CN1257056C - 层压板和使用层压板的部件 - Google Patents
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Abstract
由彼此层压的基础材料和高分子板而没有粘合剂形成的层压板和使用层压板的部件,其中在对基础板和高分子板的相对表面施加活化处理之后,通过层压式粘附基础板到分子板上而形成层压板,和使用层压板形成部件。
Description
技术领域
本发明涉及通过不使用粘合剂而层压基础材料和高分子板形成的层压板和使用该层压板的部件。
背景技术
迄今为止,已经提出通过将如由高分子材料组成的板层压到基础材料如印刷电路板上而形成的层压板,和已经提出通过使用粘合剂的结合方法作为层压方法。
然而,在上述的现有层压方法中,由于粘合剂的耐热性差,它涉及的问题是层压板的耐热性有限或厚度和重量增加了粘合剂层那么多,因此不适于重量的降低和厚度的降低。
考虑到上述的技术背景,本发明的目的是提供通过没有由粘合剂层引起的电特性劣化和不使用粘合剂而层压基础材料和高分子板形成的层压板,以及使用层压板的部件,印刷电路板和I C封装。
发明公开
本发明所述的层压板是一种通过在基础材料至少一个表面上层压高分子板而形成的层压板,所述高分子板优选是液晶聚合物或聚酰亚胺,其中层压板的形式是通过预先活化要彼此粘合的基础材料和高分子板的各自表面和然后邻接和重叠基础材料和高分子板,使得基础材料和高分子板的活化表面彼此相对,因此将它们压挤结合。在此情况下,活化处理优选包括在惰性气体气氛中进行放电和向基础材料和高分子板的各自表面施加溅射蚀刻。
此外,优选基础材料是一种如下物质:液晶聚合物、聚酰亚胺和玻璃环氧物。
本发明还提供了使用上述层压板的部件,该部件优选是印刷电路板或IC封装的部件。
附图简述
图1是显示根据本发明层压板的实施方案的简要横截面图。
图2是显示根据本发明层压板的另一个实施方案的简要横截面图。
实施本发明的最好方式
以下描述本发明的实施方案。
图1是显示根据本发明层压板的实施方案的简要横截面图,它显示在基础材料28的一个表面上层压高分子板26的例子。图2是显示根据本发明层压板的另一个实施方案的简要横截面图,它显示在基础材料28的两个表面上层压高分子板24,26的例子。
作为用于高分子板26的材料,使用液晶聚合物或聚酰亚胺。对于聚酰亚胺,可以使用通常的材料和热塑性类型材料两者。此外,也合适地依赖于层压的用途,选择高分子板26的厚度。例如,它是1-1000μm。在其中它小于1μm的情况下,高分子板的制备困难。当它超过1000μm时,高分子板的制备困难。在其中层压板的用途是柔性印刷衬底的情况下,应用范围之内的那些,例如3-300μm。在其中它小于3μm的情况下,机械强度较差和在其中它超过300μm的情况下,柔韧性差。它优选为10-150μm和,更优选20-75μm。
作为用于高分子板24的材料,可以选择可应用于高分子材料26的任何材料,和高分子板24的材料和厚度可以与高分子板26的那些相同或不同。
基础材料的种类没有特别的限制,只要它是能够制备层压板的材料,包括金属、无机材料或有机材料,和可以合适地依赖于层压板的用途选择和使用。例如,这是高分子板、刚性印刷电路板或柔性印刷电路板。在其中衬底材料是高分子板的情况下,可以选择可适用于高分子板26的那些,和基础材料的材料和厚度可以与要层压的高分子板24的那些相同或不同。在其中基础材料是印刷电路板的情况下,可以使用不含有用于表面层的保护膜的那些,其中线路部分被曝露。此外,对于印刷电路板,可以使用纸环氧衬底、玻璃环氧衬底、陶瓷衬底等。
描述图1所示的层压板的制造方法。将每个切割成预定尺寸的高分子板26和基础材料28布置在制造设备中和分别通过活化处理设备对它们施加活化处理。
活化处理如下所述进行。即,将装入制造设备中的高分子板26和基础材料28分别与接地的一个电极A接触和通过在相对于另一个电极B的1-50MHz下施加AC电流而进行溅射蚀刻处理,电极B以绝缘方式在惰性气体气氛,优选氩气中在约大气压下支撑,以进行辉光放电或电晕放电,其中与曝露于由放电引起的等离子体的电极A接触的高分子板26和基础材料28每个的面积是电极B面积的1/3或更小。可以在超过9×104-至多约大气压的压力下施加惰性气体。对于施加的AC电流,在它小于1MHz的情况下,难以保持稳定的放电和连续蚀刻较困难,而在它超过50MHz的情况下,振荡倾向于发生和电源系统复杂化,这不是优选的。此外,为了在良好效率下的蚀刻,必须使电极A的面积小于电极B的面积和通过限定它为1/3或更小,蚀刻在足够的效率下是可能的。
然后,将施加了活化处理的高分子板26和基础材料28邻接和彼此重叠,使得活化表面彼此相对和由压挤结合单元热压挤结合和层压和结合。假定加热温度为T(℃)和熔融温度为Tm(℃),优选是T<Tm。特别是对于具有玻璃转变点的材料,例如液晶聚合物等,优选是Tg<T<Tm,假定玻璃化转变温度为Tg(℃)。更优选为Tg+20<T<Tm-20。通过上述的层压结合,形成层压板20和制造图1所示的层压板20。
然后,以相同的方式通过使用层压板20代替上述描述中的基础材料28,制造图2所示的层压板22。
如需要,这样制造的层压板可以施加热处理用于除去或降低残余应力。在热处理中,由于可引起结合强度降低的有害气体(例如氧气)可能渗透高分子板,优选在真空中或在减压状态下,或在降低气氛下进行。
对于层压板的制造,可以采用间歇处理。进行活化处理,同时装载预先在制造设备中每个切割成预定尺寸的多个高分子板和基础材料,将它们输送到活化处理设备和布置或抓牢它们在如下状态:其中将要处理的表面彼此相对或平行设置到适当的位置,如垂直或水平状态,在其中用于保持高分子板和基础材料的设备也用作压挤结合设备的情况下,施加压挤结合同时当它们在活化处理之后布置或抓牢它们,或在用于保持高分子板或基础材料的设备并不用作压挤结合设备的情况下,输送它们到压挤结合设备如压挤设备和进行压挤结合。
在其中印刷电路板用作本发明层压板的基础材料的情况下,可以将电路图案形成到高分子板上,施加通孔或中间层传导构造以将电路构成为多层结构,和进一步可以通过使用多层层压板作为基础材料获得多层印刷电路板。此外,先前采用电路图案形成或采用如由金属组成的导电板层压的高分子板可以层压到基础材料上。因此,它适于印刷电路板(刚性印刷电路板或柔性印刷电路板)和也可应用于用于IC卡、CSP(芯片尺寸封装或芯片规模封装)、BGA(网格焊球阵列)等的IC封装。
实施例
以下描述实施例。
(实施例1)
50μm厚度的液晶聚合物膜用作高分子板26,和50μm厚度的液晶聚合物膜用作衬底材料28。在层压板制造设备中放置两个液晶聚合物膜和将液晶聚合物膜在活化处理单元(氩气气氛,10-3~4×10-3Pa)中,由溅射蚀刻方法分别进行活化处理。然后,在压挤结合设备中,将活化的液晶聚合物膜以活化表面要彼此邻接的方式彼此堆叠,以制造层压板20。
(实施例2)
50μm厚度的液晶聚合物膜用作高分子板26,和50μm厚度的聚酰亚胺膜用作衬底材料28。在层压板制造设备中放置液晶聚合物膜和聚酰亚胺膜和将液晶聚合物膜和聚酰亚胺膜在活化处理单元(氩气气氛,10-2~4×10-2Pa)中,由溅射蚀刻方法分别进行活化处理。然后,在压挤结合设备中,将活化的液晶聚合物膜和聚酰亚胺膜以活化表面彼此邻接的方式彼此堆叠,以制造层压板20。
(实施例3)
在其上层压有18μm厚度的铜箔以形成电路的50μm厚度的液晶聚合物膜用于基础材料28,和使用通过在50μm厚度的液晶聚合物膜上层压18μm厚度的铜箔而形成的层压材料代替高分子板26。在层压板制造设备中放置基础材料和层压材料,和将在侧面上形成有电路的基础材料和在液晶聚合物膜侧面上的层压材料在活化处理单元(氩气气氛,10-1~10Pa)中,由溅射蚀刻方法分别进行活化处理。然后,将进行活化处理的在侧面上形成有电路的基础材料和在液晶聚合物膜侧面上的层压材料,由压挤结合设备在彼此倚靠邻接活化表面的状态下堆叠和压挤,以制造层压板20。然后,进行通孔构造,由镀敷的传导构造和用于表面层的电路形成,以制造电路衬底。
工业实用性
如上所述,通过在彼此相对的基础材料和高分子板表面上施加活化处理,和然后邻接和堆叠它们使得活化表面彼此相对和将它们压挤结合,而形成根据本发明的层压板。因此,不使用粘合剂,可以达到重量的更多降低和厚度的更多降低并且它适于电路衬底的用途等。
Claims (4)
1.一种通过在基础材料至少一个表面上层压高分子板而形成的层压板,所述高分子板包括液晶聚合物或聚酰亚胺,其中预先对要结合的基础材料和高分子板的表面施加活化处理,其中活化处理包括在惰性气体气氛中进行放电和向基础材料和高分子板的每个表面施加溅射蚀刻处理,和然后将基础材料和高分子板彼此倚靠地邻接和堆叠,使得其活化表面彼此相对和通过应用加热辊在高分子板的熔融温度到玻璃化转变点的范围内在惰性气体气氛下将它们压挤结合。
2.根据权利要求1的层压板,其中基础材料包括一种如下物质:液晶聚合物、聚酰亚胺和玻璃环氧物。
3.一种使用权利要求1所述的层压板的印刷电路板。
4.一种使用权利要求1所述的层压板的IC封装。
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JP5234647B2 (ja) * | 2009-03-31 | 2013-07-10 | 新日鉄住金化学株式会社 | 複合接着フィルムおよびそれを用いた多層回路基板並びにその製造方法 |
JP2013087264A (ja) * | 2011-10-21 | 2013-05-13 | Sumitomo Chemical Co Ltd | 積層板の製造方法、積層板および回路基板 |
JP6340180B2 (ja) * | 2013-10-08 | 2018-06-06 | 東レ・デュポン株式会社 | ポリイミド樹脂−液晶ポリマー複合フィルム及びその製造方法 |
TWI719955B (zh) * | 2014-12-18 | 2021-03-01 | 日商住友化學股份有限公司 | 三層薄膜、三層薄膜之製造方法、層合板及印刷電路基板 |
CN113613411B (zh) * | 2021-09-23 | 2023-04-07 | 浙江清华柔性电子技术研究院 | 柔性电路基板及其制备方法和应用 |
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CA1041892A (en) * | 1974-04-30 | 1978-11-07 | David H. Dawes | Heat lamination of thermoplastic films |
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JPS61141532A (ja) * | 1984-12-14 | 1986-06-28 | Shin Etsu Chem Co Ltd | 積層フイルムの製造方法 |
JPH02134239A (ja) * | 1988-11-15 | 1990-05-23 | Shin Etsu Chem Co Ltd | フレキシブル印刷回路用基板の製造方法 |
US5246782A (en) * | 1990-12-10 | 1993-09-21 | The Dow Chemical Company | Laminates of polymers having perfluorocyclobutane rings and polymers containing perfluorocyclobutane rings |
EP0467096A1 (en) * | 1990-06-28 | 1992-01-22 | E.I. Du Pont De Nemours And Company | Process for preparing laminate of a polyimide and a fluorocarbon polymer |
US5259110A (en) * | 1992-04-03 | 1993-11-09 | International Business Machines Corporation | Method for forming a multilayer microelectronic wiring module |
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WO2002085621A1 (fr) | 2002-10-31 |
EP1393896A1 (en) | 2004-03-03 |
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