TR200001006T2 - Filling material with electrical conductivity and method for the production of this material. - Google Patents

Filling material with electrical conductivity and method for the production of this material.

Info

Publication number
TR200001006T2
TR200001006T2 TR200001006T TR200001006T TR200001006T2 TR 200001006 T2 TR200001006 T2 TR 200001006T2 TR 200001006 T TR200001006 T TR 200001006T TR 200001006 T TR200001006 T TR 200001006T TR 200001006 T2 TR200001006 T2 TR 200001006T2
Authority
TR
Turkey
Prior art keywords
production
electrical conductivity
filling material
filling
resistant
Prior art date
Application number
TR200001006T
Other languages
Turkish (tr)
Inventor
Kahl Helmut
Tiburtius Bernd
Wegener Helmut
Original Assignee
Kahl Helmut
Tiburtius Bernd
Wegener Helmut
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kahl Helmut, Tiburtius Bernd, Wegener Helmut filed Critical Kahl Helmut
Publication of TR200001006T2 publication Critical patent/TR200001006T2/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/223—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating specially adapted for coating particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

Iletken bir plastik malzemeye yönelik, gaz dolgulu ve basinca dayanikli/elastik, özellikle de sikistirilmis oyuk mikro gövde seklinde, disi son derece iletken bir metal ile kaplanmis olan parçaciklardan olusan, elektrik iletkenligine sahip dolgu malzemesi.Electrically conductive filler material for conductive plastic material, consisting of gas-filled and pressure-resistant / elastic, especially compacted hollow micro-body, particles coated with a highly conductive metal outside.

TR200001006T 1997-11-03 1998-11-03 Filling material with electrical conductivity and method for the production of this material. TR200001006T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19749956 1997-11-03

Publications (1)

Publication Number Publication Date
TR200001006T2 true TR200001006T2 (en) 2000-07-21

Family

ID=7848379

Family Applications (1)

Application Number Title Priority Date Filing Date
TR200001006T TR200001006T2 (en) 1997-11-03 1998-11-03 Filling material with electrical conductivity and method for the production of this material.

Country Status (13)

Country Link
EP (1) EP1030880A1 (en)
JP (1) JP2001521964A (en)
KR (1) KR100421334B1 (en)
CN (1) CN1283213A (en)
AU (1) AU730445B2 (en)
CA (1) CA2309074A1 (en)
DE (1) DE19881647D2 (en)
HU (1) HUP0004285A3 (en)
IL (1) IL135862A0 (en)
NO (1) NO312902B1 (en)
RU (1) RU2199556C2 (en)
TR (1) TR200001006T2 (en)
WO (1) WO1999023152A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001522896A (en) * 1997-11-03 2001-11-20 カール ヘルムート Plastic material
KR20160058759A (en) 2013-09-24 2016-05-25 헨켈 아이피 앤드 홀딩 게엠베하 Pyrolized organic layers and conductive prepregs made therewith
CN104448562A (en) * 2014-12-04 2015-03-25 苏州润佳工程塑料股份有限公司 Coated conductive powder and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096548A (en) * 1983-10-31 1985-05-30 Nippon Chem Ind Co Ltd:The Electrically conductive material
US4621024A (en) * 1984-12-31 1986-11-04 Paper Applications International, Inc. Metal-coated hollow microspheres
JP3042101B2 (en) * 1991-11-22 2000-05-15 ジェイエスアール株式会社 Method for producing composite particles and hollow particles
DE4405156C1 (en) * 1994-02-18 1995-10-26 Univ Karlsruhe Process for the production of coated polymeric microparticles
DE19518942C2 (en) * 1995-05-23 1998-12-10 Fraunhofer Ges Forschung Process for the production of metallized polymer particles and polymer material produced by the process and their use

Also Published As

Publication number Publication date
RU2199556C2 (en) 2003-02-27
KR100421334B1 (en) 2004-03-09
CA2309074A1 (en) 1999-05-14
WO1999023152A1 (en) 1999-05-14
HUP0004285A1 (en) 2001-03-28
NO20002323L (en) 2000-06-20
JP2001521964A (en) 2001-11-13
EP1030880A1 (en) 2000-08-30
AU1749599A (en) 1999-05-24
HUP0004285A3 (en) 2002-02-28
DE19881647D2 (en) 2000-04-13
CN1283213A (en) 2001-02-07
KR20010031755A (en) 2001-04-16
NO312902B1 (en) 2002-07-15
IL135862A0 (en) 2001-05-20
NO20002323D0 (en) 2000-05-02
AU730445B2 (en) 2001-03-08

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