CN1297815A - 高可靠性的喷墨打印头 - Google Patents
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Abstract
本发明提供一种打印系统,它包含一个喷墨打印头(204),该打印头可靠近打印介质(106)工作。该打印头带有一个喷嘴层(401),其中形成多个喷嘴,用于响应激励信号,选择性地喷射液体。该打印头还包括;一个具有上表面(500)的支撑体(300),该上表面形成一个钻孔凹槽(502),该凹槽用于容纳液流喷射基板(304),一个密封剂(312),它至少部分封闭该液流喷射基板的一部分。该密封剂是模制成型的,与喷嘴层形成一个平面。形成的该平面具有如下优点:(1)减小轨道误差的影响;(2)可通过打印系统的清洁机构有效地清洁打印头;(3)消除了库存期间打印头墨水泄漏的问题。
Description
本发明是代表Marvin Wong等人于1999年10月29日申请的、题目为“带有预制基板的喷墨打印头”并且已转上给本发明的受让人的美国专利申请(序列号)09/430,534的部分接续申请,该申请的全部内容在此引入作为参考。
本发明涉及喷墨打印机,具体地说,涉及包含一个喷墨打印头的打印系统。热喷墨打印机从二十世纪八十年代早期产生以来,已经获得了巨大的商业成功。这种打印系统从打印黑色文字和图像发展为全彩色,照片质量的图像。喷墨打印机通常与诸如计算机的一个输出设备相连接。该输出设备向打印机提供打印指令。这些指令通常是要打印在打印介质上的文字和图像的描述语言。常见的喷墨打印机带有包含一个或多个打印头的滑架。该打印头和打印介质彼此相对移动,从而完成打印。
该打印头通常由一个液流喷射基板组成,该基板与该打印系统电连接并且与其液体连通。该液流喷射基板带有多个置于其中的加热电阻,该电阻接收来自打印头的激励信号。上述加热电阻的附近设有多个形成在喷嘴层中的喷嘴。从固定在打印头上的墨水源或从可与打印头分离的可更换的墨水源向该加热电阻供应墨水。通过喷嘴,以墨滴的形式选择性地喷射被供入加热电阻的墨水,并将其喷射到打印介质上。打印介质上的墨水干燥形成墨水“点”,将这些点放在一起看时,形成图像描述语言所表现的打印图像。有时,打印图像用打印质量指标来表征,该指标可包括点的定位、打印分辨率、彩色混合以及例如没有赝像的整体外观。喷墨打印机制造商常常面临日益增长的改善打印质量并提高打印头的可靠性等需求。
最好彼此平行地设置喷嘴层和打印介质。可用一个矢量表示从喷嘴层的一个喷嘴中喷射出的一滴墨滴,该矢量最好垂直于打印介质的平面。当从“理想打印头”的喷嘴层中喷出墨水时,打印介质上墨滴的实际位置就是它应该到达的位置,即其飞行轨道误差为零。但是,实际上喷嘴层制造过程中的偏差导致以通常为0-2度的角度从一个喷嘴中喷出墨滴。喷嘴层中的该偏差是由这样的偏差引起的,例如喷嘴制造中的允许误差以及喷嘴层的平面性方面的偏差等。
打印头和打印介质之间相隔的距离会增大飞行轨道误差造成的影响。例如,传统打印头距打印介质1.5mm。如果与理想即垂直方向成2度误差角地从喷嘴层中喷出墨滴,该墨滴将距离它在打印中应该到达的位置偏移0.052mm。但是,如果打印头和打印介质相隔0.7mm,同样以2度的误差角喷出墨水,墨滴将仅仅偏移0.024mm。由于该飞轨道误差影响墨水在打印介质上的定位,因此该误差会降低打印图像的质量。
在传统打印头中,当混合彩色墨水来形成“照片”品质的打印图像时,飞行轨道误差导致打印质量下降的现象非常普遍。此时,偏移的墨滴会导致打印图像呈颗粒状及条纹状。此外,附加的因素,诸如气流,会进一步影响打印系统的飞行轨道误差。减小打印头和打印介质之间的距离可减轻这些附加因素的影响。
常见打印系统中的打印头与打印介质相隔1-1.5mm。打印头和打印介质之间的这个距离受到液流喷射基板和支撑该液流喷射基板的打印头主体之间的电连接的限制。例如,一个一次性(disposable)的打印头盒包括一个装在打印头主体中的液流喷射基板。通常在该电连接即互连电缆之上设置封装材料,以便保护该连接或使其与墨水隔绝。在热喷墨打印头中使用的墨水带有盐成分,因此有腐蚀性和导电性。一旦该墨水泄漏进入电接口,会产生短路或造成腐蚀,降低打印头的寿命。置于上述互连电缆上的封装材料通常被称为密封垫珠。该密封垫珠从液流喷射基板的喷嘴层突出,并限定了打印头和打印介质之间的距离。因此,对减小飞行轨道误差有一定限制。
除了打印质量以外,打印系统还应具有高可靠性。会降低打印头的可靠性的两种常见的错误模式是(1):互连电缆接触到墨水,以及(2)在打印头的保存寿命内墨水泄漏。该密封垫珠可能受到侵蚀,因而如果打印头的位置太靠近打印介质,以致于在打印过程中该密封垫珠摩擦打印介质,那么就会致使互连电缆接触到墨水。墨水会腐蚀互连电缆,最终导致打印头出现电子故障,使得打印头不可靠。
传统的喷墨打印机采用一个清洁机构,该机构包括一个擦净器,用于日常地从打印头的喷嘴板上擦去墨水残渣。这些残渣如果足够多的话将会堵塞喷嘴,从而阻止墨滴喷射或者使喷射方向错误。该清洁机构具有一定的容许间隙,以便在清洁过程中该擦净器不会损坏打印头。但是,如果擦净器受到突出的密封垫珠的阻碍,擦净器的效果将会降低,而且还可能侵蚀该密封垫珠。
第二个降低打印头寿命的可靠性因素是打印头所处环境的条件。打印头在被用于打印系统之前经常处于极端的环境下。例如,打印头经常被储存在运输仓库里,那里的温度在0-60摄氏度之间。如果打印头通过飞机来运输的话,在运输过程中,打印头还可能处于大气压变化的环境中。总之,传统的打印头被设计为可以适应这些极端的条件而不会泄漏。但是,在前面所述的极端的环境条件下,打印头可能会在被用于打印系统之前就产生泄漏。为了补救这个问题,在喷嘴层上加装了一种带状材料,以便进一步防止墨水泄漏及喷嘴中的墨水干燥。该带状材料最好均匀地贴在喷嘴层上。但是在传统的打印头中,前述密封垫珠会妨碍该带状材料均匀地粘贴在喷嘴层上。如果带状材料不均匀地粘贴在喷嘴层上,墨水会从喷嘴层泄漏,进而损伤周围的部件。而且,从打印头泄漏出来的墨水经过一段时间后会硬化并堵塞喷嘴,还会污染打印头中所含的其它颜色的墨水。此外,用户会发现渗漏的打印头是有故障和劣质的。
因此,始终需要继续改进打印系统,使之更加可靠并且能打印出更高质量的图像。这样的打印系统应当适合大量生产,同时材料成本低,而且还可降低每页的打印成本。
本发明提供一种打印系统,该系统包括一个响应于激励信号,用于在打印介质上喷墨的喷墨打印头。该打印头包括一个支撑体和一个置于该支撑体中的液流喷射基板,该支撑体具有一个形成一凹槽的上表面,该基板与该支撑体形成电连接并且与其液体连通。该液流喷射基板具有一个基本呈平面的喷嘴层,该喷嘴层处于支撑体的上表面的相反侧。该喷嘴层中形成大量喷嘴。打印头的基本呈平面状的接触面位于喷嘴层和密封剂的下方,该密封剂至少部分封闭上述液流喷射基板和支承体,从而形成与喷嘴层基本上共面的表面。
图1是一个打印系统的一个实施例的立体图,该打印系统的打印头在打印介质上平移,从而实现完成打印操作。
图2是一个打印系统的示意图,该打印系统包括上述打印头和一个用于供给该打印头墨水的液体容器。
图3是本发明优选打印头的底视立体图,该打印头包括一个支撑体和一个安装在该支撑体中的液流喷射基板。
图4(a)是图3所示的液流喷射基板脱离支撑体时的底视立体图。
图4(b)是图3所示的液流喷射基板的正剖图,其中示出了用于形成液流喷射基板的材料。
图5是图3所示支撑体的单独的底视立体图,该支撑体用于容纳一个液流喷射基板,该支撑体从液体容器中接收墨水,并通过通道将墨水输送到该液流喷射基板。
图6(a)是一个支撑体的立体图,该支撑体上插有液流喷射基板,该液流喷射基板与支撑体电连接并且与其液体连通。
图6(b)是图6(a)所示支撑体的正剖图,其中在液流喷射基板和支撑体之间形成的互连电缆是拱形的。
图7(a)示出一个模型的立体图,一旦液流喷射基板插入钻孔凹槽,该模型向形成在支撑体上表面中的钻孔凹槽的选定区域内注入密封剂。
图7(b)示出图7(a)的立体图,该图7(b)将图7(a)中模型的一部分除去,从而露出位于液流喷射基板的上表面和支撑体上表面之间的平面。
图8(a)是图7的剖视图,该图8(a)示出当密封剂注入支撑体时的所述模型、液流喷射基板和支撑体。
图8(b)是本发明的剖视图,其中的液流喷射基板被密封在支撑体中,从而形成基本为平面的上表面。
图1示出打印系统100的一个实施例,该打印系统包括本发明的一个打印头102。该打印系统100包括一个能支撑一个或多个打印头102的滑架101。该滑架101固定在一个滑架支撑件104上,当打印头102在打印区运动时,该支撑件104支撑该打印头102。当打印头102在打印区运动时,打印介质106同时步进通过打印区。当打印头102在打印区运动时,该打印头102通过互连电缆107接收来自打印系统100的激励信号,用以选择性地将墨滴喷射在打印介质106上。或者,该打印头102可以固定不动,而打印介质106相对于该打印头102运动来完成打印。虽然图1所示的打印系统100是用于打印8.5×11英寸的打印介质的,但是本领域的普通技术人员应该理解,该打印系统100和打印头102同样适于其它很多种打印环境,诸如大幅面打印和织物打印等。
图2示出了一个带有本发明优选实施例的打印头102的打印系统的示意图。该打印系统包括一个液体容器202,该容器与一个打印头204液体连通,其中墨水从打印头204的下侧(未示出)喷出。该打印头204通过一个液体通道206与该液体容器202相连。该液体通道206由挠材料陶成,使得当打印头204在打印介质上运动时,墨水可连续流到打印头204中。图2所示的打印系统的优点在于它带有可单独更换的液体容器202。因此当液体容器202中的墨水被用尽时,可不更换打印头204而仅更换液体容器202。或者也可以更换打印头204,而不更换液体容器202。
图3示出图2所示的打印头204的底视立体图。将该打印头204放置在可看见其底部的方位,墨水就是从该底部喷出的。该打印头204包括一个支撑体300和一个液流喷射基板304。该液流喷射基板304由半导体材料制成,并带有大量喷嘴306,所述喷嘴构成喷嘴层。墨水从喷嘴306中喷出,并喷射在打印介质上完成打印。而且,液流喷射基板304通过互连电缆308与支撑体300电连接,该支撑体向液流喷射基板304提供激励信号。该互连电缆308使支撑体300上的电接头307与液流喷射基板304上的电接头309形成电连接。在本发明中互连电缆308由金丝构成,但也可采用其它电导线,例如铜、铝或银等。
当打印头204插入打印系统100的滑架101中时,该电接触垫310接触到邻近的滑架101上的电接触垫,从而在打印系统100和打印头204之间形成电连接。互连电缆308和液流喷射基板304的一部分被密封剂312密封。下面马上要详细说明的密封剂312用来防止墨水污染互连电缆308。
图4(a)是没有支撑体300时,图3所示的液流喷射基板304的立体图。该液流喷射基板304具有一个第一平面400、一个第二平面402和一个底面403。该第一平面400带有大量喷嘴306,所述喷嘴形成一个喷嘴层401。该第二平面402通常被称为接触面,该平面上带有8个电接头309,当然根据打印头的具体情况,也可以在第二平面402上设置更多或更少个电接头309。例如,可以根据喷嘴306的数目、信号线的数目和打印系统的多路传输体系改变电接头309的数目。该电接头309是由诸如铝和金的导电材料制成的。液流喷射基板304的底面403包含一个液流通道405。从液流通道405流出的液体被导向热电阻(未示出)并从喷嘴层401中的喷嘴306中选择性地喷出。
图4(b)示出一个图4(a)所示的液流喷射基板304的一个优选实施例的放大剖视图。该液流喷射基板304还包括一个墨水腔410和一个加热电阻412。从支撑体300接收到的墨水流入该液流喷射基板304的液体通道405中。接着墨水被导入墨水腔410中,墨水停留在位于墨水腔410的基底413处的加热电阻412之上。该加热电阻412通过互连电缆308(未示出)接收激励信号,再通过喷嘴306喷出墨水。
图4(b)的液流喷射基板304是由数种材料依次成层而形成一个高质量、可靠的打印头。每层有预定的厚度和独特的功能。首先设置一层近0.6mm厚的半导体基板415。其次在该半导体基板415之上形成一层厚1.2μm的氧化层414,使该半导体基板415与即将形成的金属层绝缘。位于氧化层414之上的金属层分别由铝(Al)418和钽铝(TaAl)420构成。该金属层用于形成加热电阻412和信号线,该加热电阻412由诸如钽铝420的电阻材料制成,而该信号线由铝418制成。在本优选实施例中,金属层的组合厚度为1.2μm。再在该金属层之上形成一个厚0.4μm的钝化层422。该钝化层422防止墨水被导入加热电阻412,进而侵蚀金属层。一个通常被称为空穴层424的附加保护层设置在上述钝化层422之上。该空穴层424由Ta制成,厚度在0.1μm-0.8μm。喷嘴层401形成在该Ta层424之上。该喷嘴层401通常厚40μm,当然也可以使用更薄或更厚一些的喷嘴层。
图5示出支撑体300的立体图,该支撑体300具有一个上表面500和一个设置在该上表面中的钻孔凹槽502。将该钻孔凹槽502的尺寸设置成能容纳液流喷射基板304。在优选实施例中,该钻孔凹槽502的凹槽斜角深度用“d1”表示。该凹槽斜角深度d1从支撑体300的上表面500伸至内部底面512。该钻孔凹槽502包含电接头307,该电接头从打印系统接收激励信号(未示出)。该电接头307处于内部底面512上,且电接头307的高度用参数“h4”表示。电接头307的数目通常对应于液流喷射基板304上的电接头309的数目。支撑体300还包含一个孔506,该孔与图2所示的液体容器202连通。流入孔506的墨水进入通道510,液流喷射基板304的液体通道405位于上述液体通道510之上。在本发明的优选实施例中,支撑体300由注模塑料制成,但是,也可以用包括陶瓷、金属和碳合成物的其它材料制成该支撑体300。
图6(a)表示液流喷射基板304插入钻孔凹槽502后的支撑体300。是这样选定用图4(b)所示的参数“h3”表示的第二平面高度的,使得当液流喷射基板304插入支撑体300时,第二平面的高度h2与用参数“h4”表示的电接头的高度一致。此外,再这样选定斜角高度h2,即使液流喷射基板304的第一平面400和支撑体300的上表面500对齐。或者,也可以使液流喷射基板304的第一平面400在支撑体300的上表面500之上。接着,液流喷射基板304通过互连电缆308与支撑体300电连接。该互连电缆308位于液流喷射基板304的第一平面400和支撑体300的上表面500的下方。
图6(b)示出液流喷射基板304和支撑体300之间的一个互连电缆308的放大剖视图。该互连电缆308是粘合在电接头307和电接头309上的电线,因此,互连电缆308是拱形的,其半径用图6(b)所示的参数“R”表示。用半导体领域的常用手法固定互连电缆308。互连电缆形成拱形以减小应力,否则,该应力会导致电连接失败。半径602通常为100μm且小于用图4(b)所示的参数h1表示的膜叠加高度,该高度通常为41μm。
为了确保拱形的互连电缆308不超出液流喷射基板304的第一平面400,要增加用图6(b)所述的参数“h2”表示的斜角高度。增加斜角高度可有效地使互连电缆308相对于第一平面400降低。也许,最有效的是这样选定斜角高度h2的值,该值通常为150μm,使得当拱形的互连电缆308处于支撑体300的上表面500以下时,第一平面400超出支撑体300的上表面500。或者,也可以这样选定斜角高度h2的值,即使得当拱形的互连电缆308处于上表面500以下时,第一平面400和上表面500处于同一平面上。尽管在本发明的一个实施例中使用了引线结合,但是也可以使用厚度大于高度h1的TAB电路。
图7(a)表示一个用于在支撑体300的选定区域中设置密封剂312的模具700。该密封剂通过入口704以液态形式被供给模具700。再在模具700中形成一个凹槽702,从而当模具700接触到支撑体300时,用以防止位于模具700下面的喷嘴层401受到损坏。图7(b)表示图7(a)的立体图,其中模具700的一部分被除去,从而露出位于液流喷射基板304的第一平面400和支撑体300的上表面500之间的平面。有选择地将该密封剂312涂敷在支撑体300的两个区域中。首先,将密封剂312涂敷在缝隙706中,该缝隙是在插入液流喷射基板304之后,在靠近液流喷射基板304和钻孔凹槽502的地方产生的。其次,将密封剂312涂敷在液流喷射基板304的互连区域708中。
图8(a)表示图7(a)的剖视图,其中模具700与支撑体300接触。该密封剂312通过通道800注入支撑体300中,或者也可以使该密封剂312通过通道800在毛细作用下被吸入支撑体300。当密封剂312通过模具700被涂敷在支撑体300上时,该密封剂312与喷嘴层401隔离。使该密封剂312与喷嘴层401隔离是很重要的,因为该密封剂312如果接触到喷嘴层401,将会永久性地堵塞其中的喷嘴306。一旦涂敷了密封剂312,该密封剂即在环境温度下干燥,也可以通过外部加热来加快干燥/固化过程。还可以使用紫外线使该密封剂固化。在本发明的优选实施例中,通过模具700内的加热线圈802加速密封剂312的固化。
图8(b)表示本发明的一个优选实施例,其中的密封剂312被注入支撑体300中,而模具700已经被除去了。该密封剂312使支撑体300的上表面500更加平整,并避免液流喷射基板的喷嘴层上的墨水接触到互连电缆308。因此,消除了墨水对互连电缆308的损害。进而,由于互连电缆308在形成密封剂层之前就处于液流喷射基板304的第一平面之下,所以省去了传统打印头中常见的密封垫珠。去除了密封垫珠,本发明的打印头204就可以更靠近打印介质工作了。因此,轨道误差及其伴随的影响打印环境的因素被减至最小,从而提高了打印质量。
以前曾尝试改进打印头的可靠性。例如,授予Komuro等人的、题目为“液体喷射记录头”的美国专利No.4873622描述了一种用于形成记录头的压力转移模制技术。该记录头包含一个排出元件,该元件上设有一个膜,墨水从该膜喷到记录介质上。该排出元件电连接到一个金属机架上。在该排出元件之上形成电连接,并围绕该电连接和记录头形成一层环氧树脂。上述膜凹陷在模制成型的环氧树脂中。
本发明中,使用一个阶状的模型,使得电连接成在喷嘴层下足够低的地方,以便密封剂形成在与喷嘴层同一个平面上。本发明的密封剂与喷嘴层形成平面,这一点与Komuro的教导相反,Komuro所说的膜陷在模制成型的环氧树脂中,因此本发明的打印头的喷嘴层可比Komuro的膜更靠近打印介质。喷嘴层更靠近打印介质可减小轨道误差。另外,本发明的打印头具有一个平面的打印头表面,比Komuro的带有一个凹槽的记录头结构更容易清洁,Komuro的记录头中的凹槽容易聚集墨水残余物和灰尘,而且难以用传统的擦拭技术来清洗。
Claims (10)
1、一种响应激励信号,在介质(106)上喷射墨水的喷墨打印头(204),它包括:
一个具有上表面(500)的支撑体(300),该上表面形成一个凹槽(502);
一个置于该支撑体中的液流喷射基板(304),该基板与支撑体建立起电连接并与支撑体液体连通,该液流喷射基板带有一个基本成平面的喷嘴层(401)和一个位于该喷嘴层下面的基本成平面的接触面(402),其中的喷嘴层中形成有多个喷嘴;
一个密封剂(312),它至少部分封闭该液流喷射基板和该支撑体,从而与喷嘴层基本共面。
2、一种如权利要求1所述的打印头(204),其特征在于,该液流喷射基板(304)用于从该支撑体(300)接收墨水,该支撑体的内部底面上(512)上设有一个通道(405),该通道与一个液体容器(202)液体连通。
3、一种如权利要求1所述的打印头(204),其特征在于,该密封剂(312)形成在喷嘴层(401)附近,该密封剂是通过注入在支撑体(300)和液流喷射基板(304)上模制成型的。
4、一种如权利要求1所述的打印头(204),其特征在于,该支撑体(300)包含一个电接头,该电接头(307)与位于共面之下的液流喷射基板(304)电连接。
5、一种如权利要求1所述的打印头(204),其特征在于,液流喷射基板(304)的接触面(402)通过一个互连电缆(308)与支撑体(300)电连接,该互连电缆位于液流喷射基板的喷嘴层(401)的下面。
6、一种如权利要求1所述的打印头(204),其特征在于,支撑体(300)上表面(500)上的凹槽(502)是通过钻孔形成的钻孔凹槽,该支撑体(300)还具有一个内部底面(512),用于支承液流喷身基板(304)。
7、一个选择性地将墨水沉积在打印介质(106)上的打印头(204)的制造方法包括以下步骤:
形成一个用于容纳液流喷射基板(304)的支撑体(300),该液流喷射基板由一个喷嘴层(401)、第一平面(400)和位于该第一平面(400)下方的一个接触面(402)构成;
将该液流喷射基板(304)插入该支撑体(300);
在该液流喷射基板(304)的接触面(402)和支撑体(300)之间形成电连接;
制成一个模具(700),用于将密封剂(312)涂敷在电连接之上,以便与该液流喷射基板(304)和该支撑体(300)的上表面(500)基本形成一个平面。
8、一种如权利要求7所述的方法,其特征在于,还包括当模具罩在该液流喷射基板(304)上时,通过模具(700)涂敷密封剂(312)的步骤。
9、一种如权利要求7所述的方法,其特征在于,还包括一旦密封剂涂敷在液流喷射基板(304)的预定部分上时,控制该密封剂(312)所处的位置的步骤。
10、一种如权利要求7所述的方法,其特征在于,还包括一旦密封剂(312)定位完成之后,移开模具(700)的步骤。
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/430,534 US6188414B1 (en) | 1998-04-30 | 1999-10-29 | Inkjet printhead with preformed substrate |
US09/430,534 | 1999-10-29 | ||
US09/430534 | 1999-10-29 | ||
US55602600A | 2000-04-20 | 2000-04-20 | |
US09/556,026 | 2000-04-20 | ||
US09/556026 | 2000-04-20 |
Publications (2)
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CN1297815A true CN1297815A (zh) | 2001-06-06 |
CN1170680C CN1170680C (zh) | 2004-10-13 |
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CNB001371991A Expired - Fee Related CN1170680C (zh) | 1999-10-29 | 2000-10-29 | 液流喷射装置及其制造方法 |
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US (3) | US6648437B2 (zh) |
EP (1) | EP1095773B1 (zh) |
KR (1) | KR100657108B1 (zh) |
CN (1) | CN1170680C (zh) |
DE (1) | DE60003767T2 (zh) |
TW (1) | TW501979B (zh) |
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Also Published As
Publication number | Publication date |
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US20020030720A1 (en) | 2002-03-14 |
DE60003767T2 (de) | 2004-06-03 |
CN1170680C (zh) | 2004-10-13 |
EP1095773B1 (en) | 2003-07-09 |
EP1095773A1 (en) | 2001-05-02 |
TW501979B (en) | 2002-09-11 |
US20040165027A1 (en) | 2004-08-26 |
US20040046824A1 (en) | 2004-03-11 |
US6648437B2 (en) | 2003-11-18 |
DE60003767D1 (de) | 2003-08-14 |
KR20010040201A (ko) | 2001-05-15 |
KR100657108B1 (ko) | 2006-12-12 |
US6962406B2 (en) | 2005-11-08 |
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