CN1314829A - 电子线路和元件的印刷 - Google Patents

电子线路和元件的印刷 Download PDF

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Publication number
CN1314829A
CN1314829A CN98814277A CN98814277A CN1314829A CN 1314829 A CN1314829 A CN 1314829A CN 98814277 A CN98814277 A CN 98814277A CN 98814277 A CN98814277 A CN 98814277A CN 1314829 A CN1314829 A CN 1314829A
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CN
China
Prior art keywords
solution
printing
deposit
layer
redox reaction
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Pending
Application number
CN98814277A
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English (en)
Chinese (zh)
Inventor
S·纳让
S·沙马
P·科克斯
S·温图拉
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SRI International Inc
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SRI International Inc
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Publication of CN1314829A publication Critical patent/CN1314829A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C23C18/1216—Metal oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/04—Construction or manufacture in general
    • H01M10/0436—Small-sized flat cells or batteries for portable equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0402—Methods of deposition of the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0402—Methods of deposition of the material
    • H01M4/0404—Methods of deposition of the material by coating on electrode collectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0402—Methods of deposition of the material
    • H01M4/0414—Methods of deposition of the material by screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0402—Methods of deposition of the material
    • H01M4/0416—Methods of deposition of the material involving impregnation with a solution, dispersion, paste or dry powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/049—Manufacturing of an active layer by chemical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/049—Manufacturing of an active layer by chemical means
    • H01M4/0492—Chemical attack of the support material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/40—Printed batteries, e.g. thin film batteries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Secondary Cells (AREA)
  • Hybrid Cells (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Coils Or Transformers For Communication (AREA)
CN98814277A 1998-08-21 1998-11-24 电子线路和元件的印刷 Pending CN1314829A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9770698P 1998-08-21 1998-08-21
US60/097706 1998-08-21

Publications (1)

Publication Number Publication Date
CN1314829A true CN1314829A (zh) 2001-09-26

Family

ID=22264746

Family Applications (1)

Application Number Title Priority Date Filing Date
CN98814277A Pending CN1314829A (zh) 1998-08-21 1998-11-24 电子线路和元件的印刷

Country Status (8)

Country Link
US (1) US6855378B1 (enExample)
EP (1) EP1113885A4 (enExample)
JP (1) JP2002523892A (enExample)
KR (1) KR20010072835A (enExample)
CN (1) CN1314829A (enExample)
AU (1) AU1602099A (enExample)
MX (1) MXPA01001907A (enExample)
WO (1) WO2000010736A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
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CN100511774C (zh) * 2003-06-18 2009-07-08 日产自动车株式会社 制造二次电池电极的方法、用于制造二次电池电极的设备和二次电池电极
CN102398438A (zh) * 2010-09-15 2012-04-04 中国科学院化学研究所 激光或微波处理喷印金属导电油墨制备的初级电路的方法

Families Citing this family (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7625420B1 (en) 1997-02-24 2009-12-01 Cabot Corporation Copper powders methods for producing powders and devices fabricated from same
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
IL153121A0 (en) 2000-06-02 2003-06-24 Stanford Res Inst Int Polymer composition
ATE400904T1 (de) 2001-06-01 2008-07-15 Polyfuel Inc Austauschbare brennstoffpatrone, brennstoffzellenaggregat mit besagter brennstoffpatrone für tragbare elektronische geräte und entsprechendes gerät
US7316855B2 (en) 2001-06-01 2008-01-08 Polyfuel, Inc. Fuel cell assembly for portable electronic device and interface, control, and regulator circuit for fuel cell powered electronic device
EP1523783A2 (de) * 2002-02-28 2005-04-20 Häring, Thomas Schichtstrukturen und verfahren zu deren herstellung
EP1369230A1 (en) * 2002-06-05 2003-12-10 Kba-Giori S.A. Method of manufacturing an engraved plate
GB0218202D0 (en) * 2002-08-06 2002-09-11 Avecia Ltd Organic light emitting diodes
GB2391871A (en) * 2002-08-16 2004-02-18 Qinetiq Ltd Depositing conductive solid materials using reservoirs in a printhead
JP4581326B2 (ja) * 2002-12-27 2010-11-17 日産自動車株式会社 積層型電池の製造装置
US20040191626A1 (en) * 2003-03-27 2004-09-30 Lewis David H. MEMS volumetric Li/ion battery for space, air and terrestrial applications
JP2004319927A (ja) * 2003-04-21 2004-11-11 Shinko Electric Ind Co Ltd パターニング装置及び膜のパターニング方法
US7537799B2 (en) * 2003-07-11 2009-05-26 Hewlett-Packard Development Company, L.P. Methods of forming electrically conductive pathways using palladium aliphatic amine complexes
EP1652246B1 (en) * 2003-07-31 2016-10-12 Nissan Motor Company Limited Secondary cell electrode and fabrication method, and secondary cell, complex cell, and vehicle
JP4920169B2 (ja) * 2003-10-06 2012-04-18 日産自動車株式会社 電池およびこの電池を搭載する車両
JP4581384B2 (ja) * 2003-12-08 2010-11-17 日産自動車株式会社 電池およびその製造方法
JP4539173B2 (ja) * 2004-05-25 2010-09-08 日産自動車株式会社 インバータ装置、およびそれを用いた駆動システム
US7931941B1 (en) 2004-10-29 2011-04-26 Pchem Associates, Inc. Synthesis of metallic nanoparticle dispersions capable of sintering at low temperatures
CN101056716B (zh) * 2004-11-10 2010-05-05 大日本印刷株式会社 金属氧化物膜的制造方法
JP5098150B2 (ja) 2004-12-07 2012-12-12 日産自動車株式会社 バイポーラ電池およびその製造方法
US7533361B2 (en) 2005-01-14 2009-05-12 Cabot Corporation System and process for manufacturing custom electronics by combining traditional electronics with printable electronics
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
WO2006076613A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Metal nanoparticle compositions
WO2006076606A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
US20060176350A1 (en) * 2005-01-14 2006-08-10 Howarth James J Replacement of passive electrical components
US20060190917A1 (en) * 2005-01-14 2006-08-24 Cabot Corporation System and process for manufacturing application specific printable circuits (ASPC'S) and other custom electronic devices
US7687327B2 (en) * 2005-07-08 2010-03-30 Kovio, Inc, Methods for manufacturing RFID tags and structures formed therefrom
KR100760219B1 (ko) * 2005-08-01 2007-10-05 연세대학교 산학협력단 로보 디스펜싱에 의한 전기화학적 셀의 제조방법, 그요소소재 페이스트, 및 이에 의해 제조된 고체산화물연료전지
WO2007038950A1 (en) * 2005-09-28 2007-04-12 Stichting Dutch Polymer Institute Method for generation of metal surface structures and apparatus therefor
US20070144305A1 (en) * 2005-12-20 2007-06-28 Jablonski Gregory A Synthesis of Metallic Nanoparticle Dispersions
JP2006229254A (ja) * 2006-05-29 2006-08-31 Morimura Chemicals Ltd 透光体の製造方法
JP2006270118A (ja) * 2006-05-29 2006-10-05 Morimura Chemicals Ltd 回路基板の製造方法
TWI347373B (en) * 2006-07-07 2011-08-21 Rohm & Haas Elect Mat Formaldehyde free electroless copper compositions
EP1876262A1 (en) * 2006-07-07 2008-01-09 Rohm and Haas Electronic Materials, L.L.C. Environmentally friendly electroless copper compositions
EP1876260B1 (en) * 2006-07-07 2018-11-28 Rohm and Haas Electronic Materials LLC Improved electroless copper compositions
TWI348499B (en) * 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples
US8231811B2 (en) * 2006-07-22 2012-07-31 Conductive Inkjet Technology Limited Formation of conductive metal regions on substrates
US7981508B1 (en) 2006-09-12 2011-07-19 Sri International Flexible circuits
US8110254B1 (en) 2006-09-12 2012-02-07 Sri International Flexible circuit chemistry
US8293121B2 (en) * 2006-09-27 2012-10-23 Samsung Electro-Mechanics Co., Ltd. Method for forming fine wiring
US20080136861A1 (en) * 2006-12-11 2008-06-12 3M Innovative Properties Company Method and apparatus for printing conductive inks
EP2131979A4 (en) 2007-03-01 2013-03-06 Pchem Associates Inc SHIELDING FROM METAL NANOPARTICLE COMPOSITIONS AND DEVICES AND METHODS THEREFOR
US7641728B2 (en) * 2007-04-23 2010-01-05 Hewlett-Packard Development Company, L.P. Ink composition and method for forming the same
US8530589B2 (en) * 2007-05-04 2013-09-10 Kovio, Inc. Print processing for patterned conductor, semiconductor and dielectric materials
KR100850757B1 (ko) * 2007-06-14 2008-08-06 삼성전기주식회사 기판의 표면처리방법 및 미세배선 형성방법
US8628818B1 (en) 2007-06-21 2014-01-14 Sri International Conductive pattern formation
US7989029B1 (en) 2007-06-21 2011-08-02 Sri International Reduced porosity copper deposition
WO2009046148A1 (en) * 2007-10-01 2009-04-09 Kovio, Inc. Profile engineered thin film devices and structures
FI20085018A0 (fi) * 2008-01-10 2008-01-10 Valtion Teknillinen Painettavan elektroniikan superkondensaattori
KR20090077705A (ko) * 2008-01-11 2009-07-15 주식회사 엘지화학 도전성 패턴 및 이의 형성방법
US20100015462A1 (en) * 2008-02-29 2010-01-21 Gregory Jablonski Metallic nanoparticle shielding structure and methods thereof
US20090252933A1 (en) * 2008-04-04 2009-10-08 3M Innovative Properties Company Method for digitally printing electroluminescent lamps
US7927976B2 (en) * 2008-07-23 2011-04-19 Semprius, Inc. Reinforced composite stamp for dry transfer printing of semiconductor elements
WO2010011974A1 (en) * 2008-07-24 2010-01-28 Kovio, Inc. Aluminum inks and methods of making the same, methods for depositing aluminum inks, and films formed by printing and/or depositing an aluminum ink
KR101736722B1 (ko) * 2008-11-19 2017-05-17 셈프리어스 아이엔씨. 전단-보조 탄성 스탬프 전사에 의한 프린팅 반도체 소자
US8895874B1 (en) 2009-03-10 2014-11-25 Averatek Corp. Indium-less transparent metalized layers
WO2010111311A2 (en) * 2009-03-23 2010-09-30 Sba Materials, Inc. New dielectric oxide films and method for making same
KR20120003458A (ko) * 2009-04-24 2012-01-10 스미토모 덴키 고교 가부시키가이샤 프린트 배선판용 기판, 프린트 배선판, 및 그들의 제조방법
US8378702B2 (en) 2009-05-08 2013-02-19 Corning Incorporated Non-contact testing of printed electronics
US8261660B2 (en) * 2009-07-22 2012-09-11 Semprius, Inc. Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
KR101795088B1 (ko) * 2009-11-09 2017-11-07 카네기 멜론 유니버시티 금속 잉크 조성물, 전도성 패턴, 방법, 및 장치
JP2011159488A (ja) 2010-02-01 2011-08-18 Sony Corp 非水電解質組成物および非水電解質二次電池
JP5492686B2 (ja) * 2010-07-07 2014-05-14 大日本スクリーン製造株式会社 電池用電極の製造方法、電池の製造方法、電池、車両および電子機器
WO2012079747A1 (en) * 2010-12-16 2012-06-21 Stichting Dutch Polymer Institute Method for preparing microstructured patterns of superconductive materials
US9065093B2 (en) 2011-04-07 2015-06-23 Massachusetts Institute Of Technology Controlled porosity in electrodes
KR102428025B1 (ko) * 2012-08-16 2022-08-03 에노빅스 코오퍼레이션 3차원 배터리들을 위한 전극 구조들
JP2014107484A (ja) * 2012-11-29 2014-06-09 Jsr Corp 接続方法および導電性インク
US9763370B2 (en) * 2013-03-15 2017-09-12 National Technology & Engineering Solutions Of Sandia, Llc Apparatus for assembly of microelectronic devices
WO2014151202A1 (en) 2013-03-15 2014-09-25 Enovix Corporation Separators for three-dimensional batteries
KR102444716B1 (ko) * 2013-05-17 2022-09-16 밀텍 코포레이션 화학선 및 전자 빔 조사 경화성 수성 전극 결합제 및 그를 포함하는 전극
US9506149B2 (en) * 2014-01-16 2016-11-29 The United States Of America, As Represented By The Secretary Of Commerce Liquid deposition composition and process for forming metal therefrom
WO2015141769A1 (ja) 2014-03-20 2015-09-24 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
WO2015147219A1 (ja) 2014-03-27 2015-10-01 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
US9954262B2 (en) * 2014-08-29 2018-04-24 Honda Motor Co., Ltd. Air secondary battery including cathode having trap portion
US10569480B2 (en) 2014-10-03 2020-02-25 Massachusetts Institute Of Technology Pore orientation using magnetic fields
US10675819B2 (en) 2014-10-03 2020-06-09 Massachusetts Institute Of Technology Magnetic field alignment of emulsions to produce porous articles
WO2016117575A1 (ja) 2015-01-22 2016-07-28 住友電気工業株式会社 プリント配線板用基材、プリント配線板及びプリント配線板の製造方法
KR101985129B1 (ko) * 2015-03-18 2019-05-31 히타치가세이가부시끼가이샤 결합제 수지 조성물, 리튬 이온 이차 전지용 전극 및 리튬 이온 이차 전지
KR102658953B1 (ko) 2015-05-14 2024-04-18 에노빅스 코오퍼레이션 에너지 저장 디바이스들에 대한 종방향 구속부들
RU2617705C2 (ru) * 2015-08-20 2017-04-26 Федеральное государственное бюджетное образовательное учреждение высшего образования "Омский государственный технический университет" Способ получения металлизированного изображения
TWI554172B (zh) * 2015-09-17 2016-10-11 欣興電子股份有限公司 線路板的製作方法
WO2017197233A1 (en) 2016-05-13 2017-11-16 Enovix Corporation Dimensional constraints for three-dimensional batteries
JP7086978B2 (ja) 2016-11-16 2022-06-20 エノビクス・コーポレイション 圧縮性カソードを備えた３次元電池
US10256507B1 (en) 2017-11-15 2019-04-09 Enovix Corporation Constrained electrode assembly
WO2019099650A1 (en) 2017-11-15 2019-05-23 Enovix Corporation Electrode assembly and secondary battery
US11211639B2 (en) 2018-08-06 2021-12-28 Enovix Corporation Electrode assembly manufacture and device
WO2021155370A1 (en) * 2020-01-30 2021-08-05 Liquid X Printed Metals, Inc. Force sensor controlled conductive heating elements
JP2023547993A (ja) 2020-09-18 2023-11-15 エノビクス・コーポレイション 電池に使用する電極の製造のための装置、システム、及び方法
CN116783744A (zh) 2020-12-09 2023-09-19 艾诺维克斯公司 用于制造二次电池的电极组合件的方法及装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3573101A (en) * 1970-01-07 1971-03-30 Bell Telephone Labor Inc Method for producing a cadmium electrode for nickel cadmium cells
US3956528A (en) * 1974-11-15 1976-05-11 Minnesota Mining And Manufacturing Company Selective plating by galvanic action
US4079156A (en) * 1975-03-07 1978-03-14 Uop Inc. Conductive metal pigments
SU921124A1 (ru) * 1979-06-19 1982-04-15 Институт Физико-Химических Основ Переработки Минерального Сырья Со Ан Ссср Способ металлизации отверстий печатных плат
FR2516739A1 (fr) * 1981-11-17 1983-05-20 Rhone Poulenc Spec Chim Procede de fabrication de circuits electroniques de type hybride a couches epaisses, des moyens destines a la mise en oeuvre de ce procede et les circuits obtenus selon ce procede
US4670122A (en) * 1986-05-05 1987-06-02 The Dow Chemical Company Low over-voltage electrodes for alkaline electrolytes
US4775556A (en) * 1986-08-05 1988-10-04 Minnesota Mining And Manufacturing Company Process for metallized imaging
US4863484A (en) * 1988-01-04 1989-09-05 Globe-Union Inc. Process for producing battery electrodes by electrochemical reduction
US5116582A (en) * 1990-04-26 1992-05-26 Photo-Catalytics, Inc. Photocatalytic slurry reactor having turbulence generating means
DE4022136A1 (de) 1990-07-11 1992-01-23 Battelle Institut E V Co(pfeil abwaerts)2(pfeil abwaerts)-sensor
US5344728A (en) * 1992-11-12 1994-09-06 Ovonic Battery Company, Inc. Compositionally and structurally disordered multiphase nickel hydroxide positive electrode for alkaline rechargeable electrochemical cells
DE19514156A1 (de) 1995-04-15 1996-10-24 Heidelberger Druckmasch Ag Photochemische Zelle
WO1997027635A1 (en) * 1996-01-25 1997-07-31 Danionics A/S Electrode/current collector, laminates for an electrochemical device
US5948464A (en) * 1996-06-19 1999-09-07 Imra America, Inc. Process of manufacturing porous separator for electrochemical power supply
AU4669897A (en) 1996-10-01 1998-04-24 National Label Company Apparatus and method for assembling electrochromic cells
DE69735159T2 (de) 1997-01-22 2006-10-26 Greatcell Solar S.A. Sonnenzelle und Verfahren für seine Herstellung
US5846615A (en) * 1997-02-28 1998-12-08 The Whitaker Corporation Direct deposition of a gold layer
US5756146A (en) * 1997-03-12 1998-05-26 International Business Machines Corporation Inspecting copper or molybdenum lines on a substrate
US5980813A (en) * 1997-04-17 1999-11-09 Sri International Rapid prototyping using multiple materials
US5980998A (en) * 1997-09-16 1999-11-09 Sri International Deposition of substances on a surface
US6548122B1 (en) * 1997-09-16 2003-04-15 Sri International Method of producing and depositing a metal film
US6146716A (en) * 1998-06-26 2000-11-14 Sri International Conservatively printed displays and methods relating to same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100511774C (zh) * 2003-06-18 2009-07-08 日产自动车株式会社 制造二次电池电极的方法、用于制造二次电池电极的设备和二次电池电极
CN102398438A (zh) * 2010-09-15 2012-04-04 中国科学院化学研究所 激光或微波处理喷印金属导电油墨制备的初级电路的方法

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