CN1457535A - 模块和电子装置 - Google Patents

模块和电子装置 Download PDF

Info

Publication number
CN1457535A
CN1457535A CN02800465A CN02800465A CN1457535A CN 1457535 A CN1457535 A CN 1457535A CN 02800465 A CN02800465 A CN 02800465A CN 02800465 A CN02800465 A CN 02800465A CN 1457535 A CN1457535 A CN 1457535A
Authority
CN
China
Prior art keywords
module
antenna
substrate
shielding part
strutting piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN02800465A
Other languages
English (en)
Other versions
CN1310376C (zh
Inventor
A·A·J·布伊斯曼
J·M·C·维尔斯佩克
A·J·M·德格劳夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
III Holdings 6 LLC
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of CN1457535A publication Critical patent/CN1457535A/zh
Application granted granted Critical
Publication of CN1310376C publication Critical patent/CN1310376C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Transceivers (AREA)
  • Support Of Aerials (AREA)
  • Details Of Aerials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
  • Control Of Electric Motors In General (AREA)

Abstract

一种适合于RF应用、特别是适合于蓝牙应用的无线模块包括其上有半导体器件(11)、屏蔽件(21)和天线(31)的衬底(1)。屏蔽件(21)位于天线(31)和半导体器件(11)之间并且与半导体器件(11)和天线(31)一起处在衬底(1)的同一侧(2)。天线(31)和屏蔽件(21)最好通过支撑件(32，42)相互连接。

Description

模块和电子装置
本发明涉及一种模块，它包括具有侧面的衬底、半导体器件、导电材料的屏蔽件以及天线，所述屏蔽件位于天线和半导体器件之间。
本发明还涉及电子装置。
从JP-A-9-237867已知这种模块。在此已知模块中，半导体器件在衬底的第一侧，天线在衬底的第二侧，即相对侧。屏蔽件集成在衬底内，衬底构造成多层板。屏蔽件包括两层，二者由通路互连，每一层都延伸在第一侧的一部分之上。该模块可以借助其第一侧设置在载体上、例如印刷电路板上，为此半导体器件被容纳在空腔中。该模块适合于高频应用。这种模块也可作为符合蓝牙标准的射频模块使用。在这种情况下，半导体器件是一个收发信机，并且，所述模块还包括用于去耦以及信号滤波的无源元件。这些元件都集成在衬底内。使用这种模块的电子装置的实例尤其是移动电话和计算机。
该已知模块的一大缺点是：由于大量的或实际上是全部的无源元件都集成在衬底内，其设计不易修改以适应各种应用。
本发明的一个目的就是提供可以用简单方法修改其设计的上述这种类型的模块。
该目的的实现方法是：屏蔽件和天线基本上都与半导体器件一样处于在衬底上的同一侧。本发明基于以下认识：所述屏蔽件可以用作天线的接地的基座面。这样，天线就不需要或仅需要一个机械支撑体，且天线可以构造成导电材料的单片或单层。
半导体器件和其他所需元件都处于本发明模块的衬底的第一侧。衬底可以借助其第二侧设置在载体上、例如印刷电路板上。屏蔽件和天线按照所述次序设置在半导体器件之上。屏蔽件和天线最好以1到5mm的间距彼此隔开，更好的间距为大约2mm。屏蔽件和天线可以是电气互连的，但也可以不互连。现在，如果需要修改模块的设计，就可以修改其上有元件的衬底或天线。设计的修改可以是例如增加无源元件或改变模块的尺寸。如果设计中不需要天线，则很容易将它去掉。
天线和屏蔽件可各自做成金属片，或做成网状或做成载体上的层。天线和屏蔽件可各自独立地用凸条或齿固定在衬底上。
本发明模块的一个优点是可以得到很小表面积的衬底。天线和屏蔽件事实上不占用或几乎不占用衬底的空间。此外，元件也可以设置在衬底的整个表面上。这与先有技术的模块不同，那种模块中元件只能设置在空腔中。衬底表面的其余部分与载体相对，在此可以配置球形栅极阵列或一些其他连接元件。在本发明的模块中可以将衬底表面区域减少到天线的大小，例如将某些元件集成到衬底中。
在一个优选实施例中，屏蔽件通过支撑件连接到天线上。支撑件的优点在于屏蔽件可以制作成封闭层，与衬底一起整个包围半导体器件。
支撑件与天线和屏蔽件构成一个整体，确保了至少在工作条件下的机械稳定性。在模块使用时天线和屏蔽件保持处于基本相互平行的方向。天线不会有相对于屏蔽件的明显位移。此外，屏蔽件、支撑件以及天线可以装配成一个整体。该装配组件可以固定在衬底的第一侧，也可固定在衬底的第二侧。该组件还可以固定在其上设置有模块的载体上。
本发明的模块可以以各种形式构成，特别是在由屏蔽件、支撑件和天线形成的组件的结构方面。在第一实施例中，所述组件的稳定性是靠用弯曲的金属片来形成屏蔽件和天线而获得的。这些金属片中的每一片本身固定在衬底的第一或第二侧。在此实施例中的支撑件保证了天线和屏蔽件保持处于基本上相互平行的取向，最好在谐振时依然处在彼此相同的距离。支撑件不需延伸到整个屏蔽件和天线。这样作的优点是：屏蔽件和天线都暴露在大气中，便于散热。此外，这样作制造成本也很低。
支撑件最好是具有第一端和第二端的长条，长条的第一端不可拆卸地连接到天线的金属片上，第二端固定在屏蔽件上。具体地说，该长条构成天线金属片的一部分，这一部分沿三边切开并折弯。长条可以用例如导电胶或机械装置连接到屏蔽件上。由于屏蔽件是接地的，所以此长条同时提供天线对地的连接。这种结构的优点是在模块制造时不需要配置另外的元件。
或者，支撑件可用橡胶材料制造。这些材料对本专业的技术人员都是已知的，也有市售。支撑件可以是例如环状、夹在屏蔽件和天线之间。这样就不需要粘结。橡胶材料的支撑件实际上也起减震器的作用。
在本发明模块的稳定结构的第二实施例中，支撑件是天线的载体并且包括电绝缘材料。屏蔽件是具有第一，第二和第三部分的金属片，所述第二部分邻接第一和第三部分并与衬底基本上平行，所述第一和第三部分中至少一部分与衬底一侧的电导体电气连接。支撑件固定在屏蔽件上。在此实施例中结构的稳定性是靠屏蔽件金属片来实现的。最好该金属片具有帽盖形状。这样在第二部分就会在相对两侧上具有第四和第五部分。第一，第三，第四和第五部分都结合到衬底的第一侧。选择具有适当介电常数的材料作为支撑件，对天线专业的技术人员来说是已知的。最好，在支撑件和屏蔽件之间有粘接增强层。此外，支撑件可以是基本上包围着所述屏蔽件的注入成型产品；这种注入成型产品本身称为例如模制互连件或多层柔性印刷电路板。这种注入成型产品也可包围天线并同时作为模块的外壳。
该实施例的一个优点是天线可以大抵定位在模块的横向侧。在这种情况下，天线以相对于衬底的大约60到120°的角度取向，最好以大约90°的角度取向。天线的这种配置对于例如天线的作用距离或防止某个方向的辐射都是有利的。另外，它为电子装置的设计提供较大的自由度。
在本发明模块的稳定结构的第三实施例中，支撑件是天线和屏蔽件的载体。在此实施例中，天线和屏蔽件可以(例如)在支撑件的各一侧用印刷技术作成层状的结构。支撑件最好用硬而脆的材料构成。例如各种形式的陶瓷材料和玻璃型的或多晶聚合材料。如果该稳定结构位于衬底的第一侧、且支撑件延伸到衬底、具有帽盖形状，则该支撑件和衬底一起形成模块的外壳。
本发明还涉及一种配备了具有天线和半导体器件的模块、特别是适合于按照蓝牙协议进行发射和接收的模块的电子装置。这种电子装置(例如便携式计算机和移动电话)的一个问题是它们的可用空间都很小。结果就是模块必须适应电子装置制造商制定的技术条件。在电子装置中利用本发明的模块就有可能以简单的方式使模块适合于该电子装置。相应地也有可能将模块集成到电子装置中，而不用本发明的模块，就会需要完全不同的解决方案，例如用适合于处理按蓝牙协议接收的信号的模块和单独的天线。
本发明的模块的优点是天线突出在模块之外电子装置的元件之上。在优选实施例中，模块相对于印刷电路板的高度为3到5mm。装置中的其它元件，例如GSM或UMTS应用中的功率放大器、微处理器、滤波器等，通常相对于印刷电路板的高度为1到2mm。这些元件和模块的位置紧靠一起，特别是因为在本发明的电子装置中只有有限的可用空间。如果天线突出在这些元件之上，发生的干扰也较少。因而天线引起的噪声也较小。在另一实施例中，维持天线信号中同等信噪比所需的对天线信号的滤波作用也较小。用本发明的模块就有可能使天线处于突出的位置，在此模块中，天线位于衬底、半导体器件和屏蔽件之上。
下面将参考附图对本发明的模块的这些和其它方面作更详细的说明，附图中：
图1是该模块第一实施例的示意的截面图；
图2是该模块第一实施例的方框图；以及
图3是该模块第二实施例的示意的截面图。
各图中同样的元件具有同样的参考数字编号。
图1示出本发明的模块10，它配备有衬底1，衬底1具有第一侧2和第二侧3。在所述第一侧2上有半导体器件11，在这种情况下为用作收发信机的集成电路。用于去耦合和滤波的无源元件14、15也在第一侧2上。在衬底1的第二侧3，有用于将所述模块设置在印刷电路板上的装置、例如导电接点盘9，球形栅极阵列的球形栅极可以固定在该盘上。衬底1配备有通路8，它提供了衬底的第一侧2到第二侧3的导电连接。衬底1在其第一侧2配备有电导体7。衬底1由陶瓷材料制成，但不是必须如此。也可使用层叠片。此外，衬底可以包括电极并且可以是所谓的低温共烧陶瓷型。
屏蔽件21用长条22固定在衬底1的第一侧2上。这些长条22胶合在或焊接在电导体7上。屏蔽件通过电导体7和通路8连接到地。屏蔽件21由金属制成并且包括第一部分23、第二部分24和第三部分25。第四和第五部分未示出。第二部分24的取向基本上与衬底1平行。第一、第三、第四和第五部分都与第二部分24相接并且都配备有长条22。故屏蔽件21具有帽盖形状。
天线31也固定在衬底1的第一侧2上。天线31为补片(pacth)型的并且基本上由金属片构成。金属片的长条32从天线上割开，连接到屏蔽件21。这种长条用作支撑件。天线31还配备有输入端33，天线通过它与半导体器件11相连接。输入端33同时还提供机械稳定性。天线31还配备有第二端子34。第二端子34原则上可以连接到地。或者也可将此端子连接到无源元件，通过它们来调谐天线。这种调谐机理在专利申请(非在先公开的)EP01200502.1(PHNL010092)中已有说明。还可以将谐振电路连接到第二端子34，这样可以扩宽天线31的频谱。从端子33和34到半导体器件11和其他器件的连接未在图1中示出。
图2是模块10的方框图。半导体器件11配备有6个输入端19并且起收发信机的作用。连接到半导体器件11的有压控振荡器(VOC)槽路16、锁相环(PLL)回路滤波器17以及电源去耦单元18。收发信机11能够向天线31发送信号并接收来自天线31的信号。有一个TX/RX开关14，用于从接收器功能转换为发射器功能，反之亦然。此TX/RX开关14通过RX平衡-不平衡转换滤波器12将信号导向半导体器件11。半导体器件11发送的信号通过TX平衡-不平衡转换滤波器13、TX/RX开关14以及带通滤波器15到达天线31。为此天线配备有输入端子33。天线配备有长条32作为接地端子，连接到屏蔽件21(图2中未示出)，屏蔽件21再接地。天线31通过其第二端子34连接到由电容52和电感53构成的谐振电路51。谐振电路51最好集成在衬底1中。
图3示出模块10的第二实施例。在此实施例中，支撑件42是由层叠片构成的载体。支撑件42包括第一部分43、第二部分44和第三部分45。支撑件42通过注入成型制成。或者，在制作好天线31和屏蔽件21后将支撑件42折弯形成第一、第二和第三部分43、44和45。支撑件42通过固定装置46(在此例中是胶)固定在衬底1的第一侧2上。或者，例如也可使用机械固定系统，诸如箝夹系统或导轨系统。长条22固定到屏蔽件21上，而长条33和34固定到天线31上，以进一步改善稳定性。长条33和34粘接到衬底1的第二侧3上。支撑件42中的通路38作为接地端子。支撑件42具有内侧48和外侧49。支撑件42在其内侧48配备有非图案层、即屏蔽件21，后者最好由铜制成。支撑件42在其外侧49配备有图案层、即天线31，它最好也由铜制成。可以用已知方式形成层31并将其构成图案。天线31的大部分落在支撑件的第三部分45上，从而天线的作用距离是有方向性的。

Claims (11)

1.一种包括具有侧面的衬底、半导体器件，导电材料的屏蔽件和天线的模块，所述屏蔽件处在所述天线和所述半导体器件之间，其特征在于：所述屏蔽件和所述天线与所述半导体器件一起大体上处在所述衬底的同一侧。
2.如权利要求1所述的模块，其特征在于：所述屏蔽件通过支撑件连接到天线。
3.如权利要求2所述的模块，其特征在于：所述屏蔽件和所述天线都是金属片，它们各自包括第一、第二和第三部分，所述第二部分连接所述第一和第三部分并且其取向基本上平行于所述衬底，所述第一和第三部分中至少一个部分与所述衬底的所述各侧面之一上的电导体电气连接。
4.如权利要求3所述的模块，其特征在于：所述支撑件包括橡胶、电绝缘材料。
5.如权利要求3所述的模块，其特征在于：所述支撑件是具有第一端和第二端的长条，所述长条的第一端不可拆卸地连接到所述天线的金属片上并且其第二端固定在所述屏蔽件上。
6.如权利要求3所述的模块，其特征在于：所述天线的所述第三部分配备有齿，后者连接到所述衬底的所述各侧面之一上的电导体。
7.如权利要求2所述的模块，其特征在于：所述支撑件是所述天线的载体并且包括电绝缘材料，所述屏蔽件是包括第一、第二和第三部分的金属片，所述第二部分连接所述第一和第三部分并且其取基本上平行于所述衬底，同时，所述第一和第三部分中至少一个部分与所述衬底所述各侧面之一上的电导体电气连接，并且所述支撑件固定在所述屏蔽件上。
8.如权利要求2所述的模块，其特征在于：所述支撑件是所述天线和所述屏蔽件的载体。
9.如权利要求8所述的模块，其特征在于：所述支撑件包括第一、第二和第三部分，所述第二部分连接所述第一和第三部分并且其取向基本上平行于所述衬底，而所述第一的第三部分一直延伸到所述衬底。
10.一种配备有如以上权利要求中任何一个所述的模块的电子装置。
11.如权利要求10所述的装置，其特征在于：存在一种载体，其上固定有所述模块和至少一个元件，所述元件在所述装置工作时发出辐射，所述元件和所述模块相对于所述载体各自具有这样的高度、使得所述模块的高度大于所述元件的高度。
CNB028004655A 2001-03-02 2002-02-25 模块和电子装置 Expired - Fee Related CN1310376C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01200794 2001-03-02
EP01200794.4 2001-03-02

Publications (2)

Publication Number Publication Date
CN1457535A true CN1457535A (zh) 2003-11-19
CN1310376C CN1310376C (zh) 2007-04-11

Family

ID=8179960

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028004655A Expired - Fee Related CN1310376C (zh) 2001-03-02 2002-02-25 模块和电子装置

Country Status (7)

Country Link
US (1) US6861731B2 (zh)
EP (1) EP1368858B1 (zh)
JP (1) JP2004519916A (zh)
CN (1) CN1310376C (zh)
AT (1) ATE499725T1 (zh)
DE (1) DE60239262D1 (zh)
WO (1) WO2002071547A1 (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102768996A (zh) * 2012-06-18 2012-11-07 日月光半导体制造股份有限公司 半导体封装构造及其制造方法
CN101615718B (zh) * 2008-06-24 2013-06-12 富士康(昆山)电脑接插件有限公司 天线组件
CN105976591A (zh) * 2016-06-23 2016-09-28 国网山东省电力公司日照供电公司 基于等电位环原理的高压输电线路无线通讯装置
CN108269790A (zh) * 2016-12-30 2018-07-10 美国亚德诺半导体公司 具有集成天线的封装的装置
CN108878407A (zh) * 2017-05-10 2018-11-23 日月光半导体制造股份有限公司 半导体封装装置及其制造方法
CN113784458A (zh) * 2020-06-09 2021-12-10 华为技术有限公司 组装方法及ap设备

Families Citing this family (150)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US20070176287A1 (en) * 1999-11-05 2007-08-02 Crowley Sean T Thin integrated circuit device packages for improved radio frequency performance
US20040217472A1 (en) * 2001-02-16 2004-11-04 Integral Technologies, Inc. Low cost chip carrier with integrated antenna, heat sink, or EMI shielding functions manufactured from conductive loaded resin-based materials
KR100369393B1 (ko) 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
US6686649B1 (en) * 2001-05-14 2004-02-03 Amkor Technology, Inc. Multi-chip semiconductor package with integral shield and antenna
US6849936B1 (en) * 2002-09-25 2005-02-01 Lsi Logic Corporation System and method for using film deposition techniques to provide an antenna within an integrated circuit package
JP2004327641A (ja) * 2003-04-24 2004-11-18 Tdk Corp 電子部品モジュール
JP3734807B2 (ja) * 2003-05-19 2006-01-11 Ｔｄｋ株式会社 電子部品モジュール
US6982483B2 (en) * 2003-05-30 2006-01-03 Freescale Semiconductor, Inc. High impedance radio frequency power plastic package
US7671803B2 (en) * 2003-07-25 2010-03-02 Hewlett-Packard Development Company, L.P. Wireless communication system
US7327015B2 (en) * 2004-09-20 2008-02-05 Advanced Semiconductor Engineering, Inc. Semiconductor device package
WO2006041033A1 (ja) * 2004-10-13 2006-04-20 Toppan Forms Co., Ltd. 非接触ｉｃラベル及びその製造方法並びに製造装置
US7629674B1 (en) * 2004-11-17 2009-12-08 Amkor Technology, Inc. Shielded package having shield fence
EP1826710A4 (en) * 2004-12-20 2009-06-17 Toppan Forms Co Ltd CONTACTLESS DATA RECEIVER / TRANSMITTER
US7507603B1 (en) 2005-12-02 2009-03-24 Amkor Technology, Inc. Etch singulated semiconductor package
US7519328B2 (en) 2006-01-19 2009-04-14 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US7968998B1 (en) 2006-06-21 2011-06-28 Amkor Technology, Inc. Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
JP4281850B2 (ja) 2006-06-30 2009-06-17 株式会社村田製作所 光ディスク
WO2008050535A1 (fr) 2006-09-26 2008-05-02 Murata Manufacturing Co., Ltd. Module couplé électromagnétiquement et article muni de celui-ci
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
JP4930586B2 (ja) 2007-04-26 2012-05-16 株式会社村田製作所 無線ｉｃデバイス
WO2008140037A1 (ja) 2007-05-11 2008-11-20 Murata Manufacturing Co., Ltd. 無線ｉｃデバイス
CN104078767B (zh) 2007-07-09 2015-12-09 株式会社村田制作所 无线ic器件
US7977774B2 (en) 2007-07-10 2011-07-12 Amkor Technology, Inc. Fusion quad flat semiconductor package
CN104540317B (zh) 2007-07-17 2018-11-02 株式会社村田制作所 印制布线基板
US20090021352A1 (en) 2007-07-18 2009-01-22 Murata Manufacturing Co., Ltd. Radio frequency ic device and electronic apparatus
WO2009011376A1 (ja) * 2007-07-18 2009-01-22 Murata Manufacturing Co., Ltd. 無線ｉｃデバイス
JP5104865B2 (ja) * 2007-07-18 2012-12-19 株式会社村田製作所 無線ｉｃデバイス
US7687899B1 (en) 2007-08-07 2010-03-30 Amkor Technology, Inc. Dual laminate package structure with embedded elements
US7777351B1 (en) 2007-10-01 2010-08-17 Amkor Technology, Inc. Thin stacked interposer package
US8089159B1 (en) 2007-10-03 2012-01-03 Amkor Technology, Inc. Semiconductor package with increased I/O density and method of making the same
US7847386B1 (en) 2007-11-05 2010-12-07 Amkor Technology, Inc. Reduced size stacked semiconductor package and method of making the same
ATE555518T1 (de) 2007-12-20 2012-05-15 Murata Manufacturing Co Ic-radiogerät
CN101601169B (zh) 2007-12-26 2013-08-14 株式会社村田制作所 天线装置及无线ic器件
FR2925980B1 (fr) * 2007-12-28 2010-06-04 St Microelectronics Sa Plot de contact electrique
US7956453B1 (en) 2008-01-16 2011-06-07 Amkor Technology, Inc. Semiconductor package with patterning layer and method of making same
US7723852B1 (en) 2008-01-21 2010-05-25 Amkor Technology, Inc. Stacked semiconductor package and method of making same
EP2251933A4 (en) 2008-03-03 2012-09-12 Murata Manufacturing Co COMPOSITE ANTENNA
JP5267463B2 (ja) 2008-03-03 2013-08-21 株式会社村田製作所 無線ｉｃデバイス及び無線通信システム
CN101960665B (zh) 2008-03-26 2014-03-26 株式会社村田制作所 无线ic器件
US8067821B1 (en) 2008-04-10 2011-11-29 Amkor Technology, Inc. Flat semiconductor package with half package molding
WO2009128437A1 (ja) 2008-04-14 2009-10-22 株式会社村田製作所 無線ｉｃデバイス、電子機器及び無線ｉｃデバイスの共振周波数の調整方法
US7768135B1 (en) 2008-04-17 2010-08-03 Amkor Technology, Inc. Semiconductor package with fast power-up cycle and method of making same
US7808084B1 (en) 2008-05-06 2010-10-05 Amkor Technology, Inc. Semiconductor package with half-etched locking features
EP2840648B1 (en) 2008-05-21 2016-03-23 Murata Manufacturing Co., Ltd. Wireless IC device
WO2009142068A1 (ja) 2008-05-22 2009-11-26 株式会社村田製作所 無線ｉｃデバイス及びその製造方法
WO2009145007A1 (ja) 2008-05-26 2009-12-03 株式会社村田製作所 無線ｉｃデバイスシステム及び無線ｉｃデバイスの真贋判定方法
EP3509162A1 (en) 2008-05-28 2019-07-10 Murata Manufacturing Co., Ltd. Wireless ic device and component for a wireless ic device
JP4557186B2 (ja) 2008-06-25 2010-10-06 株式会社村田製作所 無線ｉｃデバイスとその製造方法
WO2010001987A1 (ja) 2008-07-04 2010-01-07 株式会社村田製作所 無線ｉｃデバイス
US8125064B1 (en) 2008-07-28 2012-02-28 Amkor Technology, Inc. Increased I/O semiconductor package and method of making same
US20100020518A1 (en) * 2008-07-28 2010-01-28 Anadigics, Inc. RF shielding arrangement for semiconductor packages
US8184453B1 (en) 2008-07-31 2012-05-22 Amkor Technology, Inc. Increased capacity semiconductor package
JP5434920B2 (ja) 2008-08-19 2014-03-05 株式会社村田製作所 無線ｉｃデバイス及びその製造方法
US7847392B1 (en) 2008-09-30 2010-12-07 Amkor Technology, Inc. Semiconductor device including leadframe with increased I/O
US7989933B1 (en) 2008-10-06 2011-08-02 Amkor Technology, Inc. Increased I/O leadframe and semiconductor device including same
WO2010047214A1 (ja) 2008-10-24 2010-04-29 株式会社村田製作所 無線ｉｃデバイス
US8008758B1 (en) 2008-10-27 2011-08-30 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe
WO2010050361A1 (ja) 2008-10-29 2010-05-06 株式会社村田製作所 無線ｉｃデバイス
US8089145B1 (en) 2008-11-17 2012-01-03 Amkor Technology, Inc. Semiconductor device including increased capacity leadframe
JP4605318B2 (ja) 2008-11-17 2011-01-05 株式会社村田製作所 アンテナ及び無線ｉｃデバイス
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US7875963B1 (en) 2008-11-21 2011-01-25 Amkor Technology, Inc. Semiconductor device including leadframe having power bars and increased I/O
US7982298B1 (en) 2008-12-03 2011-07-19 Amkor Technology, Inc. Package in package semiconductor device
US8487420B1 (en) 2008-12-08 2013-07-16 Amkor Technology, Inc. Package in package semiconductor device with film over wire
US20170117214A1 (en) 2009-01-05 2017-04-27 Amkor Technology, Inc. Semiconductor device with through-mold via
US8680656B1 (en) 2009-01-05 2014-03-25 Amkor Technology, Inc. Leadframe structure for concentrated photovoltaic receiver package
US8058715B1 (en) 2009-01-09 2011-11-15 Amkor Technology, Inc. Package in package device for RF transceiver module
JP5041075B2 (ja) 2009-01-09 2012-10-03 株式会社村田製作所 無線ｉｃデバイスおよび無線ｉｃモジュール
CN102204011B (zh) 2009-01-16 2013-12-25 株式会社村田制作所 高频器件及无线ic器件
WO2010087429A1 (ja) 2009-01-30 2010-08-05 株式会社村田製作所 アンテナ及び無線ｉｃデバイス
US8026589B1 (en) 2009-02-23 2011-09-27 Amkor Technology, Inc. Reduced profile stackable semiconductor package
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8575742B1 (en) 2009-04-06 2013-11-05 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including power bars
JP5510450B2 (ja) 2009-04-14 2014-06-04 株式会社村田製作所 無線ｉｃデバイス
WO2010122685A1 (ja) 2009-04-21 2010-10-28 株式会社村田製作所 アンテナ装置及びその共振周波数設定方法
JP5447515B2 (ja) 2009-06-03 2014-03-19 株式会社村田製作所 無線ｉｃデバイス及びその製造方法
WO2010146944A1 (ja) 2009-06-19 2010-12-23 株式会社村田製作所 無線ｉｃデバイス及び給電回路と放射板との結合方法
JP4788850B2 (ja) 2009-07-03 2011-10-05 株式会社村田製作所 アンテナモジュール
WO2011037234A1 (ja) 2009-09-28 2011-03-31 株式会社村田製作所 無線ｉｃデバイスおよびそれを用いた環境状態検出方法
JP5201270B2 (ja) 2009-09-30 2013-06-05 株式会社村田製作所 回路基板及びその製造方法
JP5304580B2 (ja) 2009-10-02 2013-10-02 株式会社村田製作所 無線ｉｃデバイス
WO2011045970A1 (ja) 2009-10-16 2011-04-21 株式会社村田製作所 アンテナ及び無線ｉｃデバイス
JP5418600B2 (ja) 2009-10-27 2014-02-19 株式会社村田製作所 送受信装置及び無線タグ読み取り装置
WO2011055702A1 (ja) 2009-11-04 2011-05-12 株式会社村田製作所 無線ｉｃタグ、リーダライタ及び情報処理システム
JP5327334B2 (ja) 2009-11-04 2013-10-30 株式会社村田製作所 通信端末及び情報処理システム
GB2487315B (en) 2009-11-04 2014-09-24 Murata Manufacturing Co Communication terminal and information processing system
KR101318707B1 (ko) 2009-11-20 2013-10-17 가부시키가이샤 무라타 세이사쿠쇼 안테나 장치 및 이동체 통신 단말
JP4978756B2 (ja) 2009-12-24 2012-07-18 株式会社村田製作所 通信端末
US8199518B1 (en) 2010-02-18 2012-06-12 Amkor Technology, Inc. Top feature package and method
JP5403146B2 (ja) 2010-03-03 2014-01-29 株式会社村田製作所 無線通信デバイス及び無線通信端末
JP5652470B2 (ja) 2010-03-03 2015-01-14 株式会社村田製作所 無線通信モジュール及び無線通信デバイス
WO2011111509A1 (ja) 2010-03-12 2011-09-15 株式会社村田製作所 無線通信デバイス及び金属製物品
WO2011118379A1 (ja) 2010-03-24 2011-09-29 株式会社村田製作所 Ｒｆｉｄシステム
JP5630499B2 (ja) 2010-03-31 2014-11-26 株式会社村田製作所 アンテナ装置及び無線通信デバイス
JP5170156B2 (ja) 2010-05-14 2013-03-27 株式会社村田製作所 無線ｉｃデバイス
JP5299351B2 (ja) 2010-05-14 2013-09-25 株式会社村田製作所 無線ｉｃデバイス
US8508023B1 (en) * 2010-06-17 2013-08-13 Amkor Technology, Inc. System and method for lowering contact resistance of the radio frequency (RF) shield to ground
WO2012005278A1 (ja) 2010-07-08 2012-01-12 株式会社村田製作所 アンテナ及びｒｆｉｄデバイス
CN102859790B (zh) 2010-07-28 2015-04-01 株式会社村田制作所 天线装置及通信终端设备
WO2012020748A1 (ja) 2010-08-10 2012-02-16 株式会社村田製作所 プリント配線板及び無線通信システム
JP5234071B2 (ja) 2010-09-03 2013-07-10 株式会社村田製作所 Ｒｆｉｃモジュール
CN103038939B (zh) 2010-09-30 2015-11-25 株式会社村田制作所 无线ic器件
WO2012050037A1 (ja) 2010-10-12 2012-04-19 株式会社村田製作所 アンテナ装置および通信端末装置
WO2012053412A1 (ja) 2010-10-21 2012-04-26 株式会社村田製作所 通信端末装置
US8674485B1 (en) 2010-12-08 2014-03-18 Amkor Technology, Inc. Semiconductor device including leadframe with downsets
US8576131B2 (en) * 2010-12-22 2013-11-05 Shure Acquisition Holdings, Inc. Helical antenna apparatus and method of forming helical antenna
WO2012093541A1 (ja) 2011-01-05 2012-07-12 株式会社村田製作所 無線通信デバイス
CN103299325B (zh) 2011-01-14 2016-03-02 株式会社村田制作所 Rfid芯片封装以及rfid标签
TWI557183B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 矽氧烷組成物、以及包含其之光電裝置
US8648450B1 (en) 2011-01-27 2014-02-11 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands
CN104899639B (zh) 2011-02-28 2018-08-07 株式会社村田制作所 无线通信器件
JP5630566B2 (ja) 2011-03-08 2014-11-26 株式会社村田製作所 アンテナ装置及び通信端末機器
JP5273326B2 (ja) 2011-04-05 2013-08-28 株式会社村田製作所 無線通信デバイス
JP5482964B2 (ja) 2011-04-13 2014-05-07 株式会社村田製作所 無線ｉｃデバイス及び無線通信端末
WO2012157596A1 (ja) 2011-05-16 2012-11-22 株式会社村田製作所 無線ｉｃデバイス
JP5729186B2 (ja) 2011-07-14 2015-06-03 富士通セミコンダクター株式会社 半導体装置及びその製造方法
EP2683031B1 (en) 2011-07-14 2016-04-27 Murata Manufacturing Co., Ltd. Wireless communication device
JP5333707B2 (ja) 2011-07-15 2013-11-06 株式会社村田製作所 無線通信デバイス
CN203850432U (zh) 2011-07-19 2014-09-24 株式会社村田制作所 天线装置以及通信终端装置
CN203553354U (zh) 2011-09-09 2014-04-16 株式会社村田制作所 天线装置及无线器件
WO2013080991A1 (ja) 2011-12-01 2013-06-06 株式会社村田製作所 無線ｉｃデバイス及びその製造方法
WO2013115019A1 (ja) 2012-01-30 2013-08-08 株式会社村田製作所 無線ｉｃデバイス
WO2013125610A1 (ja) 2012-02-24 2013-08-29 株式会社村田製作所 アンテナ装置および無線通信装置
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
CN104487985B (zh) 2012-04-13 2020-06-26 株式会社村田制作所 Rfid标签的检查方法及检查装置
US9196958B2 (en) * 2012-07-26 2015-11-24 Apple Inc. Antenna structures and shield layers on packaged wireless circuits
KR101486790B1 (ko) 2013-05-02 2015-01-28 앰코 테크놀로지 코리아 주식회사 강성보강부를 갖는 마이크로 리드프레임
KR101563911B1 (ko) 2013-10-24 2015-10-28 앰코 테크놀로지 코리아 주식회사 반도체 패키지
JP2015176966A (ja) * 2014-03-14 2015-10-05 株式会社東芝 電子機器
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
US9825597B2 (en) 2015-12-30 2017-11-21 Skyworks Solutions, Inc. Impedance transformation circuit for amplifier
US10062670B2 (en) 2016-04-18 2018-08-28 Skyworks Solutions, Inc. Radio frequency system-in-package with stacked clocking crystal
US10320071B2 (en) 2016-04-19 2019-06-11 Skyworks Solutions, Inc. Methods for selectively shielding radio frequency modules
US10297913B2 (en) 2016-05-04 2019-05-21 Skyworks Solutions, Inc. Shielded radio frequency component with integrated antenna
JP6500859B2 (ja) * 2016-08-22 2019-04-17 株式会社村田製作所 無線モジュール
CN107887698B (zh) 2016-09-29 2020-11-10 矽品精密工业股份有限公司 电子封装结构及其制法
US10037951B2 (en) * 2016-11-29 2018-07-31 Cyntec Co., Ltd. Semiconductor package with antenna
TW202329611A (zh) 2016-12-29 2023-07-16 美商天工方案公司 前端系統及相關裝置、積體電路、模組及方法
US10515924B2 (en) 2017-03-10 2019-12-24 Skyworks Solutions, Inc. Radio frequency modules
JP6809600B2 (ja) * 2017-04-03 2021-01-06 株式会社村田製作所 高周波モジュール
JP7049897B2 (ja) * 2018-04-13 2022-04-07 モレックス エルエルシー アンテナモジュール
US11211340B2 (en) 2018-11-28 2021-12-28 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
US10896880B2 (en) * 2018-11-28 2021-01-19 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and fabrication method thereof
TWI744572B (zh) 2018-11-28 2021-11-01 蔡憲聰 具有封裝內隔室屏蔽的半導體封裝及其製作方法
US11239179B2 (en) 2018-11-28 2022-02-01 Shiann-Tsong Tsai Semiconductor package and fabrication method thereof
US10923435B2 (en) 2018-11-28 2021-02-16 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance
US11139552B1 (en) * 2020-05-05 2021-10-05 Semiconductor Components Industries, Llc Method of forming a semiconductor device
US11901270B2 (en) * 2020-09-02 2024-02-13 Advanced Semiconductor Engineering, Inc. Semiconductor device package

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02308604A (ja) * 1989-05-23 1990-12-21 Harada Ind Co Ltd 移動通信用平板アンテナ
US5166772A (en) * 1991-02-22 1992-11-24 Motorola, Inc. Transfer molded semiconductor device package with integral shield
JP2705392B2 (ja) * 1991-09-04 1998-01-28 日本電気株式会社 携帯無線機
JPH06152236A (ja) * 1992-10-29 1994-05-31 Ngk Insulators Ltd 平面アンテナ用シールド基板
US5650655A (en) * 1994-04-28 1997-07-22 Micron Technology, Inc. Integrated circuitry having electrical interconnects
JP3374604B2 (ja) * 1995-07-12 2003-02-10 富士通株式会社 無線通信装置
JP3378435B2 (ja) * 1995-09-29 2003-02-17 株式会社東芝 超高周波帯無線通信装置
JP3266491B2 (ja) 1996-02-29 2002-03-18 京セラ株式会社 高周波用パッケージ
TW443717U (en) * 1996-06-28 2001-06-23 Sharp Kk Tuner structure and cable modem tuner using the same
DK176625B1 (da) * 1996-07-05 2008-12-01 Ipcom Gmbh & Co Kg Håndbåret apparat med antennemidler til udsendelse af et radiosignal
JPH1079623A (ja) * 1996-09-02 1998-03-24 Olympus Optical Co Ltd アンテナ素子を内蔵する半導体モジュール
DE69938271T2 (de) * 1998-05-29 2009-03-19 Kyocera Corp. Hochfrequenzmodul
US6064286A (en) * 1998-07-31 2000-05-16 The Whitaker Corporation Millimeter wave module with an interconnect from an interior cavity
US6092281A (en) * 1998-08-28 2000-07-25 Amkor Technology, Inc. Electromagnetic interference shield driver and method
SE9904256D0 (sv) * 1999-02-10 1999-11-24 Allgon Ab An antenna device and a radio communication device including an antenna device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101615718B (zh) * 2008-06-24 2013-06-12 富士康(昆山)电脑接插件有限公司 天线组件
CN102768996A (zh) * 2012-06-18 2012-11-07 日月光半导体制造股份有限公司 半导体封装构造及其制造方法
CN105976591A (zh) * 2016-06-23 2016-09-28 国网山东省电力公司日照供电公司 基于等电位环原理的高压输电线路无线通讯装置
CN105976591B (zh) * 2016-06-23 2019-03-15 国网山东省电力公司日照供电公司 基于等电位环原理的高压输电线路无线通讯装置
CN108269790A (zh) * 2016-12-30 2018-07-10 美国亚德诺半导体公司 具有集成天线的封装的装置
CN108269790B (zh) * 2016-12-30 2021-08-17 美国亚德诺半导体公司 具有集成天线的封装的装置
CN108878407A (zh) * 2017-05-10 2018-11-23 日月光半导体制造股份有限公司 半导体封装装置及其制造方法
CN108878407B (zh) * 2017-05-10 2021-12-10 日月光半导体制造股份有限公司 半导体封装装置及其制造方法
CN113784458A (zh) * 2020-06-09 2021-12-10 华为技术有限公司 组装方法及ap设备
US11876282B2 (en) 2020-06-09 2024-01-16 Huawei Technologies Co., Ltd. Assembly method and AP device

Also Published As

Publication number Publication date
JP2004519916A (ja) 2004-07-02
EP1368858A1 (en) 2003-12-10
ATE499725T1 (de) 2011-03-15
EP1368858B1 (en) 2011-02-23
US6861731B2 (en) 2005-03-01
US20020167060A1 (en) 2002-11-14
WO2002071547A1 (en) 2002-09-12
DE60239262D1 (de) 2011-04-07
CN1310376C (zh) 2007-04-11

Similar Documents

Publication Publication Date Title
CN1310376C (zh) 模块和电子装置
EP0667685B1 (en) Branching filter, branching filter module and radio communication apparatus
TW567639B (en) Apparatus including a radio communication function
US7245884B2 (en) RF module
EP0932255B1 (en) MCM with high Q overlapping resonator
US6420937B1 (en) Voltage controlled oscillator with power amplifier
US7795728B2 (en) Electronic component
US6980066B2 (en) High-frequency module
US20060097906A1 (en) Radar-transceiver for microwave and millimetre applications
CN1694250A (zh) 高频电路模块和无线通信设备
US8682403B2 (en) Filter having impedance matching circuits
CN1770649A (zh) 便携式电话机用高频模块
CN100525127C (zh) 电气开关模块、开关模块装置、具有开关模块的移动无线电设备和具有开关模块装置的移动无线电设备
US7236065B2 (en) Integrated RF-front end having an adjustable antenna
US6882250B2 (en) High-frequency device and communication apparatus
US20060214271A1 (en) Device and applications for passive RF components in leadframes
CN112930623A (zh) 天线元件、阵列天线、通信单元、移动体以及基站
JP2004088508A (ja) アンテナ付高周波モジュール
US5886587A (en) Flipped lumped element circulator
KR101393771B1 (ko) 프론트 앤드 모듈 및 그 제조 방법
WO1998036454A1 (en) Integrated circuit having a parasitic resonance filter
JP2001326319A (ja) アンテナ素子一体型高周波回路モジュール
CN218827106U (zh) 异构封装基板和异构封装模组
CN211700560U (zh) 一种适用于蓝牙的陶瓷片式天线
CN117728163A (zh) 天线结构和形成其的方法以及环形设备和形成其的方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: NXP CO., LTD.

Free format text: FORMER OWNER: ROYAL PHILIPS ELECTRONICS CO., LTD.

Effective date: 20071026

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20071026

Address after: Holland Ian Deho Finn

Patentee after: Koninkl Philips Electronics NV

Address before: Holland Ian Deho Finn

Patentee before: Koninklike Philips Electronics N. V.

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20150911

Address after: Delaware

Patentee after: III Holding 6 limited liability company

Address before: Holland Ian Deho Finn

Patentee before: Koninkl Philips Electronics NV

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070411

Termination date: 20190225

CF01 Termination of patent right due to non-payment of annual fee