TR200001006T2 - Filling material with electrical conductivity and method for the production of this material. - Google Patents
Filling material with electrical conductivity and method for the production of this material.Info
- Publication number
- TR200001006T2 TR200001006T2 TR200001006T TR200001006T TR200001006T2 TR 200001006 T2 TR200001006 T2 TR 200001006T2 TR 200001006 T TR200001006 T TR 200001006T TR 200001006 T TR200001006 T TR 200001006T TR 200001006 T2 TR200001006 T2 TR 200001006T2
- Authority
- TR
- Turkey
- Prior art keywords
- production
- electrical conductivity
- filling material
- filling
- resistant
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/223—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating specially adapted for coating particles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Physical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Iletken bir plastik malzemeye yönelik, gaz dolgulu ve basinca dayanikli/elastik, özellikle de sikistirilmis oyuk mikro gövde seklinde, disi son derece iletken bir metal ile kaplanmis olan parçaciklardan olusan, elektrik iletkenligine sahip dolgu malzemesi.Electrically conductive filler material for conductive plastic material, consisting of gas-filled and pressure-resistant / elastic, especially compacted hollow micro-body, particles coated with a highly conductive metal outside.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19749956 | 1997-11-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
TR200001006T2 true TR200001006T2 (en) | 2000-07-21 |
Family
ID=7848379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TR200001006T TR200001006T2 (en) | 1997-11-03 | 1998-11-03 | Filling material with electrical conductivity and method for the production of this material. |
Country Status (13)
Country | Link |
---|---|
EP (1) | EP1030880A1 (en) |
JP (1) | JP2001521964A (en) |
KR (1) | KR100421334B1 (en) |
CN (1) | CN1283213A (en) |
AU (1) | AU730445B2 (en) |
CA (1) | CA2309074A1 (en) |
DE (1) | DE19881647D2 (en) |
HU (1) | HUP0004285A3 (en) |
IL (1) | IL135862A0 (en) |
NO (1) | NO312902B1 (en) |
RU (1) | RU2199556C2 (en) |
TR (1) | TR200001006T2 (en) |
WO (1) | WO1999023152A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001522896A (en) * | 1997-11-03 | 2001-11-20 | カール ヘルムート | Plastic material |
KR20160058759A (en) | 2013-09-24 | 2016-05-25 | 헨켈 아이피 앤드 홀딩 게엠베하 | Pyrolized organic layers and conductive prepregs made therewith |
CN104448562A (en) * | 2014-12-04 | 2015-03-25 | 苏州润佳工程塑料股份有限公司 | Coated conductive powder and preparation method thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6096548A (en) * | 1983-10-31 | 1985-05-30 | Nippon Chem Ind Co Ltd:The | Electrically conductive material |
US4621024A (en) * | 1984-12-31 | 1986-11-04 | Paper Applications International, Inc. | Metal-coated hollow microspheres |
JP3042101B2 (en) * | 1991-11-22 | 2000-05-15 | ジェイエスアール株式会社 | Method for producing composite particles and hollow particles |
DE4405156C1 (en) * | 1994-02-18 | 1995-10-26 | Univ Karlsruhe | Process for the production of coated polymeric microparticles |
DE19518942C2 (en) * | 1995-05-23 | 1998-12-10 | Fraunhofer Ges Forschung | Process for the production of metallized polymer particles and polymer material produced by the process and their use |
-
1998
- 1998-11-03 DE DE19881647T patent/DE19881647D2/en not_active Ceased
- 1998-11-03 IL IL13586298A patent/IL135862A0/en unknown
- 1998-11-03 CN CN98812782A patent/CN1283213A/en active Pending
- 1998-11-03 WO PCT/DE1998/003267 patent/WO1999023152A1/en not_active Application Discontinuation
- 1998-11-03 CA CA 2309074 patent/CA2309074A1/en not_active Abandoned
- 1998-11-03 TR TR200001006T patent/TR200001006T2/en unknown
- 1998-11-03 JP JP2000519021A patent/JP2001521964A/en active Pending
- 1998-11-03 AU AU17495/99A patent/AU730445B2/en not_active Ceased
- 1998-11-03 KR KR10-2000-7004820A patent/KR100421334B1/en not_active IP Right Cessation
- 1998-11-03 HU HU0004285A patent/HUP0004285A3/en unknown
- 1998-11-03 EP EP98962226A patent/EP1030880A1/en not_active Withdrawn
- 1998-11-03 RU RU2000114187A patent/RU2199556C2/en not_active IP Right Cessation
-
2000
- 2000-05-02 NO NO20002323A patent/NO312902B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
RU2199556C2 (en) | 2003-02-27 |
KR100421334B1 (en) | 2004-03-09 |
CA2309074A1 (en) | 1999-05-14 |
WO1999023152A1 (en) | 1999-05-14 |
HUP0004285A1 (en) | 2001-03-28 |
NO20002323L (en) | 2000-06-20 |
JP2001521964A (en) | 2001-11-13 |
EP1030880A1 (en) | 2000-08-30 |
AU1749599A (en) | 1999-05-24 |
HUP0004285A3 (en) | 2002-02-28 |
DE19881647D2 (en) | 2000-04-13 |
CN1283213A (en) | 2001-02-07 |
KR20010031755A (en) | 2001-04-16 |
NO312902B1 (en) | 2002-07-15 |
IL135862A0 (en) | 2001-05-20 |
NO20002323D0 (en) | 2000-05-02 |
AU730445B2 (en) | 2001-03-08 |
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