NO20002323D0 - Elektrisk ledende fyllstoff for ledende plastmaterialer - Google Patents
Elektrisk ledende fyllstoff for ledende plastmaterialerInfo
- Publication number
- NO20002323D0 NO20002323D0 NO20002323A NO20002323A NO20002323D0 NO 20002323 D0 NO20002323 D0 NO 20002323D0 NO 20002323 A NO20002323 A NO 20002323A NO 20002323 A NO20002323 A NO 20002323A NO 20002323 D0 NO20002323 D0 NO 20002323D0
- Authority
- NO
- Norway
- Prior art keywords
- plastic materials
- electrically conductive
- conductive
- filler
- conductive filler
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/223—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating specially adapted for coating particles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19749956 | 1997-11-03 | ||
PCT/DE1998/003267 WO1999023152A1 (de) | 1997-11-03 | 1998-11-03 | Elektrisch leitfähiger füllstoff und verfahren zu dessen herstellung |
Publications (3)
Publication Number | Publication Date |
---|---|
NO20002323D0 true NO20002323D0 (no) | 2000-05-02 |
NO20002323L NO20002323L (no) | 2000-06-20 |
NO312902B1 NO312902B1 (no) | 2002-07-15 |
Family
ID=7848379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20002323A NO312902B1 (no) | 1997-11-03 | 2000-05-02 | Elektrisk ledende fyllstoff for ledende plastmaterialer |
Country Status (13)
Country | Link |
---|---|
EP (1) | EP1030880A1 (no) |
JP (1) | JP2001521964A (no) |
KR (1) | KR100421334B1 (no) |
CN (1) | CN1283213A (no) |
AU (1) | AU730445B2 (no) |
CA (1) | CA2309074A1 (no) |
DE (1) | DE19881647D2 (no) |
HU (1) | HUP0004285A3 (no) |
IL (1) | IL135862A0 (no) |
NO (1) | NO312902B1 (no) |
RU (1) | RU2199556C2 (no) |
TR (1) | TR200001006T2 (no) |
WO (1) | WO1999023152A1 (no) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999023153A2 (de) * | 1997-11-03 | 1999-05-14 | Helmut Kahl | Kunststoffmaterial und leitfähiger kunststoffgegenstand |
BR112016002368A2 (pt) | 2013-09-24 | 2017-08-01 | Henkel IP & Holding GmbH | camadas orgânicas pirolisadas e pré-impregnados condutores produzidos com essas camadas |
CN104448562A (zh) * | 2014-12-04 | 2015-03-25 | 苏州润佳工程塑料股份有限公司 | 一种包覆型导电粉体及其制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6096548A (ja) * | 1983-10-31 | 1985-05-30 | Nippon Chem Ind Co Ltd:The | 導電性材料 |
US4621024A (en) * | 1984-12-31 | 1986-11-04 | Paper Applications International, Inc. | Metal-coated hollow microspheres |
JP3042101B2 (ja) * | 1991-11-22 | 2000-05-15 | ジェイエスアール株式会社 | 複合粒子および中空粒子の製造方法 |
DE4405156C1 (de) * | 1994-02-18 | 1995-10-26 | Univ Karlsruhe | Verfahren zur Herstellung beschichteter polymerer Mikropartikel |
DE19518942C2 (de) * | 1995-05-23 | 1998-12-10 | Fraunhofer Ges Forschung | Verfahren zur Herstellung von metallisierten Polymerpartikeln und nach dem Verfahren hergestelltes Polymermaterial sowie deren Verwendung |
-
1998
- 1998-11-03 CA CA 2309074 patent/CA2309074A1/en not_active Abandoned
- 1998-11-03 IL IL13586298A patent/IL135862A0/xx unknown
- 1998-11-03 EP EP98962226A patent/EP1030880A1/de not_active Withdrawn
- 1998-11-03 HU HU0004285A patent/HUP0004285A3/hu unknown
- 1998-11-03 WO PCT/DE1998/003267 patent/WO1999023152A1/de not_active Application Discontinuation
- 1998-11-03 CN CN98812782A patent/CN1283213A/zh active Pending
- 1998-11-03 JP JP2000519021A patent/JP2001521964A/ja active Pending
- 1998-11-03 TR TR200001006T patent/TR200001006T2/xx unknown
- 1998-11-03 KR KR10-2000-7004820A patent/KR100421334B1/ko not_active IP Right Cessation
- 1998-11-03 AU AU17495/99A patent/AU730445B2/en not_active Ceased
- 1998-11-03 DE DE19881647T patent/DE19881647D2/de not_active Ceased
- 1998-11-03 RU RU2000114187A patent/RU2199556C2/ru not_active IP Right Cessation
-
2000
- 2000-05-02 NO NO20002323A patent/NO312902B1/no not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2309074A1 (en) | 1999-05-14 |
KR100421334B1 (ko) | 2004-03-09 |
JP2001521964A (ja) | 2001-11-13 |
HUP0004285A3 (en) | 2002-02-28 |
TR200001006T2 (tr) | 2000-07-21 |
NO312902B1 (no) | 2002-07-15 |
HUP0004285A1 (en) | 2001-03-28 |
KR20010031755A (ko) | 2001-04-16 |
CN1283213A (zh) | 2001-02-07 |
DE19881647D2 (de) | 2000-04-13 |
RU2199556C2 (ru) | 2003-02-27 |
AU1749599A (en) | 1999-05-24 |
EP1030880A1 (de) | 2000-08-30 |
NO20002323L (no) | 2000-06-20 |
AU730445B2 (en) | 2001-03-08 |
IL135862A0 (en) | 2001-05-20 |
WO1999023152A1 (de) | 1999-05-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM1K | Lapsed by not paying the annual fees |