CN1360736A - 用于芯片模块的芯片载体及芯片模块的制造方法 - Google Patents

用于芯片模块的芯片载体及芯片模块的制造方法 Download PDF

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CN1360736A
CN1360736A CN00809974A CN00809974A CN1360736A CN 1360736 A CN1360736 A CN 1360736A CN 00809974 A CN00809974 A CN 00809974A CN 00809974 A CN00809974 A CN 00809974A CN 1360736 A CN1360736 A CN 1360736A
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大卫·芬恩
曼弗雷德·里兹勒
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Linxens Holding SAS
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Abstract

本发明涉及用于制造芯片模块(18)的芯片载体,该芯片模块具有衬底和设于衬底上的连接引线,其中连接引线被设计成类似于条状且在衬底上平行延伸,连接引线由置于衬底上的导电连接导线束(12,13)构成,衬底由载体膜(11)形成。

Description

用于芯片模块的芯片载体及芯片模块的制造方法
技术领域
本发明涉及具有衬底及排列在衬底上的连接引线的芯片载体(carrier)，其中连接引线被设计成类似于条状并在衬底上平行延伸。此外，本发明涉及使用该芯片载体制造的芯片模块以及制造这种芯片模块的方法。
背景技术
通常使用芯片载体来制造芯片模块，该芯片载体的表面设有用以与芯片上凸出的接触金属化相连的印刷电路结构。使用蚀刻工艺中制造的印刷电路结构确实能使任何想要的印刷电路结构成为可能，尤其是那些具有复杂设计的结构。然而，即使常规芯片载体的提供或制造，哪怕是与芯片模块制造用芯片的实际接触工艺无关，也需要复杂且相应昂贵的工序。使用蚀刻技术需要用于衬底的载体层的适当结构，在使用光刻工艺来限定印刷电路结构时，除了所谓的蚀刻阻挡层以外，该结构还必须设有漆(lacquer)涂层。
从DE 195 41 039 A1知道一种具有芯片载体的芯片模块，其中在绝缘层上形成的连接引线具有条状设计并在衬底的绝缘层上相互平行地延伸，它们都分别分配给芯片的凸出接触金属化。为了制造这种公知的芯片模块，在一连续衬底载体上排列芯片载体的各衬底，此连续衬底载体经由在衬底载体上连续延伸的连接引线与各衬底相连。在此公知方法中，仅使用薄膜状衬底载体使连接引线与衬底相连。
发明内容
从公知的现有技术着手，本发明的目的在于提供一种用于芯片模块的芯片载体或一种相对于公知的芯片模块表现出设计特别简单的芯片模块的制造方法，因而使特别节约成本的制造成为可能。
使用具有如权利要求1所述特征的芯片载体来实现该目的。
在依据本发明的芯片载体中，连接引线由置于衬底上的导电连接导线束构成，衬底由载体膜形成。
把连接引线设计成与载体膜完全无关的连接导线束，使得可不必以昂贵的蚀刻技术为基础来制造连接引线。因此，依据本发明的芯片载体由载体膜与连接导线束(strand)(它们都代表初始状态下的独立元件)的组合构成，从而制造芯片载体不需要例如使用蚀刻工艺等特殊的技术，而只需由载体膜直接形成衬底的简单连接或接合工艺。把衬底用作载体膜还使衬底具有特别平坦的设计。
在本发明的一个较佳实施例中，与连接导线束相对的载体膜一侧设有至少一个附加的导电导线束，其中绝缘载体膜设置在一面的连接导线束与另一面的附加导电导线束之间，从而形成中间层。
在连接导线束与芯片接触后，在载体膜的相对侧添加此至少一个导电导线束形成一电容器结构，它设置成与芯片并联。恰恰在收发器的技术领域中，芯片模块的这一特殊结构产生了特殊的优点，即当连接导线束与线圈单元接触时，可明显地增加通过把芯片与线圈单元组合而形成的收发器单元的范围。
尤其是，对于使用芯片载体的芯片模块的自动制造，已证明有利的是至少部分地给连接导线束提供用以与芯片的接触金属化接触的连接材料涂层，从而在提供衬底后可使芯片直接接触连接导线束，而无须任何附加的中间步骤。此连接材料涂层可由连接焊接涂层或导电粘合剂涂层等构成。
通过至少部分地给连接导线束提供用以与芯片的凸出接触金属化接触的接触金属化，使得可获得极其高的质量，即可靠的连接，尤其是通过接触金属化所提高的连接导线束的表面质量。当然，可使用由铜或铜合金制成的连接导线束来形成与芯片的接触金属化的直接连接，尤其是在芯片的接触金属化示出具有相应低熔点的铅/锡合金或类似合金。
如果芯片载体的连接导线束与线圈单元的端子相连，则可把芯片载体用作制造收发器的基本单元，其中仅需要增强该基本单元与芯片的接触。
如上所述，根据上述芯片模块，还可提供一种收发器模块，其中依据本发明，与芯片的接触金属化接触的连接导线束与线圈单元的端子相连。
在依据本发明的芯片模块中，芯片的接触金属化与芯片载体的连接导线束的顶面接触。除了可以简单地倒装片接触来制造芯片模块以外，该芯片模块结构还提供了可进一步应用与连接导线束相对的衬底一侧的优点。
如果与芯片的接触金属化接触的连接导线束另外还与线圈单元的端子相连，则获得了具有相当简单的结构的收发器模块。
依据本发明的制造芯片模块的方法包含以下步骤：
-把至少两个导电连接导线束加到载体膜的一侧，从而这些连接导线束在载体膜上平行延伸，以及
-使芯片的接触金属化与连接导线束接触，从而芯片的接触金属化与各连接导线束相连。
如在开始描述依据本发明的芯片模块的结构时已强调的，该制造工艺的特征在于，由于可通过连接导线束与载体膜的简单组合来实现设有连接引线的衬底这一事实，所以可以最低数目的步骤和依据本发明的接触类型使得简单的倒装片接触成为可能。
如果连接导线束在与芯片接触前与线圈单元接触，则制造工艺的第一部分(它也可与随后的接触芯片无关地执行)产生了具有芯片载体形式的中间产品，该产品可直接用于制造收发器单元。
如果连接导线束连续地加到载体膜，则可实现依据本发明的方法的一个特别实用的变化，从而使连接导线束和载体膜成为连续导线束，并使它们在接触区连续相向移动，从而产生粘合。
如果在形成与连接导线束的接触区前，在载体膜的限定距离处设置窗口孔，从而通过连接导线束覆盖随后形成的接触区中的窗口孔，同时形成穴状接触插孔，也可制造芯片模块，而不影响连续的工艺，其中芯片的接触金属化与连接导线束的底面接触，且芯片本身位于与连接导线束相对的载体膜一侧。
因此，此方法的变形使得制造特别平坦或薄的芯片模块成为可能。
在另一个方法变形中，通过把至少一个附加的导电背导线束(counter-strand)置于与待加上连接导线束的一侧相对的一侧，可制造具有电容器结构的芯片模块。该工艺可在把连接导线束加到载体膜之前或之后进行。
通过在层叠工艺中把连接导线束和/或至少一个背导线束加到载体膜上，使得实现该方法的一个特别容易因而节约成本的方式成为可能。
此外，在此连接中，有利的是使用热熔性涂层在连接导线束和/或至少一个背导线束与载体膜之间形成粘合。
附图概述
以下将根据附图更详细地说明芯片模块的一个实施例极制造该芯片模块的方法的一个变形。图中：
图1是用于制造芯片模块的芯片载体的俯视图；
图2是图1所示的芯片载体，一芯片与其接触而形成芯片模块；
图3是芯片模块的第一实施例的剖面图；
图4是芯片模块的第二实施例的剖面图；
图5是芯片模块的第三实施例的剖面图；
图6是图5所示芯片模块的衬底的电学等效电路图；
图7是用于执行芯片模块制造方法的变形的器件的示意图。
本发明的较佳实施方式
图1示出具有载体膜11和加到载体膜11一侧的连接导线束12和13的芯片载体导线束10的剖面的俯视图。
图2示出图1所示的芯片载体导线束10，在芯片载体导线束10上有许多隔开的芯片14与其接触。如图2所示，具有其接触金属化(在技术用语中也叫做“凸块(bump)”)的芯片14在倒装片技术中以这样的方式与连接导线束12、13接触，从而以导电的方式把一凸块15或16分配给连接导线束12、13。
如图2中的分隔线17所示，在芯片14与芯片载体导线束10接触后，通过分开贯穿芯片载体导线束10的切口，使芯片模块18与固定在一起的复合芯片模块分离。
图3示出依据图2中交线III-III的剖面图。如图所示，以倒装片技术，使芯片14与沿分隔线17和芯片载体导线束10分离的芯片载体19的连接导线束12、13上的凸块15、16接触。在此情况下，形成芯片载体19的衬底的载体膜11由聚酰亚胺树脂薄膜(kapton)构成，其顶面覆盖有由所谓的E铜制成的连接导线束12、13。为了提高连接导线束12、13的表面质量，在此情况下，后者涂敷有接触金属化。也可把不导电的材料用于芯片载体19或芯片载体导线束10，例如，环氧玻璃、聚酯、聚碳酸酯和聚酰亚胺，其中例如使用聚酰亚胺的载体膜11的柔性设计是有利的，尤其是在使用以下参考图7更详细说明的这种制造工艺时。
图4示出芯片模块20的变形，其中芯片14与连接导线束12、13的底面22接触，这与图3所示的芯片模块18(其中芯片14与连接导线束12、13的顶面21接触)相反。
为此，在被连接导线束12、13覆盖的芯片载体28的载体膜11的区域中形成穴状接触插孔23、24，它们用来容纳芯片14的凸块15、16。如果经由例如接触金属化适当地制备连接导线束12、13的表面，则可使凸块15、16与连接导线束12、13直接接触，或可执行图4所示的接触工艺，其中可额外地提供分开的接合材料，例如位于连接导线束12、13的底面22与芯片14的凸块15、16之间的焊接材料25等。
图5示出芯片模块26的另一个实施例，其中与图3所示芯片模块18相反，背导线束27射在与连接导线束12、13相对的载体膜11一侧，以与连接导线束12、13相同的方式把背导线束27加到载体膜11，背导线束27可由与连接导线束12、13相同的材料构成。
图5所示的结构通过一面的载体层11形式的绝缘中间层使相互分开的连接导线束12、13和另一面的背导线束27相对，此结构产生了一电容器配置，其电路图如图6所示。依据图6，衬底28的结构产生了平行于芯片14排列的两个电容器的串联连接。
图7示出用于制造芯片模块的可能变形，其中尤其是图7所示的系统设计使得制造具有连续且互连配置的图4所示芯片模块20成为可能。为此，图7所示的系统包括有载体膜11缠绕在其上的进给辊30，载体膜11沿箭头31的方向展开，并在系统末端处的产品辊(product roll)32上卷起。在进给辊30与产品辊32之间的区域内是带有卷起的连接导线束12或13的两个进给辊33和34。位于一面的进给辊33和34与另一面的产品辊32之间的是层压辊(laminating roller)35。为了制造如图4所示具有连续的带状互连配置的芯片载体28或芯片模块20，沿图7所示的箭头31的方向对载体膜11进行计时和推进，其中通过冲压装置36以预定的时钟速率在限定的间隔处在载体膜11中形成窗口孔，以形成图4所示的接触插孔23、24。在冲压装置36的下游，从进给辊33、34把连接导线束12、13提供给载体膜11，然后使连接导线束12、13在接触区38中由层压辊35和反作用辊37形成的辊隙(roll slit)中与载体膜11接触。因而，此接合或连接工艺的结果是，以连续的方式在层压辊35的下游产生图4剖面图中所示的芯片载体28，并缠绕在产品辊32上。现在，可把产品辊32用作后续制造工艺(用于使芯片14与连接导线束12、13连续或定时接触)的进给辊，从而可连续地制造图4所示的互连芯片模块20。
为了随后制造收发器单元，还可在层叠工艺后使线圈单元与连接导线束接触。这里，可根据需要设计线圈。可把线圈配置在分开的载体上，或者在一特别有利的变形中不使用载体，而把线圈直接加到载体膜上与连接导线束接触。在此连接中，使用线盘是有利的。

Claims (14)

1.一种用于形成芯片模块的芯片载体，所述芯片模块具有衬底及设在衬底上的连接引线，其中连接引线被设计成类似于条状且在衬底上平行延伸，
其特征在于
连接引线由加到衬底的导电连接导线束(12，13)构成，衬底由载体膜(11)形成。
2.如权利要求1所述的芯片载体，
其特征在于
在与连接导线束(12，13)相对的载体膜(11)一侧设有至少一个附加的导电背导线束(27)，以产生电容，其中绝缘载体膜设为一面的连接导线束与另一面的背导线束之间的中间层。
3.如权利要求1或2所述的芯片载体，
其特征在于
连接导线束(12，13)至少部分地设有用于与芯片(14)的接触金属化(15，16)接触的连接材料涂层这一事实。
4.如以上权利要求中任一项所述的芯片载体，
其特征在于
连接导线束(12，13)至少部分地设有用于与芯片(14)的接触金属化(15，16)接触的接触金属化。
5.如以上权利要求中任一项所述的芯片载体，
其特征在于
连接导线束(12，13)与线圈单元的端子相连。
6.一种芯片模块，具有如权利要求1到5中任一项所述的芯片载体以及芯片，所述芯片具有凸出的接触金属化的连接表面，
其特征在于
芯片(14)的接触金属化(15，16)与连接导线束(12，13)的顶面(21)接触。
7.如权利要求6所述的芯片模块，
其特征在于
与芯片的接触金属化(15，16)接触的连接导线束(12，13)与线圈单元的端子相连。
8.一种用于制造如权利要求6或7所述的芯片模块的方法，
其特征在于以下步骤：
-把至少两个导电连接导线束(12，13)加到载体膜(11)的一侧，从而连接导线束在载体表面上平行延伸，以及
-使芯片(14)的接触金属化(15，16)与连接导线束接触，从而芯片的接触金属化与各连接导线束接触。
9.如权利要求8所述的制造芯片模块的方法，
其特征在于
在使连接导线束(12，13)与芯片(14)接触前，连接导线束与线圈单元接触。
10.如权利要求8或9所述的制造芯片模块的方法，
其特征在于
把连接导线束(12，13)以这样的方式连续加到载体膜(11)，从而把连接导线束与载体膜制备为连续导线束，并使它们在接触区(38)内连续相向移动，同时形成粘合。
11.如权利要求10所述的方法，
其特征在于
在形成与连接导线束(12，13)的接触区(38)前，在载体膜的限定距离处设置窗口孔，从而以连接导线束(12，13)覆盖随后形成的接触区中的窗口孔，同时形成穴状接触插孔(23，24)。
12.如权利要求8到11中任一项所述的方法，
其特征在于
在载体膜(11)的与待加上连接导线束(12，13)的一侧相对的一侧上涂敷至少一个附加的导电背导线束。
13.如权利要求8到12中任一项所述的方法，
其特征在于
在层压工艺中把连接导线束(12，13)和/或至少一个背导线束(27)加到载体膜(11)。
14.如权利要求13所述的方法，
其特征在于
通过施加热熔在连接导线束(12，13)和/或至少一个背导线束(27)与载体膜(11)之间产生粘合。
CNB00809974XA 1999-05-05 2000-05-04 用于芯片模块的芯片载体及芯片模块的制造方法 Expired - Fee Related CN1200460C (zh)

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