CN1283213A - 导电性填料及其制备方法 - Google Patents

导电性填料及其制备方法 Download PDF

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Publication number
CN1283213A
CN1283213A CN98812782A CN98812782A CN1283213A CN 1283213 A CN1283213 A CN 1283213A CN 98812782 A CN98812782 A CN 98812782A CN 98812782 A CN98812782 A CN 98812782A CN 1283213 A CN1283213 A CN 1283213A
Authority
CN
China
Prior art keywords
ducted body
filler
mentioned
small
small ducted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN98812782A
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English (en)
Chinese (zh)
Inventor
赫尔穆特·卡尔
伯恩德·蒂布尔齐乌斯
赫尔穆特·瓦格纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CN1283213A publication Critical patent/CN1283213A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/223—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating specially adapted for coating particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Conductive Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
CN98812782A 1997-11-03 1998-11-03 导电性填料及其制备方法 Pending CN1283213A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19749956 1997-11-03
DE19749956.2 1997-11-03

Publications (1)

Publication Number Publication Date
CN1283213A true CN1283213A (zh) 2001-02-07

Family

ID=7848379

Family Applications (1)

Application Number Title Priority Date Filing Date
CN98812782A Pending CN1283213A (zh) 1997-11-03 1998-11-03 导电性填料及其制备方法

Country Status (13)

Country Link
EP (1) EP1030880A1 (ja)
JP (1) JP2001521964A (ja)
KR (1) KR100421334B1 (ja)
CN (1) CN1283213A (ja)
AU (1) AU730445B2 (ja)
CA (1) CA2309074A1 (ja)
DE (1) DE19881647D2 (ja)
HU (1) HUP0004285A3 (ja)
IL (1) IL135862A0 (ja)
NO (1) NO312902B1 (ja)
RU (1) RU2199556C2 (ja)
TR (1) TR200001006T2 (ja)
WO (1) WO1999023152A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104448562A (zh) * 2014-12-04 2015-03-25 苏州润佳工程塑料股份有限公司 一种包覆型导电粉体及其制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE269374T1 (de) * 1997-11-03 2004-07-15 Helmut Kahl Kunststoffmaterial und leitfähiger kunststoffgegenstand
JP6516731B2 (ja) 2013-09-24 2019-05-22 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 熱分解有機層およびそれによって製造される導電性プリプレグ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096548A (ja) * 1983-10-31 1985-05-30 Nippon Chem Ind Co Ltd:The 導電性材料
US4621024A (en) * 1984-12-31 1986-11-04 Paper Applications International, Inc. Metal-coated hollow microspheres
JP3042101B2 (ja) * 1991-11-22 2000-05-15 ジェイエスアール株式会社 複合粒子および中空粒子の製造方法
DE4405156C1 (de) * 1994-02-18 1995-10-26 Univ Karlsruhe Verfahren zur Herstellung beschichteter polymerer Mikropartikel
DE19518942C2 (de) * 1995-05-23 1998-12-10 Fraunhofer Ges Forschung Verfahren zur Herstellung von metallisierten Polymerpartikeln und nach dem Verfahren hergestelltes Polymermaterial sowie deren Verwendung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104448562A (zh) * 2014-12-04 2015-03-25 苏州润佳工程塑料股份有限公司 一种包覆型导电粉体及其制备方法

Also Published As

Publication number Publication date
KR20010031755A (ko) 2001-04-16
CA2309074A1 (en) 1999-05-14
JP2001521964A (ja) 2001-11-13
WO1999023152A1 (de) 1999-05-14
TR200001006T2 (tr) 2000-07-21
RU2199556C2 (ru) 2003-02-27
AU1749599A (en) 1999-05-24
IL135862A0 (en) 2001-05-20
DE19881647D2 (de) 2000-04-13
HUP0004285A1 (en) 2001-03-28
NO312902B1 (no) 2002-07-15
NO20002323D0 (no) 2000-05-02
EP1030880A1 (de) 2000-08-30
AU730445B2 (en) 2001-03-08
KR100421334B1 (ko) 2004-03-09
HUP0004285A3 (en) 2002-02-28
NO20002323L (no) 2000-06-20

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication