AU1749599A - Electrically conductive filler and process for the production thereof - Google Patents

Electrically conductive filler and process for the production thereof

Info

Publication number
AU1749599A
AU1749599A AU17495/99A AU1749599A AU1749599A AU 1749599 A AU1749599 A AU 1749599A AU 17495/99 A AU17495/99 A AU 17495/99A AU 1749599 A AU1749599 A AU 1749599A AU 1749599 A AU1749599 A AU 1749599A
Authority
AU
Australia
Prior art keywords
production
electrically conductive
conductive filler
filler
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU17495/99A
Other versions
AU730445B2 (en
Inventor
Helmut Kahl
Bernd Tiburtius
Helmut Wegener
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU1749599A publication Critical patent/AU1749599A/en
Application granted granted Critical
Publication of AU730445B2 publication Critical patent/AU730445B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/223Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating specially adapted for coating particles
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/22Expanded, porous or hollow particles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • C23C18/2086Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Conductive Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
AU17495/99A 1997-11-03 1998-11-03 Electrically conductive filler and process for the production thereof Ceased AU730445B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19749956 1997-11-03
DE19749956 1997-11-03
PCT/DE1998/003267 WO1999023152A1 (en) 1997-11-03 1998-11-03 Electrically conductive filler and method for the production thereof

Publications (2)

Publication Number Publication Date
AU1749599A true AU1749599A (en) 1999-05-24
AU730445B2 AU730445B2 (en) 2001-03-08

Family

ID=7848379

Family Applications (1)

Application Number Title Priority Date Filing Date
AU17495/99A Ceased AU730445B2 (en) 1997-11-03 1998-11-03 Electrically conductive filler and process for the production thereof

Country Status (13)

Country Link
EP (1) EP1030880A1 (en)
JP (1) JP2001521964A (en)
KR (1) KR100421334B1 (en)
CN (1) CN1283213A (en)
AU (1) AU730445B2 (en)
CA (1) CA2309074A1 (en)
DE (1) DE19881647D2 (en)
HU (1) HUP0004285A3 (en)
IL (1) IL135862A0 (en)
NO (1) NO312902B1 (en)
RU (1) RU2199556C2 (en)
TR (1) TR200001006T2 (en)
WO (1) WO1999023152A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU739520B2 (en) * 1997-11-03 2001-10-11 Karl Gielnik Plastic material and conductive plastic object

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112016002368A2 (en) 2013-09-24 2017-08-01 Henkel IP & Holding GmbH pyrolyzed organic conductive prepreg layers produced with these layers
CN104448562A (en) * 2014-12-04 2015-03-25 苏州润佳工程塑料股份有限公司 Coated conductive powder and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096548A (en) * 1983-10-31 1985-05-30 Nippon Chem Ind Co Ltd:The Electrically conductive material
US4621024A (en) * 1984-12-31 1986-11-04 Paper Applications International, Inc. Metal-coated hollow microspheres
JP3042101B2 (en) * 1991-11-22 2000-05-15 ジェイエスアール株式会社 Method for producing composite particles and hollow particles
DE4405156C1 (en) * 1994-02-18 1995-10-26 Univ Karlsruhe Process for the production of coated polymeric microparticles
DE19518942C2 (en) * 1995-05-23 1998-12-10 Fraunhofer Ges Forschung Process for the production of metallized polymer particles and polymer material produced by the process and their use

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU739520B2 (en) * 1997-11-03 2001-10-11 Karl Gielnik Plastic material and conductive plastic object

Also Published As

Publication number Publication date
HUP0004285A3 (en) 2002-02-28
NO20002323D0 (en) 2000-05-02
IL135862A0 (en) 2001-05-20
TR200001006T2 (en) 2000-07-21
JP2001521964A (en) 2001-11-13
DE19881647D2 (en) 2000-04-13
RU2199556C2 (en) 2003-02-27
EP1030880A1 (en) 2000-08-30
WO1999023152A1 (en) 1999-05-14
KR20010031755A (en) 2001-04-16
HUP0004285A1 (en) 2001-03-28
CA2309074A1 (en) 1999-05-14
NO20002323L (en) 2000-06-20
CN1283213A (en) 2001-02-07
KR100421334B1 (en) 2004-03-09
NO312902B1 (en) 2002-07-15
AU730445B2 (en) 2001-03-08

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Legal Events

Date Code Title Description
FGA Letters patent sealed or granted (standard patent)