CN1374993A - 电子标签组件及其方法 - Google Patents

电子标签组件及其方法 Download PDF

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CN1374993A
CN1374993A CN00804478A CN00804478A CN1374993A CN 1374993 A CN1374993 A CN 1374993A CN 00804478 A CN00804478 A CN 00804478A CN 00804478 A CN00804478 A CN 00804478A CN 1374993 A CN1374993 A CN 1374993A
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substrate
integrated circuit
conductive
circuit lead
binding agent
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诺埃尔·H·埃伯哈特
肖恩·洛文
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Motorola Solutions Inc
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Motorola Inc
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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Abstract

电子标签组件(100)包括:其上具有天线图形(104,106)的基底(102);具有电连接端子(204,206)的集成电路管芯108,电连接端子(204,206)与天线图形(104,106)直接接触或连接;和置于基底和集成电路管芯(108)之间的非导电粘结剂(202),用于把二者固定在一起,并保持电连接的完整性。优选地,在引入非导电粘结剂(202)的同时,在集成电路管芯(108)上施加夹持力以保持电气端子(204,206)和天线图形(104,106)之间的接触。

Description

电子标签组件及其方法
技术领域
本发明一般涉及电子组件,具体涉及一种使用集成电路部件的电子标签组件。
发明背景
在电子应用中,经常需要形成包括有集成电路部件和承载基底的组件,在集成电路部件和承载基底之间有电连接。通常,通过焊接、引线键合、电镀或通过各向异性的导电粘结剂建立集成电路管芯(die)和承载基底之间的电连接界面。这些现有技术方法有其各自的优点和缺点,其中包括对特定类型部件和制造工艺,组装成本等等的适用性。
各向异性导电粘结剂已经得到广泛应用,因为其在制造过程中具有某些得到共识的优点。典型的各向异性导电粘结剂包含金属或其它导电颗粒,当在电连接界面之间挤压这些颗粒时可以在电连接界面之间形成单向电结合。在一个或多个电连接界面上的凸起或隆起部分可以促进这种挤压作用。在对小尺寸部件使用导电粘结剂时,会涉及某些制造难题。例如,必须精确地施加粘结剂,避免紧密间隔的端子之间发生短路。而且,可能需要对接触表面进行特殊处理,以便促进适当的电连接。这些和其它成本缺陷已经限制了把导电粘结剂用于集成电路管芯与承载基底的结合。
电子标签组件需要一种低成本方法来连接集成电路管芯,以适用于大量生产。现有技术中描述的集成电路管芯结合方法不能充分地满足这种需要。因此,需要一种用于结合集成电路以形成一个组件(例如电子标签组件)的改进的方法。
附图说明
图1是根据本发明的电子标签组件的平面图;
图2是图1的电子标签组件的剖视图;
图3显示根据本发明在预组装阶段的基底和集成电路管芯;
图4显示根据本发明的集成电路管芯上的电连接端子与基底上导电图形形式的天线接触;
图5显示根据本发明在集成电路管芯和基底之间引入的非导电粘结剂;
图6显示根据本发明的集成电路组件,其中粘结剂保持着集成电路管芯的电连接端子和基底的导电图形之间的电接触。
优选实施例的详细描述
本发明提供一种适用于大量、低成本应用的电子标签组件,其中使用非导电粘结剂将集成电路管芯结合到基底上。把集成电路管芯放置到基底上,使得集成电路管芯上的电气端子与基底上导电图形形式的天线相接触。在保持电气端子和导电图形之间接触的同时,在电路管芯和基底之间引入非导电粘结剂,以把集成电路管芯固定到基底上,并且保持电气连接端子和导电图形之间的接触。优选地,在集成电路管芯上施加夹持力以便在引入非导电粘结剂的同时保持电气端子和导电图形之间的接触。
图1和图2显示根据本发明的电子标签组件100的平面图和剖视图。电子标签组件100是一个集成电路组件,包括其上具有通信电路的芯片型部件108,和电耦合天线104,106。芯片型部件108是一个使用标准制造工艺形成的半导体管芯。优选地,该管芯108具有隆起的电导体204,206或凸起形式的电连接端子来作为电连接触点。
在优选实施例中,在基底102上实现天线104,106,天线最好由纤维材料(例如纸或布)、塑料或其它廉价材料形成。天线104,106被形成为两个相互间隔开淀积的导电材料图形。优选的导电材料包括碳素墨水,充碳聚合物,或其它适合低成本应用的材料。可以以低成本方式在基底上印刷、喷涂或淀积导电图形。在优选实施例中,导电图形和电连接导体没有过渡元素(transitional elements)。
使用非导电粘结剂202把集成电路管芯108粘附到基底102上。电连接触点204,206从集成电路管芯108上突出并直接与基底102上的导电图形104,106接触或连接。非导电粘结剂202介于集成电路管芯108和基底102之间,在其间形成直接接触。粘结剂202把集成电路管芯108固定到基底102上,并保持电导体204,206和导电图形104,106之间的电接触。
图3,4,5和6显示根据本发明在各个制造阶段的电子标签组件100。参见图3,在基底上印刷或淀积天线或导电图形104,106,并单独地制备集成电路管芯108(例如,通过标准的制造工艺)。参见图4,把集成电路管芯108和基底102靠在一起,使得在管芯108上的电导体204,206和基底102上的导电图形104,106之间建立接触。施加一个夹持力以保持电导体204,206和导电图形104,106之间的接触。
参见图5,在保持电导体204,206和导电图形104,106之间接触的同时,在集成电路管芯108和基底102之间引入非导电粘结剂。优选地,利用夹持力把集成电路管芯108固定就位,同时把粘结剂施放针502置于管芯108和基底102之间,并施放粘结剂。在粘结剂固化时保持夹持力。如图6所示,当除去该夹持力时,由粘结剂602保持电导体204,206和导电图形104,106之间的接触。
本发明相对于现有技术具有很多优点。提供了一种适用于大量、低成本应用的电子标签组件,其无需使用昂贵的各向异性粘结剂,并且无需使用显著增加成本或复杂性的特殊材料和工艺。通过在集成电路管芯端子和天线图形之间建立直接电接触,并通过使用非导电粘结剂来保持这种接触,提供了一种廉价的制造工艺。

Claims (10)

1.一种形成集成电路组件的方法,包括以下步骤:
把其上具有电气端子的集成电路管芯和其上具有天线图形的基底靠在一起,使得在电气端子和天线图形之间建立接触;
在电气端子和天线图形之间建立直接接触;
在集成电路管芯和基底之间引入非导电粘结剂;和
使用该非导电粘结剂保持电气端子和天线图形之间的直接接触。
2.根据权利要求1的方法,进一步包括以下步骤:在基底上印刷天线图形。
3.根据权利要求2的方法,其中印刷步骤包括以下步骤:使用含碳材料印刷导电图形。
4.根据权利要求3的方法,其中印刷步骤包括以下步骤:在纸上印刷导电图形。
5.一种形成电子标签组件的方法,按顺序包括以下步骤:
(a)把一集成电路管芯放置在一基底上,使得集成电路管芯上的电导体与基底上淀积的天线图形接触;和
(b)在保持电导体和天线图形之间接触的同时,在集成电路管芯和基底之间引入粘结剂,以把集成电路管芯固定到基底上,和固定电导体和天线图形之间的接触。
6.根据权利要求5的方法,其中粘结剂由非导电粘结剂构成。
7.根据权利要求5的方法,其中步骤(b)包括以下步骤:使粘结剂接触集成电路管芯和天线图形,以在其间形成结合。
8.根据权利要求5的方法,其中基底由纸形成,并且进一步包括以下步骤:在纸上印刷天线图形。
9.一种电子标签,包括:
一基底;
一天线,包括在基底上形成的相互间隔开的第一和第二导电图形;
一集成电路管芯,具有从其上突出的第一和第二电连接导体,第一和第二电连接导体分别直接连接第一和第二相互间隔开的导电图形;和
非导电粘结剂,置于第一和第二电连接导体周围,和在第一和第二相互间隔开的导电图形之上,把集成电路管芯固定到基底上。
10.根据权利要求9的电子标签,其中基底由纤维材料形成,导电图形包括在其上设置的导电墨水。
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