CN1423674A - 阻燃环氧模塑组合物 - Google Patents
阻燃环氧模塑组合物 Download PDFInfo
- Publication number
- CN1423674A CN1423674A CN01808103A CN01808103A CN1423674A CN 1423674 A CN1423674 A CN 1423674A CN 01808103 A CN01808103 A CN 01808103A CN 01808103 A CN01808103 A CN 01808103A CN 1423674 A CN1423674 A CN 1423674A
- Authority
- CN
- China
- Prior art keywords
- moulding compound
- transition metal
- metal oxide
- gross weight
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3256—Molybdenum oxides, molybdates or oxide forming salts thereof, e.g. cadmium molybdate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3258—Tungsten oxides, tungstates, or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3284—Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3418—Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/42—Non metallic elements added as constituents or additives, e.g. sulfur, phosphor, selenium or tellurium
- C04B2235/422—Carbon
- C04B2235/424—Carbon black
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/48—Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/48—Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins
- C04B2235/483—Si-containing organic compounds, e.g. silicone resins, (poly)silanes, (poly)siloxanes or (poly)silazanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
- Fireproofing Substances (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
样品 | 18A | 19A | 20A | 21A | 22A | 23A |
二氧化硅填料(wt%) | 83.09 | 82.89 | 82.49 | 81.69 | 80.19 | 83.19 |
联苯树脂(wt%) | 5.34 | 5.34 | 5.34 | 5.34 | 5.34 | 5.34 |
环氧甲酚线性酚醛树脂(wt%) | 1.00 | 1.00 | 1.00 | 1.00 | 1.00 | 1.00 |
煅烧的二氧化硅(wt%) | 0.40 | 0.40 | 0.40 | 0.40 | 0.40 | 0.40 |
炭黑着色剂(wt%) | 0.30 | 0.30 | 0.30 | 0.30 | 0.30 | 0.30 |
苧烯类型硬化剂(来自Yuka Shell)(wt%) | 1.45 | 1.45 | 1.45 | 1.45 | 1.45 | 1.45 |
线性酚醛树脂硬化剂(wt%) | 2.47 | 2.47 | 2.47 | 2.47 | 2.47 | 2.47 |
催化剂(wt%) | 0.23 | 0.23 | 0.23 | 0.23 | 0.23 | 0.23 |
蜡(wt%) | 0.74 | 0.74 | 0.74 | 0.74 | 0.74 | 0.74 |
硅烷(wt%) | 1.05 | 1.05 | 1.05 | 1.05 | 1.05 | 1.05 |
弹性体(wt%) | 1.50 | 1.50 | 1.50 | 1.50 | 1.50 | 1.50 |
WO3(wt%) | 0.75 | 0.75 | 0.75 | 0.75 | 0.75 | 0.75 |
ZnMoO4(wt%) | 0.10 | 0.30 | 0.70 | 1.50 | 3.00 | 0 |
离子清除剂(wt%) | 1.58 | 1.58 | 1.58 | 1.58 | 1.58 | 1.58 |
样品 | 18A | 19A | 20A | 21A | 22A | 23A |
可燃性测试(UL94) | ||||||
总燃烧时间(5个样条)(s) | 60 | >139 | 25 | 29 | 9 | >97 |
状态 | 故障 | 故障 | V-1 | V-1 | V-0 | 故障 |
水分吸收(%) | ||||||
16小时 | 0.094 | 0.094 | 0.090 | 0.092 | 0.085 | 0.090 |
24小时 | 0.114 | 0.117 | 0.113 | 0.115 | 0.107 | 0.116 |
48小时 | 0.168 | 0.171 | 0.166 | 0.169 | 0.163 | 0.171 |
96小时 | 0.213 | 0.217 | 0.210 | 0.215 | 0.216 | 0.223 |
168小时 | 0.250 | 0.255 | 0.250 | 0.258 | 0.268 | 0.269 |
高压釜测试(%故障) | ||||||
在2250小时测试之后 | 2.3 | 0.0 | 0.0 | 2.3 | 14.0 | 0.0 |
HTSL测试(%故障) | ||||||
在1500小时测试之后 | 0.0 | 0.0 | 0.0 | 0.0 | 0.0 | 0.0 |
样品 | 34A | 35A | 36A | 37A | 38A | 39A |
二氧化硅填料(wt%) | 81.20 | 81.10 | 80.90 | 80.50 | 79.70 | 78.20 |
联苯树脂(wt%) | 0.0 | 0.0 | 0.0 | 0.0 | 0.0 | 0.0 |
环氧甲酚线性酚醛树脂(wt%) | 8.03 | 8.03 | 8.03 | 8.03 | 8.03 | 8.03 |
煅烧的二氧化硅(wt%) | 0.60 | 0.60 | 0.60 | 0.60 | 0.60 | 0.60 |
炭黑着色剂(wt%) | 0.30 | 0.30 | 0.30 | 0.30 | 0.30 | 0.30 |
苧烯类型硬化剂(Yuka Shell)(wt%) | 0.0 | 0.0 | 0.0 | 0.0 | 0.0 | 0.0 |
线性酚醛树脂硬化剂(wt%) | 4.58 | 4.58 | 4.58 | 4.58 | 4.58 | 4.58 |
催化剂(wt%) | 0.17 | 0.17 | 0.17 | 0.17 | 0.17 | 0.17 |
蜡(wt%) | 0.74 | 0.74 | 0.74 | 0.74 | 0.74 | 0.74 |
硅烷(wt%) | 1.05 | 1.05 | 1.05 | 1.05 | 1.05 | 1.05 |
弹性体(wt%) | 1.00 | 1.50 | 1.50 | 1.50 | 1.50 | 1.50 |
WO3(wt%) | 0.75 | 0.75 | 0.75 | 0.75 | 0.75 | 0.75 |
ZnMoO4(wt%) | 0.00 | 0.10 | 0.30 | 0.70 | 1.50 | 3.0 |
离子清除剂(wt%) | 1.58 | 1.58 | 1.58 | 1.58 | 1.58 | 1.58 |
样品 | 34A | 35A | 36A | 37A | 38A | 39A |
可燃性测试(UL94) | ||||||
总燃烧时间(5个样条)(s) | >138 | >72 | 41 | 42 | 58 | 9 |
状态 | 故障 | 故障 | V-1 | V-1 | V-1 | V-0 |
水分吸收(%) | ||||||
16小时 | 0.088 | 0.086 | 0.087 | 0.092 | 0.086 | 0.090 |
24小时 | 0.122 | 0.119 | 0.119 | 0.124 | 0.115 | 0.118 |
48小时 | 0.168 | 0.165 | 0.163 | 0.167 | 0.157 | 0.162 |
96小时 | 0.226 | 0.228 | 0.233 | 0.234 | 0.225 | 0.227 |
168小时 | 0.237 | 0.237 | 0.245 | 0.235 | 0.237 | 0.238 |
高压釜测试(%故障) | ||||||
在2000小时测试之后 | 0.0 | 0.0 | 0.0 | 0.0 | 2.6 | 0.0 |
HTSL测试(%故障) | ||||||
在1700小时测试之后 | 0.0 | 0.0 | 0.0 | 0.0 | 0.0 | 0.0 |
样品 | 40A | 33A | 41A | 42A | 43A | 44A | 45A |
二氧化硅填料(wt%) | 83.94 | 83.19 | 82.44 | 80.94 | 83.19 | 82.44 | 80.94 |
联苯树脂(wt%) | 5.34 | 5.34 | 5.34 | 5.34 | 5.34 | 5.34 | 5.34 |
环氧甲酚线性酚醛树脂(wt%) | 1.00 | 1.00 | 1.00 | 1.00 | 1.00 | 1.00 | 1.00 |
煅烧的二氧化硅(wt%) | 0.40 | 0.40 | 0.40 | 0.40 | 0.40 | 0.40 | 0.40 |
炭黑着色剂(wt%) | 0.30 | 0.30 | 0.30 | 0.30 | 0.30 | 0.30 | 0.30 |
苧烯类型硬化剂(YukaShell)(wt%) | 1.45 | 1.45 | 1.45 | 1.45 | 1.45 | 1.45 | 1.45 |
线性酚醛树脂硬化剂(wt%) | 2.47 | 2.47 | 2.47 | 2.47 | 2.47 | 2.47 | 2.47 |
催化剂(wt%) | 0.23 | 0.23 | 0.23 | 0.23 | 0.23 | 0.23 | 0.23 |
蜡(wt%) | 0.74 | 0.74 | 0.74 | 0.74 | 0.74 | 0.74 | 0.74 |
硅烷(wt%) | 1.05 | 1.05 | 1.05 | 1.05 | 1.05 | 1.05 | 1.05 |
弹性体(wt%) | 1.50 | 1.50 | 1.50 | 1.50 | 1.50 | 1.50 | 1.50 |
WO3(wt%) | 0 | 0.75 | 1.50 | 3.00 | 0 | 0 | 0 |
ZnMoO4(wt%) | 0 | 0 | 0 | 0 | 0.75 | 1.50 | 3.00 |
离子清除剂(wt%) | 1.58 | 1.58 | 1.58 | 1.58 | 1.58 | 1.58 | 1.58 |
样品 | 40A | 33A | 41A | 42A | 43A | 44A | 45A |
可燃性测试(UL94) | |||||||
总燃烧时间(5个样条)(s) | 51 | >100 | >138 | >135 | >152 | >166 | >113 |
状态 | 故障 | 故障 | 故障 | 故障 | 故障 | 故障 | 故障 |
样品 | 17A | 18B |
二氧化硅填料(wt%) | 79.81 | 80.17 |
联苯树脂(wt%) | 0.0 | 5.34 |
环氧甲酚线性酚醛树脂(wt%) | 6.10 | 0.0 |
煅烧的二氧化硅(wt%) | 0.80 | 0.60 |
炭黑着色剂(wt%) | 0.30 | 0.30 |
线性酚醛树脂硬化剂(wt%) | 4.86 | 4.68 |
催化剂(wt%) | 0.24 | 0.22 |
蜡(wt%) | 0.74 | 0.74 |
硅烷(wt%) | 1.05 | 1.05 |
弹性体(wt%) | 0.50 | 0.50 |
WO3(wt%) | 0.75 | 0.75 |
ZnMoO4(wt%) | 3.00 | 3.00 |
MoO3(wt%) | 0.75 | 0.75 |
离子清除剂(wt%) | 1.50 | 1.50 |
样品 | 17A | 18B |
可燃性测试(UL94) | ||
总燃烧时间(5个样条)(s) | 1 | 4 |
状态 | V-0 | V-0 |
用于形成良好精选固化物的最小时间(min) | 1.0 | 1.0 |
样品 | 80A | 10B | 79A | 81A |
二氧化硅填料(wt%) | 80.78 | 80.78 | 80.78 | 83.45 |
联苯树脂(wt%) | 0.0 | 0.0 | 0.0 | 5.64 |
环氧甲酚线性酚醛树脂(wt%) | 8.85 | 0.0 | 7.25 | 0.0 |
NC-3000P(wt%) | 0.0 | 9.75 | 0.0 | 0.0 |
煅烧的二氧化硅(wt%) | 0.40 | 0.40 | 0.40 | 0.60 |
炭黑着色剂(wt%) | 0.30 | 0.30 | 0.30 | 0.30 |
线性酚醛树脂硬化剂(wt%) | 4.89 | 3.99 | 1.44 | 1.64 |
MEH7851(wt%) | 0.0 | 0.0 | 5.05 | 2.97 |
催化剂(wt%) | 0.16 | 0.16 | 0.16 | 0.16 |
蜡(wt%) | 0.74 | 0.74 | 0.74 | 0.86 |
硅烷(wt%) | 1.05 | 1.05 | 1.05 | 1.05 |
弹性体(wt%) | 0.50 | 0.50 | 0.50 | 1.00 |
WO3(wt%) | 0.75 | 0.75 | 0.75 | 0.75 |
离子清除剂(wt%) | 1.58 | 1.58 | 1.58 | 1.58 |
样品 | 80A | 10B | 79A | 81A |
可燃性测试(UL94) | ||||
总燃烧时间(5个样条)(s) | >114 | 2 | 8 | 14 |
状态 | 故障 | V-0 | V-0 | V-0 |
Claims (71)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/532,423 US6432540B1 (en) | 2000-03-23 | 2000-03-23 | Flame retardant molding compositions |
US09/532,423 | 2000-03-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1423674A true CN1423674A (zh) | 2003-06-11 |
CN1215109C CN1215109C (zh) | 2005-08-17 |
Family
ID=24121713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB018081037A Expired - Fee Related CN1215109C (zh) | 2000-03-23 | 2001-03-22 | 阻燃环氧模塑组合物 |
Country Status (13)
Country | Link |
---|---|
US (1) | US6432540B1 (zh) |
EP (1) | EP1276799B1 (zh) |
JP (1) | JP4766506B2 (zh) |
KR (1) | KR100740497B1 (zh) |
CN (1) | CN1215109C (zh) |
AT (1) | ATE524516T1 (zh) |
AU (1) | AU2001249377A1 (zh) |
CA (1) | CA2402383A1 (zh) |
ES (1) | ES2373538T3 (zh) |
MX (1) | MXPA02009274A (zh) |
MY (1) | MY121182A (zh) |
TW (1) | TWI238839B (zh) |
WO (1) | WO2001070867A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110075445A (zh) * | 2019-06-03 | 2019-08-02 | 辽宁大学 | 一种智能灭火贴的制备方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6610406B2 (en) * | 2000-03-23 | 2003-08-26 | Henkel Locktite Corporation | Flame retardant molding compositions |
US6822341B1 (en) | 2002-12-19 | 2004-11-23 | Henkel Corporation | Latent catalysts for molding compounds |
US20040166241A1 (en) * | 2003-02-20 | 2004-08-26 | Henkel Loctite Corporation | Molding compositions containing quaternary organophosphonium salts |
US7291684B2 (en) * | 2003-03-11 | 2007-11-06 | Sumitomo Bakelite Co., Ltd. | Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
CN103554844B (zh) | 2013-10-29 | 2016-02-17 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及其用途 |
US10531555B1 (en) * | 2016-03-22 | 2020-01-07 | The United States Of America As Represented By The Secretary Of The Army | Tungsten oxide thermal shield |
CN116948386B (zh) * | 2023-06-08 | 2023-12-22 | 江苏通上新材料科技有限公司 | 一种阻燃复合电缆材料及其制备方法和应用 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2250483A (en) | 1937-08-10 | 1941-07-29 | Hopkinson Harry | Fireproofing composition and method |
US2610920A (en) | 1948-11-01 | 1952-09-16 | Hopkinson Harry | Flameproofing composition |
GB1102921A (en) | 1965-02-11 | 1968-02-14 | Ici Ltd | Stabilised polyamide compositions |
US3897346A (en) | 1972-06-16 | 1975-07-29 | Gaf Corp | Flame retardant agent for synthetic plastics |
US4097287A (en) | 1975-09-04 | 1978-06-27 | Kansai Paint Co., Ltd. | Inorganic film forming composition for coating |
US4028333A (en) | 1975-12-18 | 1977-06-07 | Velsicol Chemical Corporation | Flame retardant polymeric compositions containing melamine hydrohalides |
US4098748A (en) * | 1976-08-16 | 1978-07-04 | Amax Inc. | Plasticized polyvinyl chloride resin composition containing molybdenum flame retardant and antimony compound smoke suppressant agent |
US4446061A (en) | 1979-10-25 | 1984-05-01 | Monsanto Company | Composition containing reaction products of metal oxides and salts with phosphorus compounds |
US4439572A (en) | 1981-10-26 | 1984-03-27 | The Sherwin-Williams Company | Zinc oxide-zinc salt smoke suppressant/flame retardants |
JPS59182546A (ja) * | 1983-03-31 | 1984-10-17 | Nitto Electric Ind Co Ltd | 半導体装置 |
BR8402638A (pt) | 1983-06-10 | 1985-04-30 | Goodrich Co B F | Composicao de cloreto de polivinila pos-clorada |
US4753916A (en) | 1986-09-17 | 1988-06-28 | E. I. Du Pont De Nemours And Company | Metal oxides of molybdenum or molybdenum and tungsten |
US4806577A (en) * | 1986-11-18 | 1989-02-21 | Nippon Shokubai Kagaku Kogyo Co., Ltd. | Adhesive composition |
US4892683A (en) | 1988-05-20 | 1990-01-09 | Gary Chemical Corporation | Flame retardant low smoke poly(vinyl chloride) thermoplastic compositions |
US5059640A (en) * | 1988-06-16 | 1991-10-22 | The United States Of America As Represented By The Secretary Of The Navy | Epoxy corrosion-resistant coating |
US5476716A (en) * | 1988-10-17 | 1995-12-19 | The Dexter Corporation | Flame retardant epoxy molding compound, method and encapsulated device |
DE3939953A1 (de) | 1989-12-02 | 1991-06-06 | Bayer Ag | Verfahren zur herstellung feinteiliger keramischer oxid-pulver aus vorlaeuferverbindungen |
US5342553A (en) | 1991-11-22 | 1994-08-30 | U. S. Borax Inc. | Process of making zinc borate and fire-retarding compositions thereof |
US5422092A (en) | 1992-09-08 | 1995-06-06 | Kabushiki Kaisha Kaisui Kagaku Kenkyujo | Flame retardant and flame-retardant resin composition |
US5906679A (en) | 1994-06-06 | 1999-05-25 | Nissan Chemical Industries, Ltd. | Coating compositions employing zinc antimonate anhydride particles |
RU2163564C2 (ru) | 1995-08-03 | 2001-02-27 | Татехо Кемикал Индастриз Ко., Лтд | Сложный гидроксид металлов, способ получения сложных гидроксидов металлов и пламезамедляющее вещество для высокомолекулярных соединений, полученное этим способом с использованием этого гидроксида |
JPH10212396A (ja) * | 1997-01-30 | 1998-08-11 | Hitachi Chem Co Ltd | 電子部品封止用エポキシ樹脂成形材料及び電子部品 |
US6190787B1 (en) * | 1997-07-02 | 2001-02-20 | Sumitomo Bakelite Company, Ltd. | Epoxy resin compositions for encapsulating semiconductors, and semiconductor devices |
JP3389095B2 (ja) * | 1998-04-22 | 2003-03-24 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP3450655B2 (ja) * | 1997-07-09 | 2003-09-29 | 日本ペルノックス株式会社 | レーザー光線の照射でマーキング可能な樹脂組成物 |
JPH11140277A (ja) | 1997-11-10 | 1999-05-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及びこれを用いた半導体装置 |
JP3994511B2 (ja) | 1998-03-23 | 2007-10-24 | 日立化成工業株式会社 | 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置 |
JP3479827B2 (ja) | 1998-04-27 | 2003-12-15 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP3582576B2 (ja) * | 1998-05-15 | 2004-10-27 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
US6297306B1 (en) * | 1998-05-15 | 2001-10-02 | Shin-Etsu Chemical Co., Ltd. | Semiconductor encapsulating epoxy resin composition and semiconductor device |
JP3707043B2 (ja) * | 1999-03-18 | 2005-10-19 | 三菱瓦斯化学株式会社 | プリント配線板用プリプレグ及び積層板 |
JP2001031842A (ja) * | 1999-07-26 | 2001-02-06 | Toray Ind Inc | エポキシ樹脂組成物及び半導体装置 |
JP3540215B2 (ja) * | 1999-09-29 | 2004-07-07 | 株式会社東芝 | エポキシ樹脂組成物及び樹脂封止型半導体装置 |
-
2000
- 2000-03-23 US US09/532,423 patent/US6432540B1/en not_active Expired - Lifetime
-
2001
- 2001-03-21 MY MYPI20011337A patent/MY121182A/en unknown
- 2001-03-22 ES ES01922594T patent/ES2373538T3/es not_active Expired - Lifetime
- 2001-03-22 AT AT01922594T patent/ATE524516T1/de not_active IP Right Cessation
- 2001-03-22 KR KR1020027012417A patent/KR100740497B1/ko not_active IP Right Cessation
- 2001-03-22 TW TW090106744A patent/TWI238839B/zh active
- 2001-03-22 EP EP01922594A patent/EP1276799B1/en not_active Expired - Lifetime
- 2001-03-22 AU AU2001249377A patent/AU2001249377A1/en not_active Abandoned
- 2001-03-22 WO PCT/US2001/009311 patent/WO2001070867A2/en active Application Filing
- 2001-03-22 CN CNB018081037A patent/CN1215109C/zh not_active Expired - Fee Related
- 2001-03-22 JP JP2001569060A patent/JP4766506B2/ja not_active Expired - Fee Related
- 2001-03-22 MX MXPA02009274A patent/MXPA02009274A/es unknown
- 2001-03-22 CA CA002402383A patent/CA2402383A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110075445A (zh) * | 2019-06-03 | 2019-08-02 | 辽宁大学 | 一种智能灭火贴的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2001070867A2 (en) | 2001-09-27 |
ATE524516T1 (de) | 2011-09-15 |
KR20020084229A (ko) | 2002-11-04 |
JP4766506B2 (ja) | 2011-09-07 |
ES2373538T3 (es) | 2012-02-06 |
KR100740497B1 (ko) | 2007-07-19 |
MY121182A (en) | 2005-12-30 |
EP1276799A2 (en) | 2003-01-22 |
AU2001249377A1 (en) | 2001-10-03 |
CN1215109C (zh) | 2005-08-17 |
TWI238839B (en) | 2005-09-01 |
US6432540B1 (en) | 2002-08-13 |
WO2001070867A3 (en) | 2002-01-31 |
MXPA02009274A (es) | 2004-04-05 |
EP1276799B1 (en) | 2011-09-14 |
JP2004500470A (ja) | 2004-01-08 |
CA2402383A1 (en) | 2001-09-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102010574B (zh) | 阻燃模塑组合物 | |
CN1215109C (zh) | 阻燃环氧模塑组合物 | |
JP3343704B2 (ja) | エポキシ樹脂組成物 | |
CN1274744C (zh) | 阻燃模塑组合物 | |
US6297306B1 (en) | Semiconductor encapsulating epoxy resin composition and semiconductor device | |
JP2004500470A5 (zh) | ||
JP2000230110A (ja) | エポキシ樹脂組成物及び半導体装置 | |
JP2000248050A (ja) | エポキシ樹脂組成物及び半導体装置 | |
JP4505888B2 (ja) | エポキシ樹脂組成物及び半導体装置 | |
KR20140083792A (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이에 의해 밀봉된 반도체 소자 | |
CN114685935B (zh) | 一种低介电常数树脂组合物及其制备方法与应用 | |
KR100898335B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 | |
KR100898337B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 | |
JP2000169675A (ja) | エポキシ樹脂組成物及び半導体装置 | |
JP3862381B2 (ja) | 半導体封止用エポキシ樹脂組成物およびその製法 | |
CN112980137A (zh) | 一种环氧模塑料及其制备方法、用途 | |
KR100414202B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
KR20090070431A (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자 | |
KR101234844B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 | |
JP2000273279A (ja) | エポキシ樹脂組成物及び半導体装置 | |
WO2004074359A2 (en) | Flame retardant molding compositions containing group iva metal oxides | |
JPS6325011B2 (zh) | ||
JP2001226462A (ja) | エポキシ樹脂組成物及び半導体装置 | |
JPH1112444A (ja) | エポキシ樹脂組成物及び半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HENKEL US IP LLC Free format text: FORMER OWNER: HENKEL CORP. Effective date: 20140910 Owner name: HENKEL INTELLECTUAL PROPERTY AND HOLDINGS CO., LTD Free format text: FORMER OWNER: HENKEL US IP LLC Effective date: 20140910 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140910 Address after: Dusseldorf Patentee after: THE DIAL Corp. Address before: American Connecticut Patentee before: Henkel American Intellectual Property LLC Effective date of registration: 20140910 Address after: American Connecticut Patentee after: Henkel American Intellectual Property LLC Address before: American Connecticut Patentee before: Henkel Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050817 Termination date: 20180322 |