CN1313266C - 透明热合薄膜 - Google Patents
透明热合薄膜 Download PDFInfo
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Abstract
一种热合薄膜,它的雾度不大于30%,并且它含有由树脂组合物制成的密封层,该树脂组合物包括总量为50-100重量%的下列成分(a)-(c):(a)5-50重量%的嵌段共聚物,它由50-95重量%苯乙烯型烃和5-50重量%共轭二烯烃型烃形成,(b)5-50重量%的乙烯/α-烯烃无规共聚物,和(c)5-70重量%的嵌段共聚物,它由10-50重量%的苯乙烯型烃和50-90重量%的共轭二烯烃型烃形成,以及(d)0-50重量%的耐冲击性聚苯乙烯。
Description
技术领域
本发明涉及用于包装容器的热合薄膜,特别涉及含有由热合性树脂组合物制成的密封层的透明热合薄膜,并涉及它的制造方法。这种热合薄膜也称为覆盖膜,并用作塑料容器特别是容纳电子元件的承载容器的覆盖材料。
背景技术
由例如塑料或纸制成的用于封住容器的热合薄膜也用作覆盖膜,该覆盖膜是封装电子元件的覆盖材料,其代表是例如载带。
这种热合薄膜可以具有双层结构,该结构包括保持撕裂强度和断裂强度并具有用于热合的耐热性的拉伸膜以及通过加热提供熔融粘合性的热合层。但是广泛使用的是具有三层结构或更多层结构的膜,它含有放置在拉伸膜和热合层之间的夹层,能提高机械强度等。这种具有三层或更多层结构的覆盖膜是利用热合层的热合性或置于热合层和拉伸膜之间的夹层,通过挤出层压法制成的。但是使用这种方法,挤出层压的步骤数会随着层数的增加而增加,从而产生了这样的问题:生产能力变劣,或原织物损失增加。从而导致成本增加。从产品质量这方面来看,含有杂质的可能性随着步骤数的增多而增加。
热合薄膜需要具有下列性质作为基本性质:
(1)容易达到实用剥离强度的热合性,
(2)易开启性,这样在开启时,内部元件能容易地取出,而不会散开。近年来,还需要关于(3)透明性的改进。如果透明性好,封装的元件能被容易地确认,从而便于检验操作,还增加了可靠性,并有再保险性。
例如JP-B-57-53828或JP-B-57-42652披露了具有优良热合性并容易开启的热合薄膜。但是,它无需完全满足透明性的要求。因此,需要具有更佳透明性的热合薄膜。
发明内容
本发明的目的是提供一种具有优良透明性并且不丧失热合薄膜基本性质的热合薄膜。
另外,本发明涉及便宜并且质量恒定的热合薄膜的制造方法,该方法是通过简化多层膜制造中的步骤实现的。
本发明提供了一种热合薄膜,它的雾度不大于30%,并且它具有由树脂组合物制成的密封层,该树脂组合物包括总量为50-100重量%的下列成分(a)-(c):
(a)5-50重量%的嵌段共聚物,它由50-95重量%苯乙烯型烃和5-50重量%共轭二烯烃型烃形成,
(b)5-50重量%的乙烯/α-烯烃无规共聚物,和
(c)5-70重量%的嵌段共聚物,它由10-50重量%的苯乙烯型烃和50-90重量%的共轭二烯烃型烃形成,以及
(d)0-50重量%的耐冲击性聚苯乙烯。
用于本发明的苯乙烯型烃可以是,例如苯乙烯、α-甲基苯乙烯和各种烷基取代的苯乙烯。其中,优选使用苯乙烯。共轭二烯烃型烃可以是,例如异戊二烯、丁二烯或含有氢加成到这种不饱和键部位的烃。在这种由50-95重量%苯乙烯型烃和5-50重量%共轭二烯烃型烃形成的嵌段共聚物之中,成分(a)和(c)可以是同一种类型,但也可以是结合使用的两种或多种类型。乙烯/α-烯烃无规共聚物中的α-烯烃可以是,例如丙烯、丁烯、戊烯或己烯。
耐冲击性聚苯乙烯包括苯乙烯型烃聚合物和共轭二烯烃型烃聚合物,这样由共轭二烯烃型烃聚合物制成的软性成分颗粒就能分散在构成基质的苯乙烯型烃聚合物中。
苯乙烯型烃和共轭二烯烃型烃的嵌段共聚物、乙烯/α-烯烃无规共聚物和耐冲击性聚苯乙烯可以分别都是市售品。
包括成分(a)-(d)的树脂组合物的混合比率是:成分(a)为5-50重量%,成分(b)是5-50重量%,(c)是5-70重量%,条件是成分(a)-(c)的总量为50-100重量%,成分(d)为0-50重量%
如果成分(a)小于5重量%,膜的形成变得困难,如果大于50重量%,剥离强度的温度依赖性变得严重,并且易开启性趋于变弱。
如果成分(b)小于5重量%,会得不到足够的剥离强度,如果大于50重量%,膜形成时对辊的粘着会趋于增加,从而使膜的形成变得困难。
如果成分(c)小于5重量%,会难以达到要得到易开启性所需的密封条件,如果大于70重量%,膜的形成会变得困难。
如果成分(d)大于50重量%,会几乎不能达到透明性。
雾度是不透明的成雾状态的程度指数,它是用积分球型透光率测量装置测得漫射透光率和总透光率,由漫射透光率/总透光率的百分数来表示的。如果透明性优良,漫射透光率就小,并且雾度值越小,透光率就越好。本发明热合薄膜的雾度不大于30%,并具有优良的透明性,从而使封装的元件能被容易地确认。
密封层的厚度优选小于30微米,更优选是4-25微米。密封层厚度至少为30微米的热合薄膜,透明性会趋低,并且透明的可见形像趋于模糊。
本发明的热合薄膜最优选以这种结构使用:由双轴拉伸的聚对苯二甲酸乙二醇酯层组成最外层,聚乙烯树脂层组成与最外层接触的第二层,聚烯烃型树脂层组成与第二层接触的第三层,上述密封层组成与第三层接触的第四层。
关于用于制成双轴取向聚对苯二甲酸乙二醇酯层的双轴取向的聚对苯二甲酸乙二醇酯,不仅可使用常用的那种聚对苯二甲酸乙二醇酯,而且还可使用涂布或捏合了抗静电剂进行抗静电处理或电晕处理等的那种聚对苯二甲酸乙二醇酯。
关于聚乙烯树脂层,可用例如低密度聚乙烯、线型低密度聚乙烯或超低密度聚乙烯,并且这些聚乙烯可以单独使用,也可作为由其中两种或多种的混合物结合使用。另外,可以掺混使用乙烯-1-丁烯、乙烯基含有羧基的乙烯共聚物如乙烯/丙烯酸酯共聚物或乙烯/乙酸乙烯酯共聚物、或它们和酸酐形成的三元共聚物。
为使最外层和第二层之间具有足够的粘合强度,可用各种常用粘固涂布剂(anchor coating agent)和表面处理技术。关于粘因涂布剂,可使用一种双组分可固化异氰酸酯型粘固涂布剂,它特别用于增强双轴取向聚对苯二甲酸乙二醇酯和聚乙烯树脂之间的粘合力。另外,为了增强粘固涂布剂与双轴取向聚对苯二甲酸乙二醇酯膜之间的粘合力,可对双轴取向聚对苯二甲酸乙二醇酯膜一侧进行电晕处理,并对聚乙烯树脂侧进行臭氧处理。
要用于聚烯烃型树脂层的聚烯烃树脂可以是,例如乙烯/1-丁烯共聚物、乙烯/乙酸乙烯酯共聚物、乙烯/丙烯酸酯共聚物、乙烯/马来酸共聚物、苯乙烯/乙烯接枝共聚物、乙烯/丙烯接枝共聚物、苯乙烯/乙烯/丁二烯嵌段共聚物、丙烯聚合物、乙烯聚合物、或它们的掺混产物。
本发明制得的热合薄膜可以有至少一侧经抗静电处理。抗静电处理的实施方法是:通过喷涂或使用装有例如凹槽辊的辊涂机,涂布表面活性剂型抗静电剂、聚合物型抗静电剂或作为抗静电剂的导电剂。
包含最外层双轴取向聚对苯二甲酸乙二醇酯层、第二层聚乙烯树脂层、第三层聚烯烃型树脂层和第四层密封层的热合薄膜的制造方法包括下列步骤:在最外层的双轴取向聚对苯二甲酸乙二醇酯膜上涂布AC试剂的步骤、挤出-涂布第二层聚乙烯树脂的步骤、和对第三层聚烯烃型树脂层和第四层密封层进行共挤出-涂布的步骤。
另外,热合薄膜的制造过程也可包括下列步骤:在最外层的双轴取向聚对苯二甲酸乙二醇酯膜上涂布AC试剂的步骤、和对包含第三层聚烯烃型树脂层和第四层密封层的共挤出膜经第二层聚乙烯树脂进行挤出-层压的步骤。
密封层所用的树脂和树脂组合物可以是,例如高密度聚乙烯、低密度聚乙烯、线型低密度聚乙烯、聚丙烯、聚1-丁烯、聚4-甲基1-戊烯、乙烯/丙烯共聚物、乙烯-1-丁烯共聚物、乙烯/乙酸乙烯酯共聚物、乙烯/丙烯酸酯共聚物、苯乙烯/丁二烯共聚物及其氢化产物、热塑性聚氨酯、和它们的掺混产物。优选是包含50-100重量%的包括下列成分的混合物的组合物:
(a)5-50重量%的嵌段共聚物,它由50-95重量%苯乙烯型烃和5-50重量%共轭二烯烃型烃形成,
(b)5-50重量%的乙烯/α-烯烃无规共聚物,和
(c)5-70重量%的嵌段共聚物,它由10-50重量%苯乙烯型烃和50-90重量%共轭二烯烃型烃形成,以及
(d)0-50重量%的耐冲击性聚苯乙烯。
关于本发明用来制造的机器,可使用普通层压机,优选使用串联层压机。对于将AC试剂涂布到双轴取向聚对苯二甲酸乙二醇酯膜上的涂布机,可用常用涂布机,例如辊涂机、凹槽涂布机、逆向辊涂机、绕线棒刮涂机或口模式涂布机。
T-模头可以用作挤出聚乙烯树脂的层压机模头。另外,它可装有调节膜宽的部件(dicker)。
用于共挤出聚烯烃型树脂层和密封层的层压机模头可以是,例如常用于共挤出的装有供料头的T-模头、多料道模头或双缝口模头。
第三层聚烯烃型树脂层和第四层密封层可通过共挤出法形成双层膜。特别是通过用T-模头法制出双层膜的方法,从模头排出的熔融树脂会被镜面辊夹持,从而增加透明性。如果要制成只有厚度小于30微米的本发明密封层的单层膜,往往难以达到良好的薄厚度精确度,或经常难以得到足够的剥离强度,从而使透明度变得不规则。然而,通过与烯烃型树脂共挤出,就能达到具有固定厚度的密封层。所制成的双层膜可以与双轴取向聚对苯二甲酸乙二醇酯一起经熔融的第二层聚乙烯树脂层压,制得热合薄膜。
在本发明中,除了上述步骤以外,如果情况需要,还可加入抗静电处理的步骤。关于抗静电剂,可通过喷涂或使用装有例如凹槽辊的辊涂机,来涂布表面活性剂型抗静电剂、聚合物型抗静电剂或作为抗静电剂的导电剂。另外,为了均匀地涂布这种抗静电剂,优选对膜表面进行电晕处理或臭氧处理,特别优选在抗静电处理之前进行电晕放电处理。
本发明的热合薄膜可用于封装的电子元件的载带用的覆盖带(cover tape)或电子元件的载包,其功能是在储存、运输、或装配、以及排列和取出电子元件,将其装进到电子线路板上时,防止电子元件受污染。
具体实施方式
下面将参照实施例和比较例,进一步详述本发明。
实施例1-6
对于热合性树脂混合物(密封层),是将(a)苯乙烯/丁二烯嵌段共聚物树脂(电气化学工业株式会社制造的“Denka Clearene”,苯乙烯含量:80重量%,丁二烯含量:20重量%),(b)乙烯/1-丁烯无规共聚物(三井化学有限公司制造的“Toughmer A”),(c)苯乙烯/丁二烯嵌段共聚物(日本合成橡胶有限公司制造的“STR树脂”,苯乙烯含量:40重量%,丁二烯含量:60重量%)和(d)耐冲击性聚苯乙烯树脂(电气化学工业株式会社制造的“Denka Styrol HI-E6”)进行人工掺混,使其组成如表1所示,并用40毫米单螺杆挤出机于200℃进行配混,制得树脂组合物。
用T-模头法对该树脂组合物和作为聚烯烃型树脂的低密度聚乙烯进行共挤出,制得密封层厚度如表2所示的双层膜(总厚度:30微米)。用挤出-层压法将该双层膜和双轴取向聚对苯二甲酸乙二醇酯膜(厚度:12微米)一起经聚乙烯树脂(厚度15微米)层压,制得热合薄膜。
比较例1-5
用和上述相同的方法,将成分(a)-(d)掺混,使其组成如表1所示,得到热合性树脂混合物。然后,将该混合物与低密度聚乙烯一起共挤出,制得厚度如表2所示的膜,用干层压法将该膜与双轴取向聚对苯二甲酸乙二醇酯膜一起层压,制出透明层压热合薄膜(总厚度:除比较例5的总厚度为40微米以外,其它都为30微米)。
下面对由此制出的膜进行评价。
透明度的评价(雾度的测量)
根据JIS K7105(1998),用测量法A中规定的积分球型测量装置来测量雾度。单位是%。结果示于表2。
热合性和易开启性的评价
在热合头宽度为0.5毫米×2、热合压力为0.4兆帕和热合速度为2次/秒的条件下,于150℃将热合薄膜封合在用于电子封装材料的聚苯乙烯型载带上。用符号○表示平均剥离强度在0.2-0.6牛范围间的热合薄膜,用符号×表示平均剥离强度在该范围之外的热合薄膜。结果示于表2中“热合性”一列中。另外,用符号○表示最多0.4牛的剥离强度的最大值与最小值之差的热合薄膜,用符号×表示差值在该范围之外的热合薄膜。结果示于表2“易开启性”一列中。
表1
组合物号 | (a) | (b) | (c) | (a)+(b)+(c) | 树脂组成 | |
(a)+(b)+(c) | (d) | |||||
12345 | 455284555 | 254574525 | 3050651020 | 100100100100100 | 90557010090 | 104530010 |
6 | 20 | 60 | 20 | 100 | 90 | 10 |
7 | 15 | 10 | 75 | 100 | 90 | 10 |
8 | 45 | 25 | 30 | 100 | 40 | 60 |
表2
组合物号 | 密封层厚度(微米) | 热合性 | 易开启性 | 雾度(%) | |
实施例1实施例2实施例3实施例4实施例5实施例6 | 123411 | 10101010254 | ○○○○○○ | ○○○○○○ | 13252814228 |
比较例1比较例2比较例3比较例4比较例5 | 56781 | 1010101035 | ○--○○ | ×--○○ | 14--4532 |
注意:符号-表示由于厚度波动过大而不能测量。
这些实施例中的热合薄膜是具有优良透明性并且不丧失基本特性的热合薄膜,所以它们的热合性优良,容易达到实用的剥离强度,并具有易开启性,从而使元件能被容易地取出,而不会在开启时散开。
实施例7
用于密封层的聚苯乙烯型树脂的制备
将(a)苯乙烯/丁二烯嵌段共聚物树脂(电气化学工业株式会社制造,商品名Denka Clearene,苯乙烯含量:80重量%,丁二烯含量:20重量%),(b)乙烯/1-丁烯无规共聚物(三井化学有限公司制造,商品名为“Toughmer A”),(c)苯乙烯/丁二烯嵌段共聚物树脂(日本合成橡胶有限公司制造,商品名“STR树脂”,苯乙烯含量:40重量%,丁二烯含量80重量%)和(d)耐冲击性聚苯乙烯树脂(电气化学工业株式会社制造,商品名“Denka Styrol HI-E6”)分别以40、25、25和10重量%的比例掺混,用40毫米单螺杆挤出机于200℃进行熔融捏合,制出用于制造所需密封层的树脂粒料。
用串联层压机制出双轴取向聚对苯二甲酸乙二醇酯膜(Toyo Boseki株式会社制造,商品名Toyobo酯膜,厚度:16微米),用AC涂布机涂布异氰酸酯型双组分可固化AC试剂(Takeda化学工业有限公司制造,商品名“Takelac A971、Takenate A3”),经干燥制得经涂布的膜,用低密度聚乙烯树脂(日本聚合化学株式会社制造,商品名“Novatec LD”)涂布该膜,用装有T-模头的65毫米挤出层压机于320℃挤出该膜,厚度为13微米。另外,用装有多流道模头的65毫米挤出层压机,将该膜上的低密度聚乙烯(Ube Kosan株式会社制造的商品“UBE聚乙烯”)和用上述方法制备用于密封层的聚苯乙烯型树脂于230℃进行共挤出-涂布,使聚乙烯和聚苯乙烯型树脂的厚度将分别为30微米和10微米,制得四层热合薄膜。
实施例8
用串联层压机制出双轴取向聚对苯二甲酸乙二醇酯膜(Toyo Boseki株式会社制造,商品名“Toyobo酯膜”,厚度:16微米),用AC涂布机涂布异氰酸酯型双组分可固化AC试剂(Takeda化学工业有限公司制造,商品名“TakelacA971、Takenate A3”),经干燥制得经涂布的膜,然后用低密度聚乙烯树脂(日本聚合化学株式会社制造的商品“Novatec LD”)涂布该膜,用装有T-模头的65毫米挤出层压机于320℃挤出该膜,厚度为13微米。另外,用装有多流道模头的65毫米挤出层压机,将该膜上的低密度聚乙烯(Ube Kosan株式会社制造,商品名“UBE聚乙烯”)和用上述方法制备用于密封层的聚苯乙烯型树脂于230℃进行共挤出-涂布,使聚乙烯和聚苯乙烯型树脂的厚度将分别为30微米和10微米,制得四层热合薄膜。然后,用电晕处理机对膜表面进行电晕处理。接着,将表面活性剂型抗静电剂(日本Junyaku株式会社制造,商品名“SAT-4”)喷涂,制出所需的膜。
实施例9
用串联层压机制出双轴取向聚对苯二甲酸乙二醇酯膜(Toyo Boseki株式会社制造,商品名“Toyobo酯膜”,厚度:16微米),用AC涂布机涂布异氰酸酯型双组分可固化AC试剂(Takeda化学工业有限公司制造,商品名“TakelacA971、Takenate A3”),经干燥制得经涂布的膜。用装有多流道模头的65毫米挤出层压机,对低密度聚乙烯(Ube Kosan株式会社制造,商品名“UBE聚乙烯”)和用上述方法制备用于密封层的聚苯乙烯型树脂于230℃进行共挤出,使聚乙烯和聚苯乙烯型树脂的厚度将分别为30微米和10微米,从而制得经共挤出的膜。然后,用装有T-模头的65毫米挤出层压机,将经涂布的膜和经共挤出的膜经低密度聚乙烯树脂(日本聚合化学株式会社制造,商品名“Novatec LD”进行挤出-层压,使聚乙烯树脂的厚度为13微米,从而制出四层热合薄膜。
实施例10
用串联层压机制出双轴取向聚对苯二甲酸乙二醇酯膜(Toyo Boseki株式会社制造,商品名“Toyobo酯膜”,厚度:16微米),用AC涂布机涂布异氰酸酯型双组分可固化AC试剂(Takeda化学工业有限公司制造,商品名“TakelacA971、Takenate A3”),经干燥制得经涂布的膜。用装有多流道模头的65毫米挤出层压机,对低密度聚乙烯(Ube Kosan株式会社制造,商品名“UBE聚乙烯”)和用上述方法制备用于密封层的聚苯乙烯型树脂于230℃进行共挤出,使聚乙烯和聚苯乙烯型树脂的厚度将分别为30微米和10微米,从而制得经共挤出的膜。然后,用装有T-模头的65毫米挤出层压机,将经涂布的膜和经共挤出的膜经低密度聚乙烯树脂(日本聚合化学株式会社制造,商品名“Novatec LD”进行挤出-层压,使聚乙烯树脂的厚度为13微米,从而制出所需的四层热合薄膜。随后,用电晕处理机对膜表面进行电晕处理,之后将表面活性剂型抗静电剂(日本Junyaku株式会社制造,商品名“SAT-4”)喷涂到表面上,制出所需的膜。
根据上述实施例的制造方法,多层膜的制造过程中的制造步骤可以简化,操作人员数可以减少,低织物损失也可降低,因此有助于降低成本,另外还可制出质量恒定的热合薄膜。
Claims (11)
1.热合薄膜,其特征在于它的雾度不大于30%,它包含:
(i)作为最外层的双轴取向聚对苯二甲酸乙二醇酯层、
(ii)作为第二层的聚乙烯树脂层、
(iii)作为第三层的聚烯烃型树脂层、和
(iv)作为第四层的厚度小于30微米的密封层;
所述的密封层由树脂组合物制成,该树脂组合物包括总量为50-100重量%的下列成分(a)-(c):
(a)5-50重量%的嵌段共聚物,它由50-95重量%苯乙烯型烃和5-50重量%共轭二烯烃型烃形成,
(b)5-50重量%的乙烯/α-烯烃无规共聚物,和
(c)5-70重量%的嵌段共聚物,它由10-50重量%的苯乙烯型烃和50-90重量%的共轭二烯烃型烃形成,以及
(d)0-50重量%的耐冲击性聚苯乙烯。
2.如权利要求1所述的热合薄膜,其特征在于至少对它的一侧进行过抗静电处理。
3.电子元件载带的覆盖带,其特征在于它由权利要求1或2所述的热合薄膜制成。
4.电子元件的载包,其特征在于它由权利要求1或2所述的热合薄膜制成。
5.权利要求1所述的热合薄膜的制造方法,其特征在于它包括下列步骤:在所述的最外层双轴取向聚对苯二甲酸乙二醇酯膜上涂布AC试剂的步骤、挤出-涂布所述的第二层聚乙烯树脂的步骤、和将所述的第三层聚烯烃型树脂层和所述的第四层密封层进行共挤出-涂布的步骤。
6.权利要求1所述的热合薄膜的制造方法,其特征在于它包括下列步骤:在所述的最外层双轴取向聚对苯二甲酸乙二醇酯膜上涂布AC试剂的步骤、对包含所述的第三层聚烯烃型树脂层和所述的第四层密封层的共挤出薄膜经第二层聚乙烯树脂进行挤出-层压的步骤。
7.权利要求2所述的热合薄膜的制造方法,其特征在于它包括下列步骤:在所述的最外层双轴取向聚对苯二甲酸乙二醇酯膜上涂布AC试剂的步骤、挤出-涂布所述的第二层聚乙烯树脂的步骤、对所述的第三层聚烯烃型树脂层和所述的第四层密封层进行共挤出-涂布的步骤、和对所述的双轴取向聚对苯二甲酸乙二醇酯层表面和密封层表面中至少一个表面进行抗静电处理的步骤。
8.权利要求2所述的热合薄膜的制造方法,其特征在于它包括下列步骤:在所述的最外层双轴取向聚对苯二甲酸乙二醇酯膜上涂布AC试剂的步骤、对所述的包含第三层聚烯烃型树脂层和第四层密封层的共挤出薄膜经第二层聚乙烯树脂进行挤出-层压的步骤、和对所述的双轴取向聚对苯二甲酸乙二醇酯层表面和密封层表面中至少一个表面进行抗静电处理的步骤。
9.如权利要求7或8所述的热合薄膜的制造方法,其特征在于在进行所述的抗静电处理之前,对至少一个要进行抗静电处理的表面进行电晕放电处理。
10.如权利要求5-9中任何一项所述的制造方法,其特征在于所述的所有步骤都在同一条生产线上进行。
11.权利要求1或2所述的热合薄膜作为容纳电子元件的承载容器的覆盖材料的用途。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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JP24441999 | 1999-08-31 | ||
JP244419/99 | 1999-08-31 | ||
JP35866499 | 1999-12-17 | ||
JP358664/99 | 1999-12-17 | ||
PCT/JP2000/005828 WO2001015897A1 (en) | 1999-08-31 | 2000-08-29 | Transparent heat-sealing film |
Publications (2)
Publication Number | Publication Date |
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CN1356939A CN1356939A (zh) | 2002-07-03 |
CN1313266C true CN1313266C (zh) | 2007-05-02 |
Family
ID=26536730
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Application Number | Title | Priority Date | Filing Date |
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CNB008086702A Expired - Fee Related CN1313266C (zh) | 1999-08-31 | 2000-08-29 | 透明热合薄膜 |
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Country | Link |
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US (2) | US6902795B1 (zh) |
EP (1) | EP1208006B1 (zh) |
JP (1) | JP3585038B2 (zh) |
KR (1) | KR100717094B1 (zh) |
CN (1) | CN1313266C (zh) |
AU (1) | AU6734000A (zh) |
DE (1) | DE60008389T2 (zh) |
MX (1) | MXPA02002121A (zh) |
MY (1) | MY125790A (zh) |
TW (1) | TWI239889B (zh) |
WO (1) | WO2001015897A1 (zh) |
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WO2001015897A1 (en) * | 1999-08-31 | 2001-03-08 | Denki Kagaku Kogyo Kabushiki Kaisha | Transparent heat-sealing film |
JP4001468B2 (ja) * | 2001-05-28 | 2007-10-31 | 電気化学工業株式会社 | キャリアテープ体 |
DE10124209A1 (de) | 2001-05-18 | 2002-11-21 | Wolff Walsrode Ag | Polyolefinfolie mit peelfähiger Deckschicht |
EP1496085A1 (en) * | 2003-07-07 | 2005-01-12 | Total Petrochemicals Research Feluy | Heat-sealable and peelable polyethylene films |
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JP4796760B2 (ja) * | 2004-09-14 | 2011-10-19 | 住友化学株式会社 | 軟質樹脂組成物 |
JP4615984B2 (ja) * | 2004-12-16 | 2011-01-19 | 電気化学工業株式会社 | カバーテープ |
JP4805612B2 (ja) * | 2005-06-17 | 2011-11-02 | 電気化学工業株式会社 | カバーフィルム |
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US20070026251A1 (en) * | 2005-07-26 | 2007-02-01 | Kraton Polymers U.S. Llc | Flexible packaging laminate films including a block copolymer layer |
EP1780003A1 (de) * | 2005-10-26 | 2007-05-02 | Alcan Technology & Management Ltd. | Schockabsorbierender Siegelfilm für ein Beutellaminat |
EP1780008A1 (de) * | 2005-10-26 | 2007-05-02 | Alcan Technology & Management Ltd. | Schockabsorbierender Siegelfim für ein Beutellaminat |
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KR20070094330A (ko) * | 2006-03-17 | 2007-09-20 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 충격강도 및 이형성이 우수한 캐리어 테이프 |
US7967509B2 (en) | 2007-06-15 | 2011-06-28 | S.C. Johnson & Son, Inc. | Pouch with a valve |
US7946766B2 (en) | 2007-06-15 | 2011-05-24 | S.C. Johnson & Son, Inc. | Offset closure mechanism for a reclosable pouch |
US7857515B2 (en) | 2007-06-15 | 2010-12-28 | S.C. Johnson Home Storage, Inc. | Airtight closure mechanism for a reclosable pouch |
US7887238B2 (en) | 2007-06-15 | 2011-02-15 | S.C. Johnson Home Storage, Inc. | Flow channels for a pouch |
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JP5291115B2 (ja) * | 2008-11-12 | 2013-09-18 | 電気化学工業株式会社 | カバーテープ |
WO2010104010A1 (ja) | 2009-03-13 | 2010-09-16 | 電気化学工業株式会社 | カバーフィルム |
CN102482016B (zh) * | 2009-06-16 | 2014-09-17 | 电气化学工业株式会社 | 压纹载带及其制备方法 |
CA2732944C (en) | 2010-02-26 | 2018-06-05 | Exopack-Technologies, Llc | Multi-layer low temperature shrink film |
SG189310A1 (en) | 2010-10-07 | 2013-05-31 | Denki Kagaku Kogyo Kk | Electronic component packaging sheet, and formed article thereof |
KR101866593B1 (ko) * | 2010-10-07 | 2018-06-11 | 덴카 주식회사 | 스티렌계 수지 조성물 및 그 성형체 |
MY190586A (en) * | 2010-12-17 | 2022-04-27 | 3M Innovative Properties Co | Heat-sealing film and cover tape for packaging electronic components |
JP2014529528A (ja) * | 2011-09-01 | 2014-11-13 | スリーエム イノベイティブプロパティズカンパニー | 電子的構成要素を梱包するためのヒートシーリング性カバーフィルム |
MY184617A (en) * | 2011-09-01 | 2021-04-08 | 3M Innovative Properties Co | A heat-sealing cover film for packaging electronic components |
DK2782754T3 (da) * | 2011-11-22 | 2019-07-08 | Danapak Flexibles As | Svejsbare oblater til PET. |
AR102954A1 (es) | 2014-12-19 | 2017-04-05 | Dow Global Technologies Llc | Una estructura de capa múltiple, un método para producir la misma, y un envasado que comprende la misma |
KR20190085508A (ko) | 2016-11-24 | 2019-07-18 | 앰코어 플렉서블스 트랜스팩 비브이비에이 | 박리가능한 시일 층 |
EP3630482A1 (en) * | 2017-05-24 | 2020-04-08 | Danapak Flexibles A/S | A method for making sheet laminates for being pre-punched to a sheet lid to be attached to a container |
WO2021007008A1 (en) * | 2019-07-09 | 2021-01-14 | Tredegar Surface Protection, Llc | Surface protection film |
CN114889266B (zh) * | 2022-04-27 | 2023-11-07 | 河南银金达彩印股份有限公司 | 一种petg流延膜 |
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JPS54120646A (en) * | 1978-03-14 | 1979-09-19 | Denki Kagaku Kogyo Kk | Heat-sealable film |
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JPS5920557B2 (ja) * | 1978-06-29 | 1984-05-14 | 電気化学工業株式会社 | 包装体 |
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MY107463A (en) * | 1991-02-28 | 1995-12-30 | Sumitomo Bakelite Co | Cover tape for packaging chip type electronic parts. |
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JP3945893B2 (ja) * | 1997-04-28 | 2007-07-18 | リケンテクノス株式会社 | 積層化粧シート |
WO2001015897A1 (en) * | 1999-08-31 | 2001-03-08 | Denki Kagaku Kogyo Kabushiki Kaisha | Transparent heat-sealing film |
-
2000
- 2000-08-29 WO PCT/JP2000/005828 patent/WO2001015897A1/en active IP Right Grant
- 2000-08-29 KR KR1020017015805A patent/KR100717094B1/ko active IP Right Grant
- 2000-08-29 EP EP20000955095 patent/EP1208006B1/en not_active Expired - Lifetime
- 2000-08-29 JP JP2001520289A patent/JP3585038B2/ja not_active Expired - Fee Related
- 2000-08-29 CN CNB008086702A patent/CN1313266C/zh not_active Expired - Fee Related
- 2000-08-29 DE DE2000608389 patent/DE60008389T2/de not_active Expired - Lifetime
- 2000-08-29 US US09/926,674 patent/US6902795B1/en not_active Expired - Lifetime
- 2000-08-29 MX MXPA02002121A patent/MXPA02002121A/es active IP Right Grant
- 2000-08-29 AU AU67340/00A patent/AU6734000A/en not_active Abandoned
- 2000-08-30 MY MYPI20003998A patent/MY125790A/en unknown
- 2000-08-30 TW TW89117654A patent/TWI239889B/zh not_active IP Right Cessation
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2005
- 2005-05-03 US US11/119,692 patent/US7341793B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS54120646A (en) * | 1978-03-14 | 1979-09-19 | Denki Kagaku Kogyo Kk | Heat-sealable film |
Also Published As
Publication number | Publication date |
---|---|
DE60008389D1 (de) | 2004-03-25 |
US6902795B1 (en) | 2005-06-07 |
US20050192404A1 (en) | 2005-09-01 |
EP1208006B1 (en) | 2004-02-18 |
MXPA02002121A (es) | 2002-10-17 |
WO2001015897A1 (en) | 2001-03-08 |
DE60008389T2 (de) | 2004-07-29 |
JP3585038B2 (ja) | 2004-11-04 |
TWI239889B (en) | 2005-09-21 |
KR100717094B1 (ko) | 2007-05-10 |
EP1208006A1 (en) | 2002-05-29 |
JP2003508253A (ja) | 2003-03-04 |
CN1356939A (zh) | 2002-07-03 |
KR20020025070A (ko) | 2002-04-03 |
US7341793B2 (en) | 2008-03-11 |
MY125790A (en) | 2006-08-30 |
AU6734000A (en) | 2001-03-26 |
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