CN1299873C - 借助激光光斑放大来激光加工工件的方法 - Google Patents
借助激光光斑放大来激光加工工件的方法 Download PDFInfo
- Publication number
- CN1299873C CN1299873C CNB038019914A CN03801991A CN1299873C CN 1299873 C CN1299873 C CN 1299873C CN B038019914 A CNB038019914 A CN B038019914A CN 03801991 A CN03801991 A CN 03801991A CN 1299873 C CN1299873 C CN 1299873C
- Authority
- CN
- China
- Prior art keywords
- laser
- acceleration
- quick
- speed
- navigation system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 38
- 238000003754 machining Methods 0.000 title claims description 8
- 230000001133 acceleration Effects 0.000 claims description 22
- 230000008569 process Effects 0.000 claims description 11
- 238000005553 drilling Methods 0.000 claims description 5
- ZBSCCQXBYNSKPV-UHFFFAOYSA-N oxolead;oxomagnesium;2,4,5-trioxa-1$l^{5},3$l^{5}-diniobabicyclo[1.1.1]pentane 1,3-dioxide Chemical compound [Mg]=O.[Pb]=O.[Pb]=O.[Pb]=O.O1[Nb]2(=O)O[Nb]1(=O)O2 ZBSCCQXBYNSKPV-UHFFFAOYSA-N 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 238000012797 qualification Methods 0.000 claims 2
- 239000000463 material Substances 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 11
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- 230000008859 change Effects 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 230000004044 response Effects 0.000 description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 238000005094 computer simulation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000003252 repetitive effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- 230000001052 transient effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 238000011112 process operation Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 241000931526 Acer campestre Species 0.000 description 1
- NOQGZXFMHARMLW-UHFFFAOYSA-N Daminozide Chemical group CN(C)NC(=O)CCC(O)=O NOQGZXFMHARMLW-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000006578 abscission Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- 238000007514 turning Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US34861302P | 2002-01-11 | 2002-01-11 | |
| US60/348,613 | 2002-01-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1612793A CN1612793A (zh) | 2005-05-04 |
| CN1299873C true CN1299873C (zh) | 2007-02-14 |
Family
ID=23368777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB038019914A Expired - Lifetime CN1299873C (zh) | 2002-01-11 | 2003-01-10 | 借助激光光斑放大来激光加工工件的方法 |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JP4340745B2 (de) |
| KR (1) | KR100982677B1 (de) |
| CN (1) | CN1299873C (de) |
| AU (1) | AU2003214818A1 (de) |
| CA (1) | CA2469520A1 (de) |
| DE (1) | DE10392185T5 (de) |
| GB (1) | GB2397545B (de) |
| TW (1) | TW564196B (de) |
| WO (1) | WO2003059568A1 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104981318A (zh) * | 2013-02-13 | 2015-10-14 | 住友化学株式会社 | 激光照射装置及光学构件贴合体的制造装置 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004059721A1 (de) * | 2004-12-11 | 2006-05-04 | Carl Baasel Lasertechnik Gmbh & Co. Kg | Bewässerungsschlauch und Verfahren zu seiner Herstellung |
| CN100462181C (zh) * | 2006-10-30 | 2009-02-18 | 西安交通大学 | 飞秒激光真三维微纳加工中心 |
| US7663269B2 (en) * | 2006-12-13 | 2010-02-16 | A-Tech Corporation | High bandwidth linear actuator for steering mirror applications |
| DE102007012815B4 (de) | 2007-03-16 | 2024-06-06 | Dmg Mori Ultrasonic Lasertec Gmbh | Verfahren und Vorrichtung zur Bildung eines Gesenks |
| US20090312859A1 (en) * | 2008-06-16 | 2009-12-17 | Electro Scientific Industries, Inc. | Modifying entry angles associated with circular tooling actions to improve throughput in part machining |
| TWI523720B (zh) | 2009-05-28 | 2016-03-01 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
| DE102009044316B4 (de) | 2009-10-22 | 2015-04-30 | Ewag Ag | Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens |
| US8338745B2 (en) * | 2009-12-07 | 2012-12-25 | Panasonic Corporation | Apparatus and methods for drilling holes with no taper or reverse taper |
| KR20220046706A (ko) * | 2010-10-22 | 2022-04-14 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법 |
| CN102069298A (zh) * | 2010-12-20 | 2011-05-25 | 珠海市铭语自动化设备有限公司 | 一种板材激光切割系统及其切割加工方法 |
| CN102566590B (zh) * | 2011-03-14 | 2014-03-26 | 北京国科世纪激光技术有限公司 | 光学元件智能调整系统及方法 |
| CN103100797B (zh) * | 2013-01-23 | 2015-09-09 | 刘茂珍 | 基于自适应光学的激光微细加工设备和方法 |
| GB2514084B (en) * | 2013-02-21 | 2016-07-27 | M-Solv Ltd | Method of forming an electrode structure for capacitive touch sensor |
| GB2511064A (en) | 2013-02-21 | 2014-08-27 | M Solv Ltd | Method of forming electrode structure for capacitive touch sensor |
| JP2016516584A (ja) * | 2013-03-15 | 2016-06-09 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | テーパ制御のためのビーム角度とワークピース移動の連係方法 |
| IT201600070259A1 (it) * | 2016-07-06 | 2018-01-06 | Adige Spa | Procedimento di lavorazione laser di un materiale metallico con controllo della posizione dell'asse ottico del laser rispetto ad un flusso di gas di assistenza, nonché macchina e programma per elaboratore per l'attuazione di un tale procedimento. |
| CN107876981B (zh) * | 2017-11-20 | 2019-08-20 | 张家港初恒激光科技有限公司 | 一种改进型的激光焊接加工工作站 |
| CN109579690A (zh) * | 2018-12-04 | 2019-04-05 | 天津津航技术物理研究所 | 一种用于快反镜稳像系统的高精度角位移检测装置 |
| CN112122776A (zh) * | 2020-09-23 | 2020-12-25 | 苏州科韵激光科技有限公司 | 基于高速旋转反射镜的非线性形状加工系统及方法 |
| KR102497645B1 (ko) * | 2021-06-23 | 2023-02-08 | 인하대학교 산학협력단 | 금형 표면 레이저 가공하는 방법 |
| CN113897608A (zh) * | 2021-10-23 | 2022-01-07 | 河南省锅炉压力容器安全检测研究院 | 一种用于阀门密封面的激光表面强化加工设备 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992012820A1 (en) * | 1991-01-17 | 1992-08-06 | United Distillers Plc | Dynamic laser marking |
| US5484982A (en) * | 1992-01-31 | 1996-01-16 | Fanuc Ltd. | Beam axis adjusting method for a laser robot |
| JPH0885866A (ja) * | 1994-09-16 | 1996-04-02 | Sumitomo Metal Mining Co Ltd | Ｉｔｏ焼結体の製造方法 |
| US5798927A (en) * | 1995-03-20 | 1998-08-25 | Electro Scientific Industries, Inc. | Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system |
| CN1213440A (zh) * | 1996-03-12 | 1999-04-07 | 电科学工业公司 | 多刀具定位系统 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54116356A (en) * | 1978-03-03 | 1979-09-10 | Hitachi Ltd | Welding method by laser |
| FR2577052B1 (fr) * | 1985-02-05 | 1988-09-09 | Bertin & Cie | Procede et dispositif de deplacement du point d'impact d'un faisceau laser sur une piece |
| JP3060813B2 (ja) * | 1993-12-28 | 2000-07-10 | トヨタ自動車株式会社 | レーザ加工装置 |
| US6407363B2 (en) * | 2000-03-30 | 2002-06-18 | Electro Scientific Industries, Inc. | Laser system and method for single press micromachining of multilayer workpieces |
-
2003
- 2003-01-10 CA CA002469520A patent/CA2469520A1/en not_active Abandoned
- 2003-01-10 JP JP2003559716A patent/JP4340745B2/ja not_active Expired - Lifetime
- 2003-01-10 KR KR1020047010540A patent/KR100982677B1/ko active IP Right Grant
- 2003-01-10 WO PCT/US2003/000686 patent/WO2003059568A1/en active Application Filing
- 2003-01-10 GB GB0412827A patent/GB2397545B/en not_active Expired - Fee Related
- 2003-01-10 DE DE10392185T patent/DE10392185T5/de not_active Ceased
- 2003-01-10 TW TW092100478A patent/TW564196B/zh not_active IP Right Cessation
- 2003-01-10 AU AU2003214818A patent/AU2003214818A1/en not_active Abandoned
- 2003-01-10 CN CNB038019914A patent/CN1299873C/zh not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992012820A1 (en) * | 1991-01-17 | 1992-08-06 | United Distillers Plc | Dynamic laser marking |
| US5484982A (en) * | 1992-01-31 | 1996-01-16 | Fanuc Ltd. | Beam axis adjusting method for a laser robot |
| JPH0885866A (ja) * | 1994-09-16 | 1996-04-02 | Sumitomo Metal Mining Co Ltd | Ｉｔｏ焼結体の製造方法 |
| US5798927A (en) * | 1995-03-20 | 1998-08-25 | Electro Scientific Industries, Inc. | Apparatus and method for coordinating the movements of stages in a multi-stage multi-rate positioner system |
| CN1213440A (zh) * | 1996-03-12 | 1999-04-07 | 电科学工业公司 | 多刀具定位系统 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104981318A (zh) * | 2013-02-13 | 2015-10-14 | 住友化学株式会社 | 激光照射装置及光学构件贴合体的制造装置 |
| TWI607815B (zh) * | 2013-02-13 | 2017-12-11 | 住友化學股份有限公司 | 雷射光照射裝置及光學組件貼合體之製造裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW564196B (en) | 2003-12-01 |
| KR20040073542A (ko) | 2004-08-19 |
| GB0412827D0 (en) | 2004-07-14 |
| AU2003214818A1 (en) | 2003-07-30 |
| WO2003059568A1 (en) | 2003-07-24 |
| DE10392185T5 (de) | 2004-12-02 |
| GB2397545A (en) | 2004-07-28 |
| TW200301718A (en) | 2003-07-16 |
| JP2005532908A (ja) | 2005-11-04 |
| KR100982677B1 (ko) | 2010-09-17 |
| CN1612793A (zh) | 2005-05-04 |
| GB2397545B (en) | 2005-05-11 |
| CA2469520A1 (en) | 2003-07-24 |
| JP4340745B2 (ja) | 2009-10-07 |
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