh) * 2016-05-11 2016-08-03 苏州日月新半导体有限公司 半导体产品、制造该半导体产品的治具及方法
CN105826211B (zh) * 2016-05-11 2018-10-19 苏州日月新半导体有限公司 半导体产品、制造该半导体产品的治具及方法

Also Published As

Publication number Publication date
KR100855527B1 (ko) 2008-09-01
US20060146312A1 (en) 2006-07-06
KR20040007448A (ko) 2004-01-24
US20040100624A1 (en) 2004-05-27
WO2002065519A1 (fr) 2002-08-22
JPWO2002065519A1 (ja) 2004-06-17
JP4196675B2 (ja) 2008-12-17
US7081946B2 (en) 2006-07-25

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