HUP0004285A3 - Electrically conductive filler and method for the production thereof - Google Patents

Electrically conductive filler and method for the production thereof

Info

Publication number
HUP0004285A3
HUP0004285A3 HU0004285A HUP0004285A HUP0004285A3 HU P0004285 A3 HUP0004285 A3 HU P0004285A3 HU 0004285 A HU0004285 A HU 0004285A HU P0004285 A HUP0004285 A HU P0004285A HU P0004285 A3 HUP0004285 A3 HU P0004285A3
Authority
HU
Hungary
Prior art keywords
production
electrically conductive
conductive filler
filler
electrically
Prior art date
Application number
HU0004285A
Other languages
Hungarian (hu)
Original Assignee
Wegener Helmut
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wegener Helmut filed Critical Wegener Helmut
Publication of HUP0004285A1 publication Critical patent/HUP0004285A1/en
Publication of HUP0004285A3 publication Critical patent/HUP0004285A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/223—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating specially adapted for coating particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Conductive Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
HU0004285A 1997-11-03 1998-11-03 Electrically conductive filler and method for the production thereof HUP0004285A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19749956 1997-11-03
PCT/DE1998/003267 WO1999023152A1 (en) 1997-11-03 1998-11-03 Electrically conductive filler and method for the production thereof

Publications (2)

Publication Number Publication Date
HUP0004285A1 HUP0004285A1 (en) 2001-03-28
HUP0004285A3 true HUP0004285A3 (en) 2002-02-28

Family

ID=7848379

Family Applications (1)

Application Number Title Priority Date Filing Date
HU0004285A HUP0004285A3 (en) 1997-11-03 1998-11-03 Electrically conductive filler and method for the production thereof

Country Status (13)

Country Link
EP (1) EP1030880A1 (en)
JP (1) JP2001521964A (en)
KR (1) KR100421334B1 (en)
CN (1) CN1283213A (en)
AU (1) AU730445B2 (en)
CA (1) CA2309074A1 (en)
DE (1) DE19881647D2 (en)
HU (1) HUP0004285A3 (en)
IL (1) IL135862A0 (en)
NO (1) NO312902B1 (en)
RU (1) RU2199556C2 (en)
TR (1) TR200001006T2 (en)
WO (1) WO1999023152A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100358941C (en) * 1997-11-03 2008-01-02 赫尔穆特·卡尔 Plastic material and conductive plastic object
WO2015047605A1 (en) 2013-09-24 2015-04-02 Henkel IP & Holding GmbH Pyrolized organic layers and conductive prepregs made therewith
CN104448562A (en) * 2014-12-04 2015-03-25 苏州润佳工程塑料股份有限公司 Coated conductive powder and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096548A (en) * 1983-10-31 1985-05-30 Nippon Chem Ind Co Ltd:The Electrically conductive material
US4621024A (en) * 1984-12-31 1986-11-04 Paper Applications International, Inc. Metal-coated hollow microspheres
JP3042101B2 (en) * 1991-11-22 2000-05-15 ジェイエスアール株式会社 Method for producing composite particles and hollow particles
DE4405156C1 (en) * 1994-02-18 1995-10-26 Univ Karlsruhe Process for the production of coated polymeric microparticles
DE19518942C2 (en) * 1995-05-23 1998-12-10 Fraunhofer Ges Forschung Process for the production of metallized polymer particles and polymer material produced by the process and their use

Also Published As

Publication number Publication date
RU2199556C2 (en) 2003-02-27
WO1999023152A1 (en) 1999-05-14
KR100421334B1 (en) 2004-03-09
KR20010031755A (en) 2001-04-16
JP2001521964A (en) 2001-11-13
HUP0004285A1 (en) 2001-03-28
CN1283213A (en) 2001-02-07
AU730445B2 (en) 2001-03-08
AU1749599A (en) 1999-05-24
IL135862A0 (en) 2001-05-20
NO312902B1 (en) 2002-07-15
CA2309074A1 (en) 1999-05-14
NO20002323D0 (en) 2000-05-02
TR200001006T2 (en) 2000-07-21
NO20002323L (en) 2000-06-20
DE19881647D2 (en) 2000-04-13
EP1030880A1 (en) 2000-08-30

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