CN1390086A - 制造多层电路组件的方法 - Google Patents
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Abstract
本发明涉及一种制造多层电路组件的方法。金属载体具有厚度小于0.5毫米的电介质材料,并且对表面形成的至少2500伏电压具有绝缘性。环形结构的焊盘确定至少一条通路或一个孔,以便有选择地去除电介质材料。用回流焊接形成电互连,为了确保安全,利用通路充分散热。
Description
本发明一般涉及电路板卡及其制造方法。
电路板卡今天仍称为“印刷电路板”,即使它们很少被印刷。不管它们是如何制造的,都必须符合严格的安全要求,如工作电压、电介质击穿电压和在工作条件下的散热能力。
当这些安全需要要求工作在至少2500伏的电压下时,便规定了最小的电介质厚度,这常常会造成散热问题。当然可以提供强制气冷或水冷,但这种安排造成了其它的问题。
Adachi等人的美国专利第4,993,148号描述了一种形成电路板的方法,该电路板包括在预限定的介质层上的喷镀导体层,留下一部分暴露的导体作为安装部件。该方法不包括应用铜箔,限定铜箔中的导体和通路图案,然后利用导体和通路图案确定电介质。
Ilardi等人的美国专利第4,999,740号描述了一种电路板,它是通过在金属衬底上建立光成像介质材料层和使介质层成像,以便形成在金属衬底上安装部件的凹下部分制成的。该电路板不包括多引线层,并且不提供大电流承载能力的电压面,或采用作为介质可去除掩模的叠层金属箔。
Adachi等人的美国专利第5,081,562号描述了一种带有金属镀层的电路板,上面形成了感光绝缘层,留下了一部分金属镀层,暴露作为部件安装区。电路板需要导体和通路的铜镀层。它不包含各层的被焊接的互连部分。
虽然这些现有技术的电路板的结构乍一看与本发明的电路板卡类似,但是它们实质上是不同的。通过阅读以下对本发明所作的详细描述,将更清楚地理解这些不同,这些不同使得在制造工艺方面和对完成的电路板卡的使用方面具有显著的优点。
举例来说,本发明允许采用非常经济的制造工艺,即不需要导体的铜喷镀和不需要通常为全部互连所需的铜喷镀。这一优点在制造包括更厚的铜和需要花费更多的制造时间的电源电路板卡中显得尤其重要。
本发明的电路板卡结构的另一显著优点是不需要通常所需的铜喷镀,这使得能够得到更高的布线密度。本发明优于现有技术的再一个优点是原边和副边电压平面之间的隔离,这提高了电性能并降低了成本。
本发明还有一个优点是采用了高介质击穿强度的材料的薄涂层,该薄的材料还提供了最小的热阻。当与电介质中用于安装部件的孔一起使用时,可以得到有效散热的电路板卡。
因此,上述现有技术专利在此引用作为参考。
本发明的主要目的是提供一种克服了现有技术的板卡结构中固有的不足的新颖和改进的电路板卡。
本发明的再一个目的是提供一种制造本发明的电路板卡的新颖和改进的方法。
简单地说,根据本发明原则构造的电路板卡包括由金属材料形成的载体或衬底。在至少一个表面上形成1毫米或小于该尺寸的电介质材料,以便支持预定结构的电路。电路和电介质的选择区域具有安装电路结构和操作要求所需的部件的去除部分。独特的金属焊盘结构作为电介质去除工艺期间的显像掩蔽物提供了自对准互连通路。
通过以下结合附图对本发明的最佳实施例所作的详细描述,本发明的上述和其它目的、优点和特征将变得更清楚。
图1是根据本发明的主要用于电压转换操作的多层电路板卡结构的视图。
图2是根据本发明的电路板卡的视图,该电路板卡主要用于根据本发明的升压电路。
图3是局部剖面的透视图,表示作为显像掩蔽物的金属焊盘的独特结构。
在图1中,标号10通常表示根据本发明的隔离电压转换器板卡。板卡10的特征在于有一块金属载体11,上面形成第一薄干膜介质层12,并将该介质层干燥或固化。
对第一干膜介质层12而言,已经发现可接受的选择对象是液体电介质丝网印刷在金属载体11的表面上并被干燥。为了在2500伏的电压下具有所需的绝缘性,第一介质层12的厚度大约是0.5毫米。
电介质的这一厚度是为了采用具有相对差的导热性的材料,低到如每一开氏温度0.2瓦,同时还提供小于每瓦3℃的最小使用热阻。随着以下的描述将变得更清楚,通过选择去除电介质材料,使用热阻被降低到每瓦0.5℃或更低。
在第一介质层12上,通过在叠层工艺中施加温度和压力,对大约62克的第一铜箔13进行叠层。正是在叠层期间,第一铜箔13附着在电介质材料上,并且该电介质材料固化。
构想通过常规的去除蚀刻工艺,第一铜箔13将形成为所需图案的电路线,以便形成例如第一电压源和第二电压源(图1中表示为原边电压和副边电压)以及也是在图1中的信号电路线13a和13b。
第一铜箔13已经被蚀刻并且所要求数目的电路已经形成以后,可光成像的电介质材料的第二介质层14覆盖第一铜箔13。已经发现真空涂层机是涂覆第二介质14的较好的涂覆器,因为在控制生产成本的制造工艺中它是重要的。
实际上,当根据本发明形成第二介质层14时,使第二介质层14干燥,然后曝光,显像和固化成一个图案,在第一铜箔13中形成的电路线之间留下电介质材料。如上所述,根据本发明的方法形成第二介质层14,从第一铜箔层13中的电路线的上表面去除电介质材料,从而形成上面可安放部件的平坦的表面,可以形成另外的电路线和连接。
对施加第二介质层14的工艺的一种改进作法是直接在铜箔层13中的电路线之间对液体电介质材料进行图案丝网印刷。图案丝网印刷工艺取消了采用薄膜电介质材料时需要的曝光和显影工艺步骤。
第三介质层29施加到平坦表面结构上,然后是对第二铜箔层19进行叠层。
例如,去除第三介质层29的一部分,如15处所示,使得部件部分16直接与形成在第一铜箔13中的副边电压电路相连。现在,通过从部件部分16到形成在第二铜箔19中的电路线18的引线17可以形成连接,像第一铜箔13施加到第一介质层12上那样,第二铜箔19叠在第三介质层29上。
标号20a和20b表示的电路线可以是同一电路的部分,也可以是完全不同的和单独的电路。图1中表示不同的元件部分21和22可以与电路线20a和20b相连。
应特别注意的是,根据本发明的结构安排使得通过回流焊接形成电连接23、24、25、26、27和28。因此,节省了成本,并且使复杂麻焊的连接变得容易,节省了材料。
下面参照图2,图中示出了用标号30表示的电路板卡的一种不同的结构。这一板卡30与图1的板卡10的一个不同之处在于由于电压特征包含在与这一板卡30上的信号电路线相同的铜箔层中,所以没有叠在被蚀刻的铜箔层上的第二介质层。
下面描述本发明的这一方面。电路板卡30包括由适合的金属如铜形成的载体31,作为地或公共部分,还作为散热部分。可光成像的电介质材料32施加到载体31的上表面并干燥。
在采用正好充足的压力的叠层工艺中将所需厚度的铜箔37施加到电介质材料32上,以便将铜箔附着到电介质材料上。这一叠层工艺期间的温度保持充分低。以便不使电介质材料固化。
如同对图1中的板卡10所作的那样,采用常规的去除蚀刻工艺,所需电路图案形成在图2中的载体31上的铜箔37中。将电介质材料32曝光为一个所要求的图案,该图案包括电互连通路33,热通路(未示出)和部件安装孔,如标号34所示,用于在该板卡的专门电路中通过焊料36焊接一部件35。
像任何电路板卡那样,电路板卡30通过溶液进行处理,去除未曝光或未复盖的电介质材料32的经选择的区域。现在将板卡30放在一定的温度下处理足够长的时间,使仍存在的电介质材料32固化。
图3表示根据本发明的铜焊盘38的环表结构,这使得能够通过采用回流焊接在电路点或元件部分和金属载体31之间形成互连。电路线39将任何其它所需的元件部分或电路点与金属载体31相连,因此可以得到上述优点。
通过将铜焊盘38的环形结构用作电介质去除处理期间的显像掩蔽物,得到了该环形结构的主要优点。借此,铜焊盘38提供了自对准互连通路结构。
电路板卡10和30都利用了可光成像的电介质材料,该材料提供了针对电太击穿如每毫米大于5000伏的良好的强度,因此电介质涂覆为具有良好散热特性的薄层。
上述制造工艺的一个重要特点是无需钻孔或铜喷镀就可实现全部互连。换句话说,根据本发明的制造方法,全部互连可通过作为制造工艺的一部分的回流焊接实现。
此外,如果特殊需要的话,可以施加一种适合的电介质材料层以代替采用直接在金属载体上的铜箔和所需的去除蚀刻工艺。在这种情况下,这种介质必须是光刻图案的,固化的,并且使其表面变粗糙和用铜喷镀。
根据本发明生产的电路板卡在隔离电压方面是有效的,并具有能量(热)耗散能力,不需要外部散热。在不需要费时和增加成本的铜喷镀、钻孔或其它机械操作的情况下,可以实现高密度的层到层和电路点到电路点之间的互连。
带有薄介质层的载体提供了极好的对发热部件散热的特性。此外,通过采用带有经选择的去除特性的电介质材料使得这种发热部件直接附着或至少靠近能够有效地作为散热器的金属载体。
利用环表焊盘结构大大提高了本发明的电路板卡结构的紧凑性,而不管该板卡是升压板卡、隔离电压转换板卡还是其它需要高散热功能的板卡,该环形焊盘结构使得能够通过焊接互连,这进一步降低了制造成本。当然,在需要的地方或通过加热或通过焊接可以预先形成和施加环形焊盘,并且电路线39可以是布线的形式,如果需要连接它可以与环形焊盘一起预先形成。
以上详细地描述了本发明。应理解在不脱离以下权利要求书所提出的发明精神和范围的前提下可作各种改变和修改。
Claims (8)
1.一种制造多层电路组件的方法,包括以下步骤:
提供作为载体的金属衬底,其表面被处理,以便接收一层预定材料;
将预定的液体膜或干膜电介质材料施加到所述金属衬底的所述经处理的表面上;
在受控的热度和压力下将铜箔材料叠到所述电介质材料上;
在所述叠放的铜箔材料中确定导体和通路图案;
溶解在由预定通路限定的区域中的所述电介质材料,形成一个孔;
固化所述金属衬底上的所述电介质材料;
将焊剂施加到元件安装焊盘和通路中;以及
将元件置于所述焊剂上的元件安装焊盘上,并回流所述焊剂。
2.如权利要求1描述的方法,其特征在于还包括步骤:交替相间地顺序增添多层电介质和导电层,确定所述要进行溶解的预定区域,以便通过环形结构的焊盘用所述回流焊剂形成通路。
3.如权利要求2描述的方法,其特征在于还包括步骤:将回流焊剂施加到由所述环形结构的焊盘确定的那些区域以及其它焊盘,以便提供牢固装配的电路板卡组件。
4.一种制造多层电路板的方法,包括:
形成包括铜基底的薄金属板;
直接在金属板上涂覆可固化的电介质涂层;
在包括中心开放的环形焊盘的可固化电介质层上形成布线层;
采用多个环形焊盘作为掩膜形成由开放的中心确定并从可固化的电介质延伸的孔;
在孔中淀积导电材料,以便将各个焊盘与金属板互连;以及
固化电介质。
5.如权利要求4描述的方法,其特征在于通过将干的,部分固化的膜叠在金属板上,来淀积电介质,在膜淀积后,但电介质膜完全固化之前,形成布线层和孔。
6.如权利要求4描述的方法,其特征在于电介质是可光成像的环氧树脂,并且形成孔的步骤包括将孔的中心下的环氧树脂暴露在电磁辐射中,并溶解暴露的环氧树脂,以便形成通过环形中心到板的孔。
7.如权利要求4描述的方法,其特征在于还包括以下步骤:产生多个电路板;以及在金属板和布线层上的一个或多个导体之间施加3000伏或更高的电压来测试一块或多块板,该布线层不与和金属板互连的环形焊盘相连。
8.如权利要求4描述的方法,其特征在于将导电材料淀积进孔的步骤包括将焊剂放在孔中,焊剂还放在多个环形焊盘上和其它的焊盘上,进一步包括以下步骤:将带有已上焊剂的布线端的表面安装元件放在电路板上;对电路板加热,使焊剂回流,以便用焊锡金属合金同时将环形焊盘与金属板互连,并将元件布线端焊接到焊盘上;以及冷却电路板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US429612 | 1995-04-27 | ||
US08/429,612 US5670750A (en) | 1995-04-27 | 1995-04-27 | Electric circuit card having a donut shaped land |
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CN96105401A Division CN1084136C (zh) | 1995-04-27 | 1996-04-03 | 具有环形焊盘的电路板卡 |
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CN1390086A true CN1390086A (zh) | 2003-01-08 |
CN1217566C CN1217566C (zh) | 2005-08-31 |
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Application Number | Title | Priority Date | Filing Date |
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CN96105401A Expired - Fee Related CN1084136C (zh) | 1995-04-27 | 1996-04-03 | 具有环形焊盘的电路板卡 |
CN011227087A Expired - Fee Related CN1217566C (zh) | 1995-04-27 | 2001-07-05 | 制造多层电路组件的方法 |
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CN96105401A Expired - Fee Related CN1084136C (zh) | 1995-04-27 | 1996-04-03 | 具有环形焊盘的电路板卡 |
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US (2) | US5670750A (zh) |
JP (1) | JP3953122B2 (zh) |
CN (2) | CN1084136C (zh) |
MY (1) | MY117343A (zh) |
SG (1) | SG70983A1 (zh) |
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-
1995
- 1995-04-27 US US08/429,612 patent/US5670750A/en not_active Expired - Fee Related
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1996
- 1996-03-08 SG SG1996006625A patent/SG70983A1/en unknown
- 1996-03-14 JP JP05729796A patent/JP3953122B2/ja not_active Expired - Fee Related
- 1996-04-03 CN CN96105401A patent/CN1084136C/zh not_active Expired - Fee Related
- 1996-04-05 MY MYPI96001295A patent/MY117343A/en unknown
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1997
- 1997-03-03 US US08/811,077 patent/US5867898A/en not_active Expired - Fee Related
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CN101030546B (zh) * | 2006-02-28 | 2010-11-03 | 飞思卡尔半导体公司 | 电容安装方法 |
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SG70983A1 (en) | 2000-03-21 |
CN1142169A (zh) | 1997-02-05 |
MY117343A (en) | 2004-06-30 |
US5867898A (en) | 1999-02-09 |
JPH08307028A (ja) | 1996-11-22 |
US5670750A (en) | 1997-09-23 |
CN1217566C (zh) | 2005-08-31 |
JP3953122B2 (ja) | 2007-08-08 |
CN1084136C (zh) | 2002-05-01 |
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