CN1303521A - 制造微模块方法和制造含有微模块的存储媒体的方法 - Google Patents

制造微模块方法和制造含有微模块的存储媒体的方法 Download PDF

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Publication number
CN1303521A
CN1303521A CN99806708A CN99806708A CN1303521A CN 1303521 A CN1303521 A CN 1303521A CN 99806708 A CN99806708 A CN 99806708A CN 99806708 A CN99806708 A CN 99806708A CN 1303521 A CN1303521 A CN 1303521A
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China
Prior art keywords
chip
micromodule
cavity
printing
pattern
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Pending
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CN99806708A
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English (en)
Chinese (zh)
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J·C·菲达尔戈
O·布鲁尼特
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Gemplus SA
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Gemplus SA
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
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    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
CN99806708A 1998-05-27 1999-05-12 制造微模块方法和制造含有微模块的存储媒体的方法 Pending CN1303521A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9806683A FR2779272B1 (fr) 1998-05-27 1998-05-27 Procede de fabrication d'un micromodule et d'un support de memorisation comportant un tel micromodule
FR98/06683 1998-05-27

Publications (1)

Publication Number Publication Date
CN1303521A true CN1303521A (zh) 2001-07-11

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Application Number Title Priority Date Filing Date
CN99806708A Pending CN1303521A (zh) 1998-05-27 1999-05-12 制造微模块方法和制造含有微模块的存储媒体的方法

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Country Link
EP (1) EP1086492A1 (fr)
CN (1) CN1303521A (fr)
AU (1) AU3611699A (fr)
FR (1) FR2779272B1 (fr)
WO (1) WO1999062118A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2828333B1 (fr) * 2000-06-23 2003-11-07 Gemplus Card Int Procede d'isolation electrique de puces comportant des circuits integres par le depot d'une couche isolante
FR2817656B1 (fr) * 2000-12-05 2003-09-26 Gemplus Card Int Isolation electrique de microcircuits regroupes avant collage unitaire

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3466108D1 (en) * 1983-06-09 1987-10-15 Flonic Sa Method of producing memory cards, and cards obtained thereby
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
US5639990A (en) * 1992-06-05 1997-06-17 Mitsui Toatsu Chemicals, Inc. Solid printed substrate and electronic circuit package using the same
EP0688051B1 (fr) * 1994-06-15 1999-09-15 De La Rue Cartes Et Systemes Procédé de fabrication et d'assemblage de carte à circuit intégré.
FR2740935B1 (fr) * 1995-11-03 1997-12-05 Schlumberger Ind Sa Procede de fabrication d'un ensemble de modules electroniques pour cartes a memoire electronique
DE19618103C2 (de) * 1996-05-06 1998-05-14 Siemens Ag Chipkartenmodul mit Beschichtung aus leitfähigem Kunststoff und Verfahren zu dessen Herstellung
EP0824301A3 (fr) * 1996-08-09 1999-08-11 Hitachi, Ltd. Panneau à circuit imprimé, carte à puce, et leur procédé de fabrication

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WO1999062118A1 (fr) 1999-12-02
AU3611699A (en) 1999-12-13
FR2779272B1 (fr) 2001-10-12
EP1086492A1 (fr) 2001-03-28
FR2779272A1 (fr) 1999-12-03

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