CN1289263C - 用于修饰半导体晶片的固定磨具和设备以及修饰方法 - Google Patents

用于修饰半导体晶片的固定磨具和设备以及修饰方法 Download PDF

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Publication number
CN1289263C
CN1289263C CNB018226604A CN01822660A CN1289263C CN 1289263 C CN1289263 C CN 1289263C CN B018226604 A CNB018226604 A CN B018226604A CN 01822660 A CN01822660 A CN 01822660A CN 1289263 C CN1289263 C CN 1289263C
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CN
China
Prior art keywords
abrasive
rigid
semiconductor wafer
belt
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB018226604A
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English (en)
Chinese (zh)
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CN1489508A (zh
Inventor
D·P·格茨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
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Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN1489508A publication Critical patent/CN1489508A/zh
Application granted granted Critical
Publication of CN1289263C publication Critical patent/CN1289263C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CNB018226604A 2001-02-15 2001-06-19 用于修饰半导体晶片的固定磨具和设备以及修饰方法 Expired - Fee Related CN1289263C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/784,667 US6632129B2 (en) 2001-02-15 2001-02-15 Fixed abrasive article for use in modifying a semiconductor wafer
US09/784,667 2001-02-15

Publications (2)

Publication Number Publication Date
CN1489508A CN1489508A (zh) 2004-04-14
CN1289263C true CN1289263C (zh) 2006-12-13

Family

ID=25133157

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB018226604A Expired - Fee Related CN1289263C (zh) 2001-02-15 2001-06-19 用于修饰半导体晶片的固定磨具和设备以及修饰方法

Country Status (8)

Country Link
US (2) US6632129B2 (OSRAM)
EP (1) EP1360034B1 (OSRAM)
JP (1) JP2004524697A (OSRAM)
KR (1) KR100742794B1 (OSRAM)
CN (1) CN1289263C (OSRAM)
AT (1) ATE311958T1 (OSRAM)
DE (1) DE60115710T2 (OSRAM)
WO (1) WO2002074490A1 (OSRAM)

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Also Published As

Publication number Publication date
US6632129B2 (en) 2003-10-14
JP2004524697A (ja) 2004-08-12
US20020111120A1 (en) 2002-08-15
KR20030077622A (ko) 2003-10-01
EP1360034B1 (en) 2005-12-07
US20040072506A1 (en) 2004-04-15
DE60115710D1 (de) 2006-01-12
ATE311958T1 (de) 2005-12-15
WO2002074490A1 (en) 2002-09-26
KR100742794B1 (ko) 2007-07-25
CN1489508A (zh) 2004-04-14
US7329171B2 (en) 2008-02-12
EP1360034A1 (en) 2003-11-12
DE60115710T2 (de) 2006-08-31

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