CN1276404C - 电激发光显示装置 - Google Patents
电激发光显示装置 Download PDFInfo
- Publication number
- CN1276404C CN1276404C CNB031221858A CN03122185A CN1276404C CN 1276404 C CN1276404 C CN 1276404C CN B031221858 A CNB031221858 A CN B031221858A CN 03122185 A CN03122185 A CN 03122185A CN 1276404 C CN1276404 C CN 1276404C
- Authority
- CN
- China
- Prior art keywords
- electrode layer
- capacitance electrode
- layer
- dielectric film
- electroluminescent display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010410 layer Substances 0.000 claims abstract description 115
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 12
- 239000011229 interlayer Substances 0.000 claims abstract description 8
- 238000012423 maintenance Methods 0.000 claims description 16
- 238000005401 electroluminescence Methods 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 49
- 239000000758 substrate Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000010276 construction Methods 0.000 description 5
- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- WBEDMFHOODHFKR-UHFFFAOYSA-N 1-n,1-n'-bis(3-methylphenyl)-1-n,1-n',4-triphenylcyclohexa-2,4-diene-1,1-diamine Chemical group CC1=CC=CC(N(C=2C=CC=CC=2)C2(C=CC(=CC2)C=2C=CC=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 WBEDMFHOODHFKR-UHFFFAOYSA-N 0.000 description 1
- -1 3-methylphenylphenylamino Chemical group 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 241001597008 Nomeidae Species 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- JHYLKGDXMUDNEO-UHFFFAOYSA-N [Mg].[In] Chemical compound [Mg].[In] JHYLKGDXMUDNEO-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000016768 molybdenum Nutrition 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002128008A JP4027149B2 (ja) | 2002-04-30 | 2002-04-30 | エレクトロルミネッセンス表示装置 |
| JP2002128008 | 2002-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1455381A CN1455381A (zh) | 2003-11-12 |
| CN1276404C true CN1276404C (zh) | 2006-09-20 |
Family
ID=29267666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031221858A Expired - Lifetime CN1276404C (zh) | 2002-04-30 | 2003-04-24 | 电激发光显示装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7330168B2 (enExample) |
| JP (1) | JP4027149B2 (enExample) |
| KR (1) | KR100527029B1 (enExample) |
| CN (1) | CN1276404C (enExample) |
| TW (1) | TWI248775B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108257983A (zh) * | 2012-06-15 | 2018-07-06 | 索尼公司 | 显示装置 |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7483001B2 (en) * | 2001-11-21 | 2009-01-27 | Seiko Epson Corporation | Active matrix substrate, electro-optical device, and electronic device |
| GB0313041D0 (en) * | 2003-06-06 | 2003-07-09 | Koninkl Philips Electronics Nv | Display device having current-driven pixels |
| JP2005173881A (ja) * | 2003-12-10 | 2005-06-30 | Sanyo Electric Co Ltd | El表示装置 |
| NL1025134C2 (nl) * | 2003-12-24 | 2005-08-26 | Lg Philips Lcd Co | Organische licht emitterende diode-inrichting van de soort met actieve matrix en daarvoor bestemde dunne-filmtransistor. |
| DE102004002587B4 (de) * | 2004-01-16 | 2006-06-01 | Novaled Gmbh | Bildelement für eine Aktiv-Matrix-Anzeige |
| JP4529467B2 (ja) * | 2004-02-13 | 2010-08-25 | ソニー株式会社 | 画素回路および表示装置 |
| US7619258B2 (en) * | 2004-03-16 | 2009-11-17 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP3933667B2 (ja) * | 2004-04-29 | 2007-06-20 | 三星エスディアイ株式会社 | 発光表示パネル及び発光表示装置 |
| TWI467541B (zh) | 2004-09-16 | 2015-01-01 | 半導體能源研究所股份有限公司 | 顯示裝置和其驅動方法 |
| US7586121B2 (en) * | 2004-12-07 | 2009-09-08 | Au Optronics Corp. | Electroluminescence device having stacked capacitors |
| KR100712111B1 (ko) | 2004-12-14 | 2007-04-27 | 삼성에스디아이 주식회사 | 보조 전극 라인을 구비하는 유기전계발광소자 및 그의제조 방법 |
| WO2006106365A2 (en) * | 2005-04-05 | 2006-10-12 | Plastic Logic Limited | Multiple conductive layer tft |
| GB0506899D0 (en) * | 2005-04-05 | 2005-05-11 | Plastic Logic Ltd | Multiple conductive layer TFT |
| US8633919B2 (en) * | 2005-04-14 | 2014-01-21 | Semiconductor Energy Laboratory Co., Ltd. | Display device, driving method of the display device, and electronic device |
| JP4350106B2 (ja) * | 2005-06-29 | 2009-10-21 | 三星モバイルディスプレイ株式會社 | 平板表示装置及びその駆動方法 |
| TWI429327B (zh) | 2005-06-30 | 2014-03-01 | Semiconductor Energy Lab | 半導體裝置、顯示裝置、及電子設備 |
| US8115206B2 (en) * | 2005-07-22 | 2012-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR101324756B1 (ko) | 2005-10-18 | 2013-11-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 및 그의 구동방법 |
| JP4661557B2 (ja) * | 2005-11-30 | 2011-03-30 | セイコーエプソン株式会社 | 発光装置および電子機器 |
| JP4993292B2 (ja) * | 2007-07-18 | 2012-08-08 | カシオ計算機株式会社 | 表示パネル及びその製造方法 |
| KR101839533B1 (ko) | 2010-12-28 | 2018-03-19 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치, 이의 구동 방법 및 그 제조 방법 |
| JP5803232B2 (ja) | 2011-04-18 | 2015-11-04 | セイコーエプソン株式会社 | 有機el装置、および電子機器 |
| JP5853614B2 (ja) | 2011-11-10 | 2016-02-09 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
| KR102110226B1 (ko) * | 2013-09-11 | 2020-05-14 | 삼성디스플레이 주식회사 | 표시패널 및 그 제조방법 |
| JP6459316B2 (ja) * | 2014-09-03 | 2019-01-30 | セイコーエプソン株式会社 | 有機エレクトロルミネッセンス装置および電子機器 |
| CN105097875A (zh) * | 2015-06-11 | 2015-11-25 | 京东方科技集团股份有限公司 | 有机电致发光显示器件、显示装置及其制作方法 |
| KR102566630B1 (ko) * | 2015-12-30 | 2023-08-16 | 엘지디스플레이 주식회사 | 유기발광표시장치 |
| JP7204429B2 (ja) * | 2018-11-06 | 2023-01-16 | キヤノン株式会社 | 表示装置および電子機器 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5874770A (en) * | 1996-10-10 | 1999-02-23 | General Electric Company | Flexible interconnect film including resistor and capacitor layers |
| JP3530362B2 (ja) * | 1996-12-19 | 2004-05-24 | 三洋電機株式会社 | 自発光型画像表示装置 |
| KR100226494B1 (ko) * | 1997-02-20 | 1999-10-15 | 김영환 | 액정표시장치 및 그 제조방법 |
| US6593592B1 (en) * | 1999-01-29 | 2003-07-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having thin film transistors |
| JP4334045B2 (ja) * | 1999-02-09 | 2009-09-16 | 三洋電機株式会社 | エレクトロルミネッセンス表示装置 |
| US6391801B1 (en) * | 1999-09-01 | 2002-05-21 | Micron Technology, Inc. | Method of forming a layer comprising tungsten oxide |
| JP2001282137A (ja) | 2000-03-30 | 2001-10-12 | Sanyo Electric Co Ltd | エレクトロルミネッセンス表示装置 |
| TWI283427B (en) * | 2001-07-12 | 2007-07-01 | Semiconductor Energy Lab | Display device using electron source elements and method of driving same |
| JP3909583B2 (ja) * | 2001-08-27 | 2007-04-25 | セイコーエプソン株式会社 | 電気光学装置の製造方法 |
| KR100453634B1 (ko) * | 2001-12-29 | 2004-10-20 | 엘지.필립스 엘시디 주식회사 | 능동행렬 유기전기발광소자 |
| US6853052B2 (en) * | 2002-03-26 | 2005-02-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having a buffer layer against stress |
-
2002
- 2002-04-30 JP JP2002128008A patent/JP4027149B2/ja not_active Expired - Lifetime
-
2003
- 2003-04-04 TW TW092107704A patent/TWI248775B/zh not_active IP Right Cessation
- 2003-04-24 CN CNB031221858A patent/CN1276404C/zh not_active Expired - Lifetime
- 2003-04-29 KR KR10-2003-0027036A patent/KR100527029B1/ko not_active Expired - Lifetime
- 2003-04-30 US US10/426,023 patent/US7330168B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108257983A (zh) * | 2012-06-15 | 2018-07-06 | 索尼公司 | 显示装置 |
| CN108257983B (zh) * | 2012-06-15 | 2022-08-09 | 索尼公司 | 显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US7330168B2 (en) | 2008-02-12 |
| TWI248775B (en) | 2006-02-01 |
| JP4027149B2 (ja) | 2007-12-26 |
| KR100527029B1 (ko) | 2005-11-09 |
| JP2003323133A (ja) | 2003-11-14 |
| CN1455381A (zh) | 2003-11-12 |
| KR20030085508A (ko) | 2003-11-05 |
| US20040012548A1 (en) | 2004-01-22 |
| TW200306754A (en) | 2003-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20060920 |