CN1323574C - 元器件安装装置 - Google Patents

元器件安装装置 Download PDF

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Publication number
CN1323574C
CN1323574C CNB200410083513XA CN200410083513A CN1323574C CN 1323574 C CN1323574 C CN 1323574C CN B200410083513X A CNB200410083513X A CN B200410083513XA CN 200410083513 A CN200410083513 A CN 200410083513A CN 1323574 C CN1323574 C CN 1323574C
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CN
China
Prior art keywords
components
parts
installation
head
supply unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB200410083513XA
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English (en)
Chinese (zh)
Other versions
CN1592575A (zh
Inventor
田村孝太
石部敏幸
菜嶋保积
西辉树
梶原正敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN1592575A publication Critical patent/CN1592575A/zh
Application granted granted Critical
Publication of CN1323574C publication Critical patent/CN1323574C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CNB200410083513XA 2000-03-17 2001-03-16 元器件安装装置 Expired - Fee Related CN1323574C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP075828/00 2000-03-17
JP2000075828A JP2001267798A (ja) 2000-03-17 2000-03-17 部品装着装置
JP075828/2000 2000-03-17

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB011120088A Division CN1183818C (zh) 2000-03-17 2001-03-16 元器件安装装置

Publications (2)

Publication Number Publication Date
CN1592575A CN1592575A (zh) 2005-03-09
CN1323574C true CN1323574C (zh) 2007-06-27

Family

ID=18593659

Family Applications (2)

Application Number Title Priority Date Filing Date
CNB011120088A Expired - Fee Related CN1183818C (zh) 2000-03-17 2001-03-16 元器件安装装置
CNB200410083513XA Expired - Fee Related CN1323574C (zh) 2000-03-17 2001-03-16 元器件安装装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CNB011120088A Expired - Fee Related CN1183818C (zh) 2000-03-17 2001-03-16 元器件安装装置

Country Status (4)

Country Link
JP (1) JP2001267798A (enExample)
KR (1) KR20010090483A (enExample)
CN (2) CN1183818C (enExample)
TW (1) TW488191B (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003067757A1 (en) * 2002-02-06 2003-08-14 Mirim Intellectual Robot Technology Co., Ltd Blank mounting apparatus for fabrication of quartz oscillator
JP4203303B2 (ja) * 2002-03-28 2008-12-24 Juki株式会社 電子部品実装装置
DE10236004B4 (de) * 2002-08-06 2007-08-23 Siemens Ag Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen
JP2004103923A (ja) 2002-09-11 2004-04-02 Tdk Corp 電子部品の実装装置および実装方法
JP4147963B2 (ja) * 2003-02-10 2008-09-10 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
JP3879679B2 (ja) * 2003-02-25 2007-02-14 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
CN1592574B (zh) * 2003-09-01 2010-06-09 重机公司 电子器件安装机中的电子器件的吸附位置修正装置
KR100552884B1 (ko) * 2003-11-04 2006-02-20 티디케이가부시기가이샤 전자 부품을 장착하기 위한 장치 및 방법
KR101009670B1 (ko) * 2004-03-30 2011-01-19 엘지디스플레이 주식회사 검사 장비
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
CN100359770C (zh) * 2004-12-31 2008-01-02 技嘉科技股份有限公司 一种针脚座送料装置
DE102005013283B4 (de) * 2005-03-22 2008-05-08 Siemens Ag Bestückautomat zum Bestücken von Substraten mit elektrischen Bauelementen
KR101308467B1 (ko) * 2009-08-04 2013-09-16 엘지디스플레이 주식회사 전자 부품 실장 장치 및 방법
CN101662928B (zh) * 2009-09-14 2011-07-06 邓智军 一种具有影像定位的电路板校位装置和钻铣装置
CN102641821A (zh) * 2011-02-17 2012-08-22 一诠精密工业股份有限公司 用于黏着光学透镜的点胶机
JP6166278B2 (ja) * 2012-11-27 2017-07-26 富士機械製造株式会社 部品実装機
CN104062073A (zh) * 2013-03-20 2014-09-24 鸿富锦精密工业(深圳)有限公司 动平衡检测装置
CN103220900B (zh) * 2013-04-09 2016-10-05 深圳市东旭发自动化有限公司 一种自动贴片机
JP6135598B2 (ja) * 2013-08-20 2017-05-31 株式会社村田製作所 チップの振込装置
CN103841764B (zh) * 2014-03-15 2017-06-06 深圳市鹰眼在线电子科技有限公司 Fpc补强片智能贴装机
KR101465125B1 (ko) * 2014-04-25 2014-11-26 안재은 오링 자동 조립 장치
CN104105356B (zh) * 2014-07-30 2017-04-05 东莞市新泽谷机械制造股份有限公司 双叉片定位送料机构
CN105149924A (zh) * 2015-09-09 2015-12-16 舒建文 一种贴件机
CN105722382A (zh) * 2016-03-23 2016-06-29 广东工业大学 一种设有横置式同步供料机构的贴片机及供料方法
JP7018709B2 (ja) * 2017-01-24 2022-02-14 Thk株式会社 加工制御システム、及び運動案内装置
CN107454820A (zh) * 2017-08-03 2017-12-08 江门市高翔电气智能化有限公司 一种插件机
KR20190091018A (ko) * 2018-01-26 2019-08-05 한화정밀기계 주식회사 부품 실장 장치
CN109287112B (zh) * 2018-09-21 2020-12-29 创维电子器件(宜春)有限公司 一种pcba自动组装设备
CN109247008A (zh) * 2018-10-30 2019-01-18 重庆隆成电子设备有限公司 一种软硬贴合机及贴片方法
CN109348701B (zh) * 2018-12-04 2023-12-15 东莞市南部佳永电子有限公司 振动型管式飞达
CN113035745B (zh) * 2021-02-25 2022-03-18 东莞普莱信智能技术有限公司 一种芯片贴装装置
CN114496848A (zh) * 2022-01-06 2022-05-13 浙江鼎炬电子科技股份有限公司 一种半导体元件组装方法
IT202300025071A1 (it) * 2023-11-24 2025-05-24 Gd Spa Una stazione operativa per alimentare dei componenti elettronici, in particolare dei microprocessori, in una macchina confezionatrice di articoli

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765993A (en) * 1987-01-20 1988-08-23 Owades Joseph L Preparation of alcohol-free barley malt-based beverage
JPH11330799A (ja) * 1998-05-21 1999-11-30 Sony Corp 部品装着装置
JP2000031695A (ja) * 1998-07-16 2000-01-28 Matsushita Electric Ind Co Ltd 電子部品の実装方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0780108B2 (ja) * 1988-10-08 1995-08-30 ティーディーケイ株式会社 部品搭載機におけるランダム搭載方法
JPH03257896A (ja) * 1990-03-07 1991-11-18 Sanyo Electric Co Ltd 部品供給装置
JP3165289B2 (ja) * 1993-07-12 2001-05-14 ヤマハ発動機株式会社 表面実装機
JP3336774B2 (ja) * 1994-11-15 2002-10-21 松下電器産業株式会社 電子部品実装装置
JPH11340686A (ja) * 1998-05-28 1999-12-10 Sony Corp チップ部品供給方法及び装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765993A (en) * 1987-01-20 1988-08-23 Owades Joseph L Preparation of alcohol-free barley malt-based beverage
JPH11330799A (ja) * 1998-05-21 1999-11-30 Sony Corp 部品装着装置
JP2000031695A (ja) * 1998-07-16 2000-01-28 Matsushita Electric Ind Co Ltd 電子部品の実装方法

Also Published As

Publication number Publication date
JP2001267798A (ja) 2001-09-28
KR20010090483A (ko) 2001-10-18
CN1183818C (zh) 2005-01-05
CN1592575A (zh) 2005-03-09
TW488191B (en) 2002-05-21
CN1317926A (zh) 2001-10-17

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SE01 Entry into force of request for substantive examination
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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070627

Termination date: 20100316