CN1303521A - 制造微模块方法和制造含有微模块的存储媒体的方法 - Google Patents
制造微模块方法和制造含有微模块的存储媒体的方法 Download PDFInfo
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- CN1303521A CN1303521A CN99806708A CN99806708A CN1303521A CN 1303521 A CN1303521 A CN 1303521A CN 99806708 A CN99806708 A CN 99806708A CN 99806708 A CN99806708 A CN 99806708A CN 1303521 A CN1303521 A CN 1303521A
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- micromodule
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- H—ELECTRICITY
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- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9806683A FR2779272B1 (fr) | 1998-05-27 | 1998-05-27 | Procede de fabrication d'un micromodule et d'un support de memorisation comportant un tel micromodule |
FR98/06683 | 1998-05-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1303521A true CN1303521A (zh) | 2001-07-11 |
Family
ID=9526769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN99806708A Pending CN1303521A (zh) | 1998-05-27 | 1999-05-12 | 制造微模块方法和制造含有微模块的存储媒体的方法 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1086492A1 (fr) |
CN (1) | CN1303521A (fr) |
AU (1) | AU3611699A (fr) |
FR (1) | FR2779272B1 (fr) |
WO (1) | WO1999062118A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2828333B1 (fr) * | 2000-06-23 | 2003-11-07 | Gemplus Card Int | Procede d'isolation electrique de puces comportant des circuits integres par le depot d'une couche isolante |
FR2817656B1 (fr) * | 2000-12-05 | 2003-09-26 | Gemplus Card Int | Isolation electrique de microcircuits regroupes avant collage unitaire |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3466108D1 (en) * | 1983-06-09 | 1987-10-15 | Flonic Sa | Method of producing memory cards, and cards obtained thereby |
FR2580416B1 (fr) * | 1985-04-12 | 1987-06-05 | Radiotechnique Compelec | Procede et dispositif pour fabriquer une carte d'identification electronique |
FR2584235B1 (fr) * | 1985-06-26 | 1988-04-22 | Bull Sa | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques |
US5639990A (en) * | 1992-06-05 | 1997-06-17 | Mitsui Toatsu Chemicals, Inc. | Solid printed substrate and electronic circuit package using the same |
EP0688051B1 (fr) * | 1994-06-15 | 1999-09-15 | De La Rue Cartes Et Systemes | Procédé de fabrication et d'assemblage de carte à circuit intégré. |
FR2740935B1 (fr) * | 1995-11-03 | 1997-12-05 | Schlumberger Ind Sa | Procede de fabrication d'un ensemble de modules electroniques pour cartes a memoire electronique |
DE19618103C2 (de) * | 1996-05-06 | 1998-05-14 | Siemens Ag | Chipkartenmodul mit Beschichtung aus leitfähigem Kunststoff und Verfahren zu dessen Herstellung |
EP0824301A3 (fr) * | 1996-08-09 | 1999-08-11 | Hitachi, Ltd. | Panneau à circuit imprimé, carte à puce, et leur procédé de fabrication |
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1998
- 1998-05-27 FR FR9806683A patent/FR2779272B1/fr not_active Expired - Fee Related
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1999
- 1999-05-12 AU AU36116/99A patent/AU3611699A/en not_active Abandoned
- 1999-05-12 WO PCT/FR1999/001142 patent/WO1999062118A1/fr not_active Application Discontinuation
- 1999-05-12 EP EP99918061A patent/EP1086492A1/fr not_active Withdrawn
- 1999-05-12 CN CN99806708A patent/CN1303521A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
WO1999062118A1 (fr) | 1999-12-02 |
AU3611699A (en) | 1999-12-13 |
FR2779272B1 (fr) | 2001-10-12 |
EP1086492A1 (fr) | 2001-03-28 |
FR2779272A1 (fr) | 1999-12-03 |
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