CN1278842C - 制造热塑性树脂容器的方法与模具 - Google Patents

制造热塑性树脂容器的方法与模具 Download PDF

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CN1278842C
CN1278842C CNB011431121A CN01143112A CN1278842C CN 1278842 C CN1278842 C CN 1278842C CN B011431121 A CNB011431121 A CN B011431121A CN 01143112 A CN01143112 A CN 01143112A CN 1278842 C CN1278842 C CN 1278842C
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die cavity
thermoplastic resin
basal plane
mould
surface portions
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陈德丰
青木秀人
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Singapore Speed Electronic Packaging Ltd
Sumitomo Bakelite Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/26—Component parts, details or accessories; Auxiliary operations
    • B29C51/30—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/006—Using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/007—Using fluid under pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/10—Forming by pressure difference, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/712—Containers; Packaging elements or accessories, Packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Packaging Frangible Articles (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Containers And Plastic Fillers For Packaging (AREA)
  • Packages (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)

Abstract

热塑性树脂容器的凹槽通过在热塑性树脂片材的一部分加热后将该部分热塑性树脂片材部分压进模具的模腔内来形成，从而形成凹槽的一底面部分和各侧壁，其特征在于，模腔的底面具有沿远离基面部分的深度方向突出的凸状面积，其中所述基面部分在模具上形成在热塑性树脂的另一部分上形成。

Description

制造热塑性树脂容器的方法与模具
技术领域
本发明涉及制造热塑性树脂容器的方法和模具，该容器特别是可用作热塑性树脂带式载体，其具有许多凹槽用以分别容纳电子元件例如集成电路芯片。
背景技术
在现有技术中，用于容纳一元件的热塑性树脂容器的凹槽靠气动力将热塑性树脂片材的一部分压进模具的模腔来形成。
发明内容
本发明的一个目的是提供制造热塑性树脂容器的方法和模具，利用该方法和模具可改善在热塑性树脂容器的凹槽的底部上的平面度。
按照本发明，对于包括一基面部分、一对从该平面基面部分延伸的侧壁和一在该两侧壁之间在基面部分与底面部分之间沿底面部分的厚度方向的距离处延伸的底面部分以便形成容纳一元件的凹槽之容器的制造方法，包括在加热热塑性树脂片材的一部分以后将该部分热塑性树脂片材压进模具的模腔内的步骤，以便以所述距离形成底面部分和各侧壁，其中模腔的底面具有一向远离基面部分的深度方向突出的凸状面积，其中所述基面部分在模具上形成在热塑性树脂片材的另一部分上。
按照本发明，由热塑性树脂片材制造包括一基面部分、一对从该平面基面部分延伸的侧壁和一在该两侧壁之间在基面部分与底面部分之间沿底面部分的厚度方向的距离处延伸的底面部分之容器的模具，包括适合于接纳在加热热塑性树脂片材以后的该部分热塑性树脂片材的模腔，以便在模腔内以所述距离形成底面部分和各侧壁从而形成一用于在其中容纳一元件的容器的凹槽，还包括一邻接于模腔并围绕模腔的平面基面面积，其中模腔的底面具有一向远离平面基面面积的深度方向突出的凸状面积。
由于模腔的底面具有向远离基面部分的深度方向突出的凸状面积，其中基面部分围绕凹槽形成在热塑性树脂片材的另一部分上，改善了在热塑性树脂容器冷却到大气温度以后底面部分上的平面度而不管在将热塑性树脂片材变形到形成容器以后所产生热塑性树脂片材的热应力和/或变形如何。
当模腔沿深度方向的深度大于所述距离时，底面部分受约束而不会向相反于深度方向的方向突出从而改善了在热塑性树脂容器冷却到大气温度以后底面部分上的平面度。优选的是凸出形状为一半球形、截圆锥形或截棱锥形。底面部分的主面积可以基本上平行于基面部分延伸。为改善平面度优选的是，在凸状的顶端与其底端之间在远离平面基面部分的方向上的深度差为0.1-1mm。该热塑性树脂容器可适合于容纳一球栅极镇流(ball grid allay)电子元件。
当在所述距离变成等于模腔的深度以后该距离被减至变成小于模腔的深度时和/或在底面部分与模腔的底面接触以后该距离被减小时，有效地改善了平面度。当模腔的底面具有一邻接于凸形面积并围绕该凸形面积的平面面积和/或凸形面积在其顶端具有一平面面积时，进一步改善了平面度。
附图简述
图1为表示本发明的一容器(元件载体带)的斜投影图；
图2为表示该容器的侧视图；
图3为沿图1中的III-III面截取的剖视图；
图4为表示其中容纳一电子元件如球栅阵列电子元件的容器的剖视图；
图5a为表示本发明另一容器(元件载体带)的斜投影图；
图5b为表示图5a的容器的侧视图；
图5c为沿图5a中的Vc-Vc面截取的剖视图；
图6a为表示本发明的模具的斜投影图；
图6b为沿图6a中的VIb-VIb面截取的剖视图。
优选实施例详述
如图1中所示，容器1用作一电子元件例如SOP(小型封装)、SSOP(压缩小型封装)、TSOP(薄小型封装)、TSSOP(薄压缩小型封装)、PLCC(有引线芯片塑料载体)、QFP(方形扁平封装)和BGA(球栅阵列)等的载体带，并且由软质树脂制成，该容器1具有凹槽(模压的区域2)，其包括所述的各侧壁和底面部分以及一作为所述基面部分的凸缘3。各凹槽2沿载体带的纵方向以恒定的间距定位并可以在其中容纳有关的电子元件。一带式盖(未示出)粘结于凸缘3上以覆盖各凹槽从而防止电子元件从凹槽中脱落，并且在凸缘的至少一侧上沿纵向方向设置带输送孔4。各凹槽2通过气动力(通过造成真空或压缩空气引起的压力差)将热塑性树脂片材压进模具的各个模腔内来形成。
当模具的模腔具有面积27mm×27mm和深度3mm，模腔的底面在其中心具有高度0.3mm的四边形截棱锥凸状的凹部，且顶端平面面积26mm×26mm，并且将一厚度0.3mm的聚苯乙烯片材在加热到180℃后靠气动力压进该模腔时则形成所述凹槽，Ko＝3.05mm，Kc＝3.10mm，Po＝0.28mm和Pc＝0.20mm，其中Ko是凹槽在其中心在凸缘3的上表面与其中心之间的深度，Kc是凹槽在其周边在凸缘3的上表面与其周边之间的深度，Po是片材在其中心的厚度，以及Pc是片材在其周边的厚度。翘曲W＝(Kc+Pc)-(Ko+Po)＝-0.03mm，因此翘曲W是非常小的。
当该凹槽在其中容纳一BGA封装件时，Zo＝0.45mm，Zc＝0.5mm，而Zo是容纳于凹槽内的BGA封装件的高度与凹槽在其中心的深度之间的差值，Zc是BGA封装件的高度与凹槽在其周边的深度之间的差值。
当模具的模腔不包括如上所述的四边形截棱锥凸状的凹部时，Ko＝2.75mm，Kc＝3.10mm，Po＝0.28mm，Pc＝0.20mm，W＝(Kc+Pc)-(Ko+Po)＝0.27mm，Zo＝0.15mm和Zc＝0.5mm。
因此，Zo是非常小的从而可能容易损坏BGA封装件。

Claims (16)

1.一种热塑性树脂容器的制造方法，该容器包括一基面部分、从该基面部分延伸的各侧壁和一在各侧壁之间延伸的底面部分，在基面部分与底面部分之间沿底面部分的厚度方向有一距离，该方法包括以下步骤：
在热塑性树脂片材的一部分加热后将该部分热塑性树脂片材压进模具的模腔，从而以所述距离形成底面部分和各侧壁，其特征在于，模腔的底面具有一向远离基面部分的深度方向突出的凸状区域，其中所述基面部分在模具上形成在热塑性树脂片材料的另一部分上；
模腔在深度方向的深度大于所述距离；
模腔的底面具有邻接于凸状区域并围绕该凸状区域的环形平面区域。
2.按照权利要求1所述的方法，其特征在于所述凸状是一截圆锥形或截棱锥形。
3.按照权利要求1所述的方法，其特征在于所述底面部分的主区域基本上平行于基面部分延伸。
4.按照权利要求1所述的方法，其特征在于，在所述凸状的顶端与其底端之间沿远离所述基面部分的深度方向的深度差为0.1-1mm。
5.按照权利要求1所述的方法，其特征在于所述热塑性树脂容器适合于容纳一球栅极镇流电子元件。
6.按照权利要求1所述的方法，其特征在于，在所述距离变得等于所述模腔的深度后，所述距离被减小以使其变成小于模腔的深度。
7.按照权利要求1所述的方法，其特征在于，在所述底面部分与模腔的底面接触后，所述距离被减小。
8.按照权利要求1所述的方法，其特征在于，所述凸状区域在其顶端具有一平面区域。
9.一种由热塑性树脂片材制造容器的模具，该容器包括一基面部分、从该基面部分延伸的各侧壁和一在各侧壁之间延伸的底面部分，在基面部分与底面部分之间沿底面部分的厚度方向有一距离，该模具包括：
一模腔，其适合于在热塑性树脂片材加热后容纳该部分热塑性树脂片材，以便在模腔内以所述距离形成所述底面部分和各侧壁，以及
一平面基面区域，其邻接于模腔并围绕该模腔；
其特征在于，模腔的底面具有向远离平面基面区域的深度方向突出的凸状区域；
模腔在深度方向的深度大于所述距离；
模腔的底面具有一邻接于凸状区域并围绕该凸状区域的环形平面区域。
10.按照权利要求9所述的模具，其特征在于，所述凸状是截圆锥形或截棱锥形。
11.按照权利要求9所述的模具，其特征在于，底面部分的主区域基本上平行于基面部分延伸。
12.按照权利要求9所述的模具，其特征在于，在所述凸状的顶端与其底端之间沿远离平面基面区域的深度方向的深度差为0.1～1mm。
13.按照权利要求9所述的模具，其特征在于，所述热塑性树脂容器适合于容纳球栅极镇流电子元件。
14.按照权利要求9所述的模具，其特征在于，在所述距离变得等于所述模腔的深度后，所述模具使所述距离被减小而变得小于模腔的深度。
15.按照权利要求9所述的模具，其特征在于，在所述底面部分与模腔的底面接触后，所述模具使所述距离被减小。
16.按照权利要求9所述的模具，其特征在于，所述凸状区域在其顶端具有一平面区域。
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US20020074695A1 (en) 2002-06-20
KR100772273B1 (ko) 2007-11-01
KR20020045546A (ko) 2002-06-19
SG143929A1 (en) 2008-07-29
EP1213126A3 (en) 2004-02-18
US6835344B2 (en) 2004-12-28
EP1213126A2 (en) 2002-06-12
EP1213126B1 (en) 2009-03-11
TW537961B (en) 2003-06-21
DE60137901D1 (de) 2009-04-23

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